Chia Shen Cheng

Person

Taichung City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Context-based adaptive binary arithmetic coding decoder capable of...
- Patent number 12,143,612
- Issue date Nov 12, 2024
- Mediatek Inc.
- Sheng-Jen Wang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and system for initiating a location-based topic
- Patent number 12,118,022
- Issue date Oct 15, 2024
- FRAMY INC.
- Yu-Hsien Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Manufacturing method of resistive random access memory device
- Patent number 12,063,796
- Issue date Aug 13, 2024
- Winbond Electronics Corp.
- Chia-Wen Cheng
Information Patent Grant
Electronic device
- Patent number 12,063,320
- Issue date Aug 13, 2024
- ASUSTeK COMPUTER Inc.
- Cheng-Han Chung
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Bonding through multi-shot laser reflow
- Patent number 12,040,309
- Issue date Jul 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip package with second opening surrounding fir...
- Patent number 11,973,095
- Issue date Apr 30, 2024
- Xintec Inc.
- Kuei-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for contorlling coefficient transmission by ea...
- Patent number 11,949,920
- Issue date Apr 2, 2024
- Mediatek Inc.
- Ming-Hsien Lai
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor package and method
- Patent number 11,942,464
- Issue date Mar 26, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vanity mirror and sun visor with lighting function
- Patent number 11,932,087
- Issue date Mar 19, 2024
- ZEALIO ELECTRONICS CO., LTD.
- Chia-Pao Cheng
- B60 - VEHICLES IN GENERAL
Information Patent Grant
Electronic device and functional module thereof
- Patent number 11,901,791
- Issue date Feb 13, 2024
- ASUSTeK COMPUTER Inc.
- Chia-Min Cheng
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
- Patent number 11,901,258
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,862,577
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM structure and method of fabricating the same
- Patent number 11,856,870
- Issue date Dec 26, 2023
- United Microelectronics Corp.
- Kuo-Chih Lai
Information Patent Grant
Method and system for recommending location-based digital content
- Patent number 11,847,180
- Issue date Dec 19, 2023
- FRAMY INC.
- Yu-Hsien Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,830,781
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and function module thereof
- Patent number 11,825,006
- Issue date Nov 21, 2023
- ASUSTeK COMPUTER Inc.
- Chia-Min Cheng
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Workpiece holder, wafer chuck, wafer holding method
- Patent number 11,791,192
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wide channel semiconductor device
- Patent number 11,784,198
- Issue date Oct 10, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Yu Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 11,784,134
- Issue date Oct 10, 2023
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with nanostructures
- Patent number 11,777,040
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsin-Hsiang Tseng
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Chip package including substrate having through hole and redistribu...
- Patent number 11,749,618
- Issue date Sep 5, 2023
- Xintec Inc.
- Chia-Ming Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out package with reinforcing rivets
- Patent number 11,742,301
- Issue date Aug 29, 2023
- Advanced Micro Devices, Inc.
- Rahul Agarwal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package with integrated voltage regulator
- Patent number 11,715,691
- Issue date Aug 1, 2023
- Advanced Micro Devices, Inc.
- Milind S. Bhagavat
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistive random access memories and method for fabricating the same
- Patent number 11,653,583
- Issue date May 16, 2023
- Winbond Electronics Corp.
- Chang-Tsung Pai
Information Patent Grant
Semiconductor structure and method
- Patent number 11,646,293
- Issue date May 9, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Shen Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and motor assembly thereof
- Patent number 11,641,145
- Issue date May 2, 2023
- ASUSTeK COMPUTER Inc.
- Chui-Hung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Reflow method and system
- Patent number 11,610,859
- Issue date Mar 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Buoy position monitoring method and buoy position monitoring system
- Patent number 11,608,170
- Issue date Mar 21, 2023
- National Yunlin University of Science and Technology
- Ching-Ju Chen
- G08 - SIGNALLING
Information Patent Grant
Functional assembly and electronic device with the functional assembly
- Patent number 11,592,866
- Issue date Feb 28, 2023
- ASUSTeK COMPUTER Inc.
- Cheng-Han Chung
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
COCKPIT DISPLAY SYSTEM
- Publication number 20240386854
- Publication date Nov 21, 2024
- AUO Corporation
- Yu-Chi CHEN
- B60 - VEHICLES IN GENERAL
Information Patent Application
COCKPIT DISPLAY SYSTEM
- Publication number 20240383333
- Publication date Nov 21, 2024
- AUO Corporation
- Yu-Chi Chen
- B60 - VEHICLES IN GENERAL
Information Patent Application
MULTI-SCREEN COCKPIT DISPLAY SYSTEM
- Publication number 20240385746
- Publication date Nov 21, 2024
- AUO Corporation
- Yu-Chi CHEN
- B60 - VEHICLES IN GENERAL
Information Patent Application
ADAPTIVE CAMERA SCHEME FOR LOW POWER SLAM IN XR
- Publication number 20240314428
- Publication date Sep 19, 2024
- MEDIATEK, INC.
- Yang-Tzu LIU TSEN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD FOR OPTIMIZING DATA TO BE USED TO TRAIN OBJECT RECOGNITION M...
- Publication number 20240282083
- Publication date Aug 22, 2024
- Linker Vision Co., Ltd.
- Paul Yuan-Bao SHIEH
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ADAPTIVE FRAME RATE FOR LOW POWER SLAM IN XR
- Publication number 20240273745
- Publication date Aug 15, 2024
- MEDIATEK INC.
- Chun Chen LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMI...
- Publication number 20240243001
- Publication date Jul 18, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yun CHENG
- B25 - HAND TOOLS PORTABLE POWER-DRIVEN TOOLS MANIPULATORS
Information Patent Application
BONDING THROUGH MULTI-SHOT LASER REFLOW
- Publication number 20240234365
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR STABILIZING LINE-OF-SIGHT FALLING POINT
- Publication number 20240203115
- Publication date Jun 20, 2024
- GENERAL INTERFACE SOLUTION LIMITED
- YU-HENG CHOU
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR PACKAGES
- Publication number 20240203971
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturning Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROSTHESIS SOCKET VACUUM SUCTION STRUCTURE
- Publication number 20240189120
- Publication date Jun 13, 2024
- KEN DALL ENTERPRISE CO., LTD.
- Chia-Pao Cheng
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
Integrated Fan-Out Packages with Embedded Heat Dissipation Structure
- Publication number 20240153842
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105642
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILE SHARING SYSTEM AND METHOD
- Publication number 20240097888
- Publication date Mar 21, 2024
- InfoKeyVault Technology Co., Ltd.
- CHIA-JUNG LIANG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088062
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THICK REDISTRIBUTION LAYER FEATURES
- Publication number 20240088074
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Feng Cheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO PROCESSING METHOD FOR PERFORMING PARTIAL HIGHLIGHTING WITH AI...
- Publication number 20240040070
- Publication date Feb 1, 2024
- Realtek Semiconductor Corp.
- Chia-Chun Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
ANTENNA SYSTEM AND ANTENNA ARRAY
- Publication number 20240039170
- Publication date Feb 1, 2024
- WISTRON NEWEB CORP.
- Chia-Shang CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO PROCESSING METHOD ARRANGED TO PERFORM PARTIAL HIGHLIGHTING WI...
- Publication number 20240037993
- Publication date Feb 1, 2024
- Realtek Semiconductor Corp.
- Chia-Chun Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230420387
- Publication date Dec 28, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FILLING TRENCH IN SEMICONDUCTOR DEVICE
- Publication number 20230402312
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kenichi SANO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIDE CHANNEL SEMICONDUCTOR DEVICE
- Publication number 20230378205
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Yu WEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH NANOSTRUCTURES
- Publication number 20230369517
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsin-Hsiang Tseng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...
- Publication number 20230369094
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369528
- Publication date Nov 16, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230369362
- Publication date Nov 16, 2023
- XINTEC INC.
- Po-Han LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIPLE-BAND TRIGGER TOOL FOR TIRE-PRESSURE MONITORING SYSTEM
- Publication number 20230305836
- Publication date Sep 28, 2023
- Chia-Wen Cheng
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM AND METHOD FOR MANAGING DATA-FILE TRANSMISSION AND ACCESS RI...
- Publication number 20230297708
- Publication date Sep 21, 2023
- InfoKeyVault Technology Co., Ltd.
- CHIHHUNG LIN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20230238408
- Publication date Jul 27, 2023
- XINTEC INC.
- Chia-Ming CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIDEO PROCESSING METHOD AND ASSOCIATED SYSTEM ON CHIP
- Publication number 20230237621
- Publication date Jul 27, 2023
- Realtek Semiconductor Corp.
- Ching-Lung Chen
- G06 - COMPUTING CALCULATING COUNTING

