Chih-Chao Yang

Person

Glenmont, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dielectric fill for tight pitch MRAM pillar array
- Patent number 11,955,152
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Via patterning for integrated circuits
- Patent number 11,942,424
- Issue date Mar 26, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density memory devices using oxide gap fill
- Patent number 11,937,514
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Theodorus E. Standaert
Information Patent Grant
High density two-tier MRAM structure
- Patent number 11,937,435
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Interconnect including integrally formed capacitor
- Patent number 11,908,738
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Nicholas Anthony Lanzillo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor structure supporting different volt...
- Patent number 11,908,888
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive top via as a bottom electrode contact for an embedded m...
- Patent number 11,910,722
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Rework for metal interconnects using etch and thermal anneal
- Patent number 11,901,224
- Issue date Feb 13, 2024
- International Business Machines Corporation
- Prasad Bhosale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simultaneous electrodes for magneto-resistive random access memory...
- Patent number 11,887,641
- Issue date Jan 30, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Anti-fuse with laterally extended liner
- Patent number 11,881,431
- Issue date Jan 23, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced copper interconnects with hybrid microstructure
- Patent number 11,881,433
- Issue date Jan 23, 2024
- TESSERA LLC
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM structures in the BEOL
- Patent number 11,877,458
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Baozhen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Decoupled interconnect structures
- Patent number 11,876,047
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-metal interconnects for semiconductor device structures
- Patent number 11,817,389
- Issue date Nov 14, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface conversion in chemical mechanical polishing
- Patent number 11,804,378
- Issue date Oct 31, 2023
- International Business Machines Corporation
- Raghuveer R Patlolla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magneto-resistive random access memory with laterally-recessed free...
- Patent number 11,758,819
- Issue date Sep 12, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 11,744,083
- Issue date Aug 29, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structures including self aligned vias
- Patent number 11,735,468
- Issue date Aug 22, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertically-stacked interdigitated metal-insulator-metal capacitor f...
- Patent number 11,715,594
- Issue date Aug 1, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor structures
- Patent number 11,688,680
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal capacitor embedded in seal...
- Patent number 11,676,892
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resistance tunable fuse structure formed by embedded thin metal layers
- Patent number 11,676,894
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Alexander Reznicek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of phase change memory cell in integrated circuit
- Patent number 11,647,681
- Issue date May 9, 2023
- International Business Machines Corporation
- Baozhen Li
Information Patent Grant
Planarization stop region for use with low pattern density intercon...
- Patent number 11,637,036
- Issue date Apr 25, 2023
- International Business Machines Corporation
- Cornelius Brown Peethala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding MRAM device in advanced interconnects
- Patent number 11,621,294
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non volatile resistive memory logic device
- Patent number 11,600,325
- Issue date Mar 7, 2023
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Grant
Electrode with alloy interface
- Patent number 11,557,482
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Via cleaning to reduce resistance
- Patent number 11,557,507
- Issue date Jan 17, 2023
- International Business Machines Corporation
- Yann A. M. Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory devices
- Patent number 11,502,242
- Issue date Nov 15, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned via for interconnect
- Patent number 11,495,538
- Issue date Nov 8, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE WITH SKIPVIA
- Publication number 20240153868
- Publication date May 9, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE CONTACT METAL FILL
- Publication number 20240153875
- Publication date May 9, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH OCTAGON PROFILE
- Publication number 20240135978
- Publication date Apr 25, 2024
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
TOP CONTACT STRUCTURE FOR EMBEDDED MRAM
- Publication number 20240130242
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Ailian Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHAMFERED MRAM DEVICE STRUCTURE
- Publication number 20240130244
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE STRUCTURE WITH IMPROVED TOP ELECTRODE
- Publication number 20240130245
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE SPACER IN SHALLOW TRENCH IS...
- Publication number 20240120372
- Publication date Apr 11, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE
- Publication number 20240113018
- Publication date Apr 4, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...
- Publication number 20240105612
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT WITH DISCONNECTED LINER AND METAL CAP
- Publication number 20240105620
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH ANNULAR ELECTRODES
- Publication number 20240107894
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE POWER RAIL WITH TIGHT SPACE
- Publication number 20240105606
- Publication date Mar 28, 2024
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM TOP ELECTRODE STRUCTURE WITH LINER LAYER
- Publication number 20240099148
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Hsueh-Chung Chen
- G11 - INFORMATION STORAGE
Information Patent Application
FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION
- Publication number 20240096783
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) APPARATUS WITH SELF-...
- Publication number 20240096978
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED EMBEDDED MEMORY ARRAY
- Publication number 20240099035
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Wu-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETORESISTIVE RANDOM-ACCESS MEMORY WITH TOP AND BOTTOM ELECTRODE...
- Publication number 20240090337
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAA DEVICE WITH THE SUBSTRATE INCLUDING EMBEDDED INSULATING STRUCTU...
- Publication number 20240088034
- Publication date Mar 14, 2024
- International Business Machines Corporation
- Tsung-Sheng Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALIGNMENT MARK FOR BACK SIDE POWER CONNECTIONS
- Publication number 20240079294
- Publication date Mar 7, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATED INPUT/OUTPUT (I/O) AND SHARED POWER TERMINALS FOR A CARRI...
- Publication number 20240072001
- Publication date Feb 29, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SIGNAL AND POWER ARRANGEMENT FOR NANOSHEET DEVICES
- Publication number 20240055441
- Publication date Feb 15, 2024
- International Business Machines Corporation
- Tao Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM STRUCTURE WITH RAISED EDGE OF TUNNEL BARRIER LAYER
- Publication number 20240032435
- Publication date Jan 25, 2024
- International Business Machines Corporation
- Koichi Motoyama
- G11 - INFORMATION STORAGE
Information Patent Application
MRAM STRUCTURE WITH A T-SHAPED FERROMAGNETIC LAYER
- Publication number 20240032438
- Publication date Jan 25, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE STRUCTURE
- Publication number 20240032436
- Publication date Jan 25, 2024
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH SELF-ALIGNED BOTTOM ELECTRODES
- Publication number 20230422629
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
BEVELED MAGNETO-RESISTIVE RANDOM ACCESS MEMORY PILLAR STRUCTURE
- Publication number 20230422630
- Publication date Dec 28, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH TAPERED SIDEWALLS
- Publication number 20230403944
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Oscar van der Strate
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DAMASCENE MRAM DEVICE
- Publication number 20230403947
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Koichi Motoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMULTANEOUS ELECTRODES FOR MAGNETO-RESISTIVE RANDOM ACCESS MEMORY...
- Publication number 20230402078
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COAXIAL TOP MRAM ELECTRODE
- Publication number 20230402079
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Oscar van der Straten
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Chao Yang

