Chih-Chao Yang

Person

Glenmont, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
MRAM top electrode structure with liner layer
- Patent number 12,369,494
- Issue date Jul 22, 2025
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 12,363,913
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor structure with enlarged capacitor area
- Patent number 12,356,638
- Issue date Jul 8, 2025
- Chanro Park
Information Patent Grant
MRAM device structure
- Patent number 12,349,598
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Koichi Motoyama
Information Patent Grant
Conical magnetic random access memory pillar structures
- Patent number 12,349,597
- Issue date Jul 1, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Etching of magnetic tunnel junction (MTJ) stack for magnetoresistiv...
- Patent number 12,342,726
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Koichi Motoyama
Information Patent Grant
Copper interconnects with self-aligned hourglass-shaped metal cap
- Patent number 12,341,100
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnect
- Patent number 12,341,066
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pad with built-in interconnect structure
- Patent number 12,327,770
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall bottom electrode structure in embedded magnetoresistive random...
- Patent number 12,324,358
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
MRAM structure with multilayer encapsulation
- Patent number 12,317,752
- Issue date May 27, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Reducing copper line resistance
- Patent number 12,315,807
- Issue date May 27, 2025
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with segmented bottom electrode
- Patent number 12,289,896
- Issue date Apr 29, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Top via interconnects with line wiggling prevention
- Patent number 12,266,605
- Issue date Apr 1, 2025
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with substitutional bottom e...
- Patent number 12,250,827
- Issue date Mar 11, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Dual layer top contact for magnetic tunnel junction stack
- Patent number 12,219,881
- Issue date Feb 4, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
MRAM device with wrap-around top electrode
- Patent number 12,207,561
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Grant
Additive interconnect formation
- Patent number 12,183,630
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Replacement bottom electrode structure for MRAM devices
- Patent number 12,167,700
- Issue date Dec 10, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Stepped contact within memory region
- Patent number 12,144,263
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,133,473
- Issue date Oct 29, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,120,963
- Issue date Oct 15, 2024
- International Business Machines Corporation
- Lili Cheng
Information Patent Grant
Multi-diameter magnetic random-access memory pillar structure
- Patent number 12,108,685
- Issue date Oct 1, 2024
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Grant
Resistance tunable fuse structure formed by embedded thin metal layers
- Patent number 12,100,653
- Issue date Sep 24, 2024
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Beol tip-to-tip shorting and time dependent dielectric breakdown
- Patent number 12,087,624
- Issue date Sep 10, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic fuse structure embedded in top via
- Patent number 12,062,609
- Issue date Aug 13, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top via interconnects without barrier metal between via and above line
- Patent number 12,057,395
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MRAM cell embedded in a metal layer
- Patent number 12,058,942
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
BEOL etch stop layer without capacitance penalty
- Patent number 12,027,416
- Issue date Jul 2, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Backside metal-insulator-metal (MIM) capacitors extending through b...
- Patent number 12,002,758
- Issue date Jun 4, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES
- Publication number 20250218941
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Min Gyu Sung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIMETALLIC FUSE ELEMENT BETWEEN METAL LEVELS
- Publication number 20250218935
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONCAVE TRAY BOTTOM ELECTRODE FOR MRAM
- Publication number 20250204268
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
SELF-ALIGNED BACKSIDE DIFFUSION BREAK AND S/D CONTACT
- Publication number 20250204001
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY DEVICES WITH ENCAPSULATION LAYERS AND METAL VIA
- Publication number 20250204267
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
Information Patent Application
AIRGAP IN SINGLE DIFFUSION BREAK
- Publication number 20250194168
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED MEMORY DEVICE USING A SHARED TRANSISTOR
- Publication number 20250194104
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Application
MRAM DEVICE WITH ASYMMETRIC ELECTRODES
- Publication number 20250194432
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
LOW RESISTANCE VIA STRUCTURE
- Publication number 20250167103
- Publication date May 22, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MERGED BACKSIDE CONTACT ISOLATION
- Publication number 20250169172
- Publication date May 22, 2025
- International Business Machines Corporation
- Lijuan Zou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT WITH STRAIGHT PROFILE
- Publication number 20250169177
- Publication date May 22, 2025
- International Business Machines Corporation
- Tsung-Sheng Kang
Information Patent Application
AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA
- Publication number 20250125192
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL FUSE STRUCTURE
- Publication number 20250125285
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TAPERED MRAM DEVICE STRUCTURE
- Publication number 20250120324
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
METAL SPACER 3D-MIM CAPACITOR
- Publication number 20250113498
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL RESISTORS
- Publication number 20250107113
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH TUNNEL BARRIER OVERHANG
- Publication number 20250107452
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
TAPERED ANTIFUSE
- Publication number 20250096123
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIFUSE AND RESISTOR
- Publication number 20250096125
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20250098322
- Publication date Mar 20, 2025
- International Business Machines Corporation
- HUIMEI ZHOU
Information Patent Application
VERTICAL ANTIFUSE
- Publication number 20250096122
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL ANTIFUSE
- Publication number 20250096124
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE THIN-FILM RESISTOR STRUCTURE
- Publication number 20250087392
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR-SHAPED RESISTOR
- Publication number 20250089347
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS
- Publication number 20250038107
- Publication date Jan 30, 2025
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC ISOLATION FOR MRAM ARRAY
- Publication number 20250031382
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES
- Publication number 20250029917
- Publication date Jan 23, 2025
- International Business Machines Corporation
- Huimei Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM ANCHOR VIA
- Publication number 20250024757
- Publication date Jan 16, 2025
- International Business Machines Corporation
- Oscar van der Straten
Information Patent Application
TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES
- Publication number 20250014994
- Publication date Jan 9, 2025
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Chao Yang

