Chih-Chao Yang

Person

Glenmont, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Additive interconnect formation
- Patent number 12,183,630
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement bottom electrode structure for MRAM devices
- Patent number 12,167,700
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Stepped contact within memory region
- Patent number 12,144,263
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,133,473
- Issue date Oct 29, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,120,963
- Issue date Oct 15, 2024
- International Business Machines Corporation
- Lili Cheng
Information Patent Grant
Multi-diameter magnetic random-access memory pillar structure
- Patent number 12,108,685
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Resistance tunable fuse structure formed by embedded thin metal layers
- Patent number 12,100,653
- Issue date Sep 24, 2024
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beol tip-to-tip shorting and time dependent dielectric breakdown
- Patent number 12,087,624
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuse structure embedded in top via
- Patent number 12,062,609
- Issue date Aug 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM cell embedded in a metal layer
- Patent number 12,058,942
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
BEOL etch stop layer without capacitance penalty
- Patent number 12,027,416
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal-insulator-metal (MIM) capacitors extending through b...
- Patent number 12,002,758
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Coaxial top MRAM electrode
- Patent number 12,002,498
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
BEOL alternative metal interconnects: integration and process
- Patent number 11,990,414
- Issue date May 21, 2024
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric fill for tight pitch MRAM pillar array
- Patent number 11,955,152
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density memory devices using oxide gap fill
- Patent number 11,937,514
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Theodorus E. Standaert
Information Patent Grant
High density two-tier MRAM structure
- Patent number 11,937,435
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Interconnect including integrally formed capacitor
- Patent number 11,908,738
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor structure supporting different volt...
- Patent number 11,908,888
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive top via as a bottom electrode contact for an embedded m...
- Patent number 11,910,722
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous electrodes for magneto-resistive random access memory...
- Patent number 11,887,641
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse with laterally extended liner
- Patent number 11,881,431
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,881,433
- Issue date Jan 23, 2024
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM structures in the BEOL
- Patent number 11,877,458
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Baozhen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Decoupled interconnect structures
- Patent number 11,876,047
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal interconnects for semiconductor device structures
- Patent number 11,817,389
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface conversion in chemical mechanical polishing
- Patent number 11,804,378
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Raghuveer R Patlolla
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240429270
- Publication date Dec 26, 2024
- International Business Machines Corporation
- HUIMEI ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421064
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421067
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE
- Publication number 20240421076
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH TRAPEZOID SHAPED ELECTRODES
- Publication number 20240389468
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
MRAM DEVICE WITH HEXAGONAL SHAPED ELECTRODES
- Publication number 20240389469
- Publication date Nov 21, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE
- Publication number 20240387264
- Publication date Nov 21, 2024
- Adeia Semiconductor Solutions LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT
- Publication number 20240371750
- Publication date Nov 7, 2024
- International Business Machines Corporation
- Manasa MEDIKONDA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRES WITH EXPANDED SIDEWALLS
- Publication number 20240332074
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS
- Publication number 20240321747
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP VIA INTERCONNECT
- Publication number 20240321630
- Publication date Sep 26, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AIR GAP IN BEOL INTERCONNECT
- Publication number 20240312834
- Publication date Sep 19, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE
- Publication number 20240304546
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRING STRUCTURE FOR ADVANCED INTERCONNECT
- Publication number 20240304547
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CROSS COUPLED STACKED TRANSISTORS
- Publication number 20240304626
- Publication date Sep 12, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE
- Publication number 20240282630
- Publication date Aug 22, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT FORMATION
- Publication number 20240266409
- Publication date Aug 8, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH OCTAGON PROFILE
- Publication number 20240233793
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
MRAM REFILL DEVICE STRUCTURE
- Publication number 20240237548
- Publication date Jul 11, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC
- Publication number 20240213092
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXTENDED SOURCE/DRAIN CONTACT FOR SHIFTED DRAIN VOLTAGE FOR A BACKS...
- Publication number 20240213337
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS
- Publication number 20240213087
- Publication date Jun 27, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE CONTACT
- Publication number 20240206345
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM WITH A MULTI-COMPONENT, MULTI-LAYER BOTTOM ELECTRODE
- Publication number 20240206346
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER VIA WITH SIDEWALL SPACER
- Publication number 20240194585
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH HAMMERHEAD PROFILE
- Publication number 20240196758
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- G11 - INFORMATION STORAGE
Information Patent Application
Interconnects with Sidewall Barrier Layer Divot Fill
- Publication number 20240194587
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT
- Publication number 20240194691
- Publication date Jun 13, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE
- Publication number 20240188446
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE

Chih-Chao Yang

Person

Patents Grantslast 30 patents

Additive interconnect formation

Replacement bottom electrode structure for MRAM devices

Stepped contact within memory region

Contact structure formation for memory devices

Contact structure formation for memory devices

Multi-diameter magnetic random-access memory pillar structure

Resistance tunable fuse structure formed by embedded thin metal layers

Beol tip-to-tip shorting and time dependent dielectric breakdown

Electronic fuse structure embedded in top via

Top via interconnects without barrier metal between via and above line

MRAM cell embedded in a metal layer

BEOL etch stop layer without capacitance penalty

Backside metal-insulator-metal (MIM) capacitors extending through b...

Coaxial top MRAM electrode

BEOL alternative metal interconnects: integration and process

Dielectric fill for tight pitch MRAM pillar array

Via patterning for integrated circuits

High-density memory devices using oxide gap fill

High density two-tier MRAM structure

Interconnect including integrally formed capacitor

Metal-insulator-metal capacitor structure supporting different volt...

Subtractive top via as a bottom electrode contact for an embedded m...

Rework for metal interconnects using etch and thermal anneal

Simultaneous electrodes for magneto-resistive random access memory...

Anti-fuse with laterally extended liner

Advanced copper interconnects with hybrid microstructure

RRAM structures in the BEOL

Decoupled interconnect structures

Multi-metal interconnects for semiconductor device structures

Surface conversion in chemical mechanical polishing

Patents Applicationslast 30 patents

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

ADVANCED INTERCONNECTS WITH HYPERBOLOID PROFILE

MRAM DEVICE WITH TRAPEZOID SHAPED ELECTRODES

MRAM DEVICE WITH HEXAGONAL SHAPED ELECTRODES

ADVANCED COPPER INTERCONNECTS WITH HYBRID MICROSTRUCTURE

SEMICONDUCTOR STRUCTURE WITH TOP VIA HAVING EXTENDED BOTTOM CONTACT

METAL WIRES WITH EXPANDED SIDEWALLS

BACKSIDE POWER ISLANDS FOR BACKSIDE POWER APPLICATIONS

TOP VIA INTERCONNECT

AIR GAP IN BEOL INTERCONNECT

LOW RESISTANCE SEMICONDUCTOR INTERCONNECT STRUCTURE

WIRING STRUCTURE FOR ADVANCED INTERCONNECT

CROSS COUPLED STACKED TRANSISTORS

SEMICONDUCTOR STRUCTURES INCLUDING METAL WIRES WITH EDGE CURVATURE

BACKSIDE CONTACT FORMATION

MRAM DEVICE WITH OCTAGON PROFILE

MRAM REFILL DEVICE STRUCTURE

OCTAGONAL INTERCONNECT WIRING FOR ADVANCED LOGIC

EXTENDED SOURCE/DRAIN CONTACT FOR SHIFTED DRAIN VOLTAGE FOR A BACKS...

ADVANCED PITCH INTERCONNECTS WITH MULTIPLE LOW ASPECT RATIO SEGMENTS

MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE CONTACT

MRAM WITH A MULTI-COMPONENT, MULTI-LAYER BOTTOM ELECTRODE

SUPER VIA WITH SIDEWALL SPACER

MRAM DEVICE WITH HAMMERHEAD PROFILE

Interconnects with Sidewall Barrier Layer Divot Fill

ENLARGED OVERLAP BETWEEN BACKSIDE POWER RAIL AND BACKSIDE CONTACT

MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE