Chien-Cheng Li

Person

Hualien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic device and method for determining intensity of low-frequ...
- Patent number 12,263,345
- Issue date Apr 1, 2025
- Acer Incorporated
- Yi-Jin Huang
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 12,183,709
- Issue date Dec 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image processing apparatus for evaluating cardiac images and ventri...
- Patent number 12,148,161
- Issue date Nov 19, 2024
- Acer Incorporated
- Hung-Sheng Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Package structure with protective lid
- Patent number 12,119,276
- Issue date Oct 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Eye state assessment method and electronic device
- Patent number 12,106,472
- Issue date Oct 1, 2024
- Acer Incorporated
- Yi-Jin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Capacitive isolation structure insert for reversed signals
- Patent number 12,073,162
- Issue date Aug 27, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheok-Kei Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming probe head structure
- Patent number 12,019,097
- Issue date Jun 25, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- G01 - MEASURING TESTING
Information Patent Grant
Package structure with a barrier layer
- Patent number 11,984,419
- Issue date May 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stud bump for wirebonding high voltage isolation barrier connection
- Patent number 11,973,052
- Issue date Apr 30, 2024
- Texas Instruments Incorporated
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PDCCH DMRS mapping and coreset resource allocation
- Patent number 11,902,063
- Issue date Feb 13, 2024
- Mediatek Inc.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Physical downlink control channel design for NR systems
- Patent number 11,895,510
- Issue date Feb 6, 2024
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Method and system for establishing light source information predict...
- Patent number 11,869,224
- Issue date Jan 9, 2024
- Acer Incorporated
- Yi-Jin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device and method
- Patent number 11,862,588
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for estimating ventricular volume
- Patent number 11,844,655
- Issue date Dec 19, 2023
- Acer Incorporated
- Yi-Jin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 11,848,302
- Issue date Dec 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guiding system and guiding method for ultrasound scanning operation
- Patent number 11,806,192
- Issue date Nov 7, 2023
- Industrial Technology Research Institute
- Chien-Ju Li
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
Bicycle bell
- Patent number 11,772,732
- Issue date Oct 3, 2023
- Jet Rider Co., Ltd.
- Je-Kuan Jau
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
Information Patent Grant
Efficient wide bandwidth operation and efficient UE-specific RF ban...
- Patent number 11,770,811
- Issue date Sep 26, 2023
- Pei-Kai Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Structure and formation method of chip package with protective lid
- Patent number 11,764,118
- Issue date Sep 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for evaluating movement state of heart
- Patent number 11,744,542
- Issue date Sep 5, 2023
- Acer Incorporated
- Hung-Sheng Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Power failure detection device and method
- Patent number 11,704,991
- Issue date Jul 18, 2023
- Realtek Semiconductor Corporation
- Chia-Lung Wang
- G01 - MEASURING TESTING
Information Patent Grant
Wake-up signal and preamble design for mobile communications
- Patent number 11,653,301
- Issue date May 16, 2023
- Mediatek Inc.
- Chun-Hsuan Kuo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Physical downlink control channel design for NR systems
- Patent number 11,622,284
- Issue date Apr 4, 2023
- Mediatek Inc.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image processing apparatus for evaluating cardiac images and ventri...
- Patent number 11,610,312
- Issue date Mar 21, 2023
- Acer Incorporated
- Hung-Sheng Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
On PDCCH DMRS mapping and coreset resource allocation
- Patent number 11,611,461
- Issue date Mar 21, 2023
- Mediatek Inc.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Chip package structure with ring-like structure
- Patent number 11,545,463
- Issue date Jan 3, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Sheng-Yao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive isolation structure insert for reversed signals
- Patent number 11,526,649
- Issue date Dec 13, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheok-Kei Lei
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Asynchronous circuits and test methods
- Patent number 11,500,018
- Issue date Nov 15, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ting-Yu Shen
- G01 - MEASURING TESTING
Information Patent Grant
Method and system for establishing light source information predict...
- Patent number 11,494,585
- Issue date Nov 8, 2022
- Acer Incorporated
- Yi-Jin Huang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method for forming package structure with a barrier layer
- Patent number 11,469,203
- Issue date Oct 11, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...
- Publication number 20250118690
- Publication date Apr 10, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...
- Publication number 20240421115
- Publication date Dec 19, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SEGMENTATION MODEL TRAINING METHOD AND ELECTRONIC DEVICE
- Publication number 20240378728
- Publication date Nov 14, 2024
- ACER INCORPORATED
- Shang-Lin Chung
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20240379475
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE ISOLATION STRUCTURE INSERT FOR REVERSED SIGNALS
- Publication number 20240362387
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheok-Kei LEI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHES...
- Publication number 20240332212
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPOSITE FUNCTION KEYBOARD CIRCUIT
- Publication number 20240310926
- Publication date Sep 19, 2024
- Primax Electronics Ltd.
- Yi-Liang Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROBE HEAD STRUCTURE
- Publication number 20240302410
- Publication date Sep 12, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING
Information Patent Application
PACKAGE STRUCTURE WITH A BARRIER LAYER
- Publication number 20240297138
- Publication date Sep 5, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Hung CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...
- Publication number 20240290683
- Publication date Aug 29, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION
- Publication number 20240274570
- Publication date Aug 15, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Chien-Chang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL IMPEDANCE IMAGING SENSING ELEMENT, SENSING SYSTEM AND SE...
- Publication number 20240219332
- Publication date Jul 4, 2024
- Industrial Technology Research Institute
- Chang-Lin HU
- G01 - MEASURING TESTING
Information Patent Application
BEAMFORMING ANTENNA DEVICE AND METHOD FOR OPERATING A BEAMFORMING A...
- Publication number 20240178558
- Publication date May 30, 2024
- TRON FUTURE TECH INC.
- KUN-CHIEN HUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20240120313
- Publication date Apr 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD
- Publication number 20240096827
- Publication date Mar 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chen-Shien Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE PACKAGE AND METHODS OF FORMATION
- Publication number 20240071854
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Packages and Methods of Forming the Same
- Publication number 20240071950
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co, LTD.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230411307
- Publication date Dec 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING
- Publication number 20230402417
- Publication date Dec 14, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chien LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230402398
- Publication date Dec 14, 2023
- Siliconware Precision Industries Co., Ltd.
- Che-Chi Wu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method Forming Same
- Publication number 20230395461
- Publication date Dec 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wen-Yi Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy through vias for Integrated Circuit Packages and Methods of F...
- Publication number 20230377905
- Publication date Nov 23, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH PROTECTIVE LID
- Publication number 20230369149
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS
- Publication number 20230290747
- Publication date Sep 14, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chien-Hung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DESIGN OF CORESET CONFIGURATIONS
- Publication number 20230247641
- Publication date Aug 3, 2023
- MEDIATEK INC.
- Yiju Liao
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PHYSICAL DOWNLINK CONTROL CHANNEL DESIGN FOR NR SYSTEMS
- Publication number 20230209366
- Publication date Jun 29, 2023
- MEDIATEK INC.
- Chien-Hwa Hwang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
IMAGE PROCESSING APPARATUS FOR EVALUATING CARDIAC IMAGES AND VENTRI...
- Publication number 20230206446
- Publication date Jun 29, 2023
- ACER INCORPORATED
- Hung-Sheng Hsu
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE
- Publication number 20230113265
- Publication date Apr 13, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Sheng-Yao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE ISOLATION STRUCTURE INSERT FOR REVERSED SIGNALS
- Publication number 20230090213
- Publication date Mar 23, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheok-Kei LEI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PROBE HEAD STRUCTURE AND METHOD FOR FORMING THE SAME
- Publication number 20230065443
- Publication date Mar 2, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Yi LIN
- G01 - MEASURING TESTING