Person

Patents Grantslast 30 patents

MRAM top electrode structure with liner layer

Fabrication of embedded memory devices utilizing a self assembled m...

Metal-insulator-metal capacitor structure with enlarged capacitor area

MRAM device structure

Conical magnetic random access memory pillar structures

Etching of magnetic tunnel junction (MTJ) stack for magnetoresistiv...

Copper interconnects with self-aligned hourglass-shaped metal cap

Advanced metal interconnect

Probe pad with built-in interconnect structure

Tall bottom electrode structure in embedded magnetoresistive random...

MRAM structure with multilayer encapsulation

Reducing copper line resistance

Magneto-resistive random access memory with segmented bottom electrode

Top via interconnects with line wiggling prevention

Magneto-resistive random access memory with substitutional bottom e...

Dual layer top contact for magnetic tunnel junction stack

MRAM device with wrap-around top electrode

Additive interconnect formation

Replacement bottom electrode structure for MRAM devices

Stepped contact within memory region

Contact structure formation for memory devices

Contact structure formation for memory devices

Multi-diameter magnetic random-access memory pillar structure

Resistance tunable fuse structure formed by embedded thin metal layers

Beol tip-to-tip shorting and time dependent dielectric breakdown

Electronic fuse structure embedded in top via

Top via interconnects without barrier metal between via and above line

MRAM cell embedded in a metal layer

BEOL etch stop layer without capacitance penalty

Backside metal-insulator-metal (MIM) capacitors extending through b...

Patents Applicationslast 30 patents

POWER RAIL LEAD FOR SEMICONDUCTOR STRUCTURES

BIMETALLIC FUSE ELEMENT BETWEEN METAL LEVELS

CONCAVE TRAY BOTTOM ELECTRODE FOR MRAM

SELF-ALIGNED BACKSIDE DIFFUSION BREAK AND S/D CONTACT

MEMORY DEVICES WITH ENCAPSULATION LAYERS AND METAL VIA

AIRGAP IN SINGLE DIFFUSION BREAK

DOUBLE-SIDED MEMORY DEVICE USING A SHARED TRANSISTOR

MRAM DEVICE WITH ASYMMETRIC ELECTRODES

LOW RESISTANCE VIA STRUCTURE

MERGED BACKSIDE CONTACT ISOLATION

BACKSIDE CONTACT WITH STRAIGHT PROFILE

AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA

ELECTRICAL FUSE STRUCTURE

MULTI-TAPERED MRAM DEVICE STRUCTURE

METAL SPACER 3D-MIM CAPACITOR

THREE-DIMENSIONAL RESISTORS

MRAM DEVICE WITH TUNNEL BARRIER OVERHANG

TAPERED ANTIFUSE

ANTIFUSE AND RESISTOR

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

VERTICAL ANTIFUSE

HORIZONTAL ANTIFUSE

SCALABLE THIN-FILM RESISTOR STRUCTURE

CIRCULAR-SHAPED RESISTOR

TRENCH LINER FUSE

INTERCONNECT STRUCTURES WITH OVERLAPPING METAL VIAS

DIELECTRIC ISOLATION FOR MRAM ARRAY

METAL-INSULATOR-METAL CAPACITOR VIA STRUCTURES

MRAM ANCHOR VIA

TERRACED CONDUCTOR STRUCTURE FOR SEMICONDUCTOR DEVICES