Chia Shen Cheng

Person

Patents Grantslast 30 patents

Context-based adaptive binary arithmetic coding decoder capable of...

Method and system for initiating a location-based topic

Manufacturing method of resistive random access memory device

Electronic device

Bonding through multi-shot laser reflow

Method for forming chip package with second opening surrounding fir...

Method and apparatus for contorlling coefficient transmission by ea...

Semiconductor package and method

Vanity mirror and sun visor with lighting function

Electronic device and functional module thereof

Iintegrated fan-out packages with embedded heat dissipation structure

Package structure

Package structure and method of fabricating the same

MRAM structure and method of fabricating the same

Method and system for recommending location-based digital content

Package structure and manufacturing method thereof

Electronic device and function module thereof

Workpiece holder, wafer chuck, wafer holding method

Wide channel semiconductor device

Chip package and manufacturing method thereof

Semiconductor device with nanostructures

Chip package including substrate having through hole and redistribu...

Fan-out package with reinforcing rivets

Integrated circuit package with integrated voltage regulator

Resistive random access memories and method for fabricating the same

Semiconductor structure and method

Electronic device and motor assembly thereof

Reflow method and system

Buoy position monitoring method and buoy position monitoring system

Functional assembly and electronic device with the functional assembly

Patents Applicationslast 30 patents

COCKPIT DISPLAY SYSTEM

COCKPIT DISPLAY SYSTEM

MULTI-SCREEN COCKPIT DISPLAY SYSTEM

ADAPTIVE CAMERA SCHEME FOR LOW POWER SLAM IN XR

METHOD FOR OPTIMIZING DATA TO BE USED TO TRAIN OBJECT RECOGNITION M...

ADAPTIVE FRAME RATE FOR LOW POWER SLAM IN XR

ROBOT, APPARATUS INCLUDING ROBOT, AND METHOD FOR MANUFACTURING SEMI...

BONDING THROUGH MULTI-SHOT LASER REFLOW

METHOD FOR STABILIZING LINE-OF-SIGHT FALLING POINT

METHODS OF FORMING SEMICONDUCTOR PACKAGES

PROSTHESIS SOCKET VACUUM SUCTION STRUCTURE

Integrated Fan-Out Packages with Embedded Heat Dissipation Structure

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

FILE SHARING SYSTEM AND METHOD

PACKAGE STRUCTURE

THICK REDISTRIBUTION LAYER FEATURES

VIDEO PROCESSING METHOD FOR PERFORMING PARTIAL HIGHLIGHTING WITH AI...

ANTENNA SYSTEM AND ANTENNA ARRAY

VIDEO PROCESSING METHOD ARRANGED TO PERFORM PARTIAL HIGHLIGHTING WI...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR FILLING TRENCH IN SEMICONDUCTOR DEVICE

WIDE CHANNEL SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH NANOSTRUCTURES

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

TRIPLE-BAND TRIGGER TOOL FOR TIRE-PRESSURE MONITORING SYSTEM

SYSTEM AND METHOD FOR MANAGING DATA-FILE TRANSMISSION AND ACCESS RI...

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

VIDEO PROCESSING METHOD AND ASSOCIATED SYSTEM ON CHIP