Chien-Cheng Li

Person

Patents Grantslast 30 patents

Electronic device and method for determining intensity of low-frequ...

Chip package structure with ring-like structure

Image processing apparatus for evaluating cardiac images and ventri...

Package structure with protective lid

Eye state assessment method and electronic device

Capacitive isolation structure insert for reversed signals

Method for forming probe head structure

Package structure with a barrier layer

Stud bump for wirebonding high voltage isolation barrier connection

PDCCH DMRS mapping and coreset resource allocation

Physical downlink control channel design for NR systems

Method and system for establishing light source information predict...

Semiconductor device and method

Method for estimating ventricular volume

Chip package structure with ring-like structure

Guiding system and guiding method for ultrasound scanning operation

Bicycle bell

Efficient wide bandwidth operation and efficient UE-specific RF ban...

Structure and formation method of chip package with protective lid

Method for evaluating movement state of heart

Power failure detection device and method

Wake-up signal and preamble design for mobile communications

Physical downlink control channel design for NR systems

Image processing apparatus for evaluating cardiac images and ventri...

On PDCCH DMRS mapping and coreset resource allocation

Chip package structure with ring-like structure

Capacitive isolation structure insert for reversed signals

Asynchronous circuits and test methods

Method and system for establishing light source information predict...

Method for forming package structure with a barrier layer

Patents Applicationslast 30 patents

DIELECTRIC STRUCTURE FOR HIGH SPEED INTERCONNECT AND RELIABILITY EN...

HYBRID UNDERFILL STRUCTURES FOR MULTI-DIE PACKAGES AND METHODS OF F...

IMAGE SEGMENTATION MODEL TRAINING METHOD AND ELECTRONIC DEVICE

PACKAGE STRUCTURE WITH PROTECTIVE LID

CAPACITIVE ISOLATION STRUCTURE INSERT FOR REVERSED SIGNALS

PACKAGE STRUCTURE INCLUDING RING STRUCTURE ATTACHED BY HYBRID ADHES...

COMPOSITE FUNCTION KEYBOARD CIRCUIT

PROBE HEAD STRUCTURE

PACKAGE STRUCTURE WITH A BARRIER LAYER

PACKAGE LID INCLUDING A MULTI-LAYER STRUCTURE FOR HEAT DISSIPATION...

STUD BUMP FOR WIREBONDING HIGH VOLTAGE ISOLATION BARRIER CONNECTION

ELECTRICAL IMPEDANCE IMAGING SENSING ELEMENT, SENSING SYSTEM AND SE...

BEAMFORMING ANTENNA DEVICE AND METHOD FOR OPERATING A BEAMFORMING A...

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD

MULTI-DIE PACKAGE AND METHODS OF FORMATION

Integrated Circuit Packages and Methods of Forming the Same

Semiconductor Device and Method Forming Same

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING

ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device and Method Forming Same

Dummy through vias for Integrated Circuit Packages and Methods of F...

PACKAGE STRUCTURE WITH PROTECTIVE LID

HEAT DISSIPATING FEATURES FOR LASER DRILLING PROCESS

DESIGN OF CORESET CONFIGURATIONS

PHYSICAL DOWNLINK CONTROL CHANNEL DESIGN FOR NR SYSTEMS

IMAGE PROCESSING APPARATUS FOR EVALUATING CARDIAC IMAGES AND VENTRI...

CHIP PACKAGE STRUCTURE WITH RING-LIKE STRUCTURE

CAPACITIVE ISOLATION STRUCTURE INSERT FOR REVERSED SIGNALS

PROBE HEAD STRUCTURE AND METHOD FOR FORMING THE SAME