Person

Patents Grantslast 30 patents

Dielectric fill for tight pitch MRAM pillar array

Via patterning for integrated circuits

High-density memory devices using oxide gap fill

High density two-tier MRAM structure

Interconnect including integrally formed capacitor

Metal-insulator-metal capacitor structure supporting different volt...

Subtractive top via as a bottom electrode contact for an embedded m...

Rework for metal interconnects using etch and thermal anneal

Simultaneous electrodes for magneto-resistive random access memory...

Anti-fuse with laterally extended liner

Advanced copper interconnects with hybrid microstructure

RRAM structures in the BEOL

Decoupled interconnect structures

Multi-metal interconnects for semiconductor device structures

Surface conversion in chemical mechanical polishing

Magneto-resistive random access memory with laterally-recessed free...

Fabrication of embedded memory devices utilizing a self assembled m...

Interconnect structures including self aligned vias

Vertically-stacked interdigitated metal-insulator-metal capacitor f...

MIM capacitor structures

Three-dimensional metal-insulator-metal capacitor embedded in seal...

Resistance tunable fuse structure formed by embedded thin metal layers

Fabrication of phase change memory cell in integrated circuit

Planarization stop region for use with low pattern density intercon...

Embedding MRAM device in advanced interconnects

Non volatile resistive memory logic device

Electrode with alloy interface

Via cleaning to reduce resistance

Embedded memory devices

Fully aligned via for interconnect

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE WITH SKIPVIA

BACKSIDE CONTACT METAL FILL

MRAM DEVICE WITH OCTAGON PROFILE

TOP CONTACT STRUCTURE FOR EMBEDDED MRAM

CHAMFERED MRAM DEVICE STRUCTURE

MRAM DEVICE STRUCTURE WITH IMPROVED TOP ELECTRODE

SEMICONDUCTOR STRUCTURE WITH CONDUCTIVE SPACER IN SHALLOW TRENCH IS...

LOCALLY WIDENED PROFILE FOR NANOSCALE WIRING STRUCTURE

BACKSIDE POWER DISTRIBUTION NETWORK AND BACKSIDE SINGLE CRYSTAL TRA...

INTERCONNECT WITH DISCONNECTED LINER AND METAL CAP

MRAM DEVICE WITH ANNULAR ELECTRODES

BACKSIDE POWER RAIL WITH TIGHT SPACE

MRAM TOP ELECTRODE STRUCTURE WITH LINER LAYER

FLEXIBLE WIRING ARCHITECTURE FOR MULTI-DIE INTEGRATION

COMPLEMENTARY METAL-OXIDE-SEMICONDUCTOR (CMOS) APPARATUS WITH SELF-...

DOUBLE-SIDED EMBEDDED MEMORY ARRAY

MAGNETORESISTIVE RANDOM-ACCESS MEMORY WITH TOP AND BOTTOM ELECTRODE...

GAA DEVICE WITH THE SUBSTRATE INCLUDING EMBEDDED INSULATING STRUCTU...

ALIGNMENT MARK FOR BACK SIDE POWER CONNECTIONS

SEPARATED INPUT/OUTPUT (I/O) AND SHARED POWER TERMINALS FOR A CARRI...

WAFER SIGNAL AND POWER ARRANGEMENT FOR NANOSHEET DEVICES

MRAM STRUCTURE WITH RAISED EDGE OF TUNNEL BARRIER LAYER

MRAM STRUCTURE WITH A T-SHAPED FERROMAGNETIC LAYER

MRAM DEVICE STRUCTURE

MRAM DEVICE WITH SELF-ALIGNED BOTTOM ELECTRODES

BEVELED MAGNETO-RESISTIVE RANDOM ACCESS MEMORY PILLAR STRUCTURE

MAGNETO-RESISTIVE RANDOM ACCESS MEMORY WITH TAPERED SIDEWALLS

DAMASCENE MRAM DEVICE

SIMULTANEOUS ELECTRODES FOR MAGNETO-RESISTIVE RANDOM ACCESS MEMORY...

COAXIAL TOP MRAM ELECTRODE