Chia-Wei Chiang

Person

Hsinchu County, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and chip structure
- Patent number 10,607,860
- Issue date Mar 31, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with a conductive casing for heat dissipation...
- Patent number 10,593,629
- Issue date Mar 17, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 10,431,549
- Issue date Oct 1, 2019
- Powertech Technology Inc.
- Chien-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package structure having conductive shield
- Patent number 10,276,510
- Issue date Apr 30, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200357770
- Publication date Nov 12, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20200243449
- Publication date Jul 30, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200243461
- Publication date Jul 30, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200013721
- Publication date Jan 9, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200006274
- Publication date Jan 2, 2020
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190214347
- Publication date Jul 11, 2019
- Powertech Technology Inc.
- Chien-Wen Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE STRUCTURE
- Publication number 20190096821
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND CHIP STRUCTURE
- Publication number 20190096699
- Publication date Mar 28, 2019
- Powertech Technology Inc.
- Chia-Wei Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Chia-Wei Chiang

Person

Patents Grantslast 30 patents

Package structure and chip structure

Semiconductor package with a conductive casing for heat dissipation...

Semiconductor package and manufacturing method thereof

Manufacturing method of package structure having conductive shield

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

MANUFACTURING METHOD OF PACKAGE STRUCTURE

PACKAGE STRUCTURE AND CHIP STRUCTURE