Chih-Ming TSAO

Person

Miaoli City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Package structure and method of forming the same
- Patent number 12,261,088
- Issue date Mar 25, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 12,230,597
- Issue date Feb 18, 2025
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Airborne contaminant management method and system
- Patent number 12,202,015
- Issue date Jan 21, 2025
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Ming Tsao
- B08 - CLEANING
Information Patent Grant
Makeup air handling unit in semiconductor fabrication building and...
- Patent number 12,140,342
- Issue date Nov 12, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 12,107,064
- Issue date Oct 1, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Particle removal method in semiconductor fabrication process
- Patent number 12,062,535
- Issue date Aug 13, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of forming the same
- Patent number 12,051,655
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 12,051,639
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 11,996,400
- Issue date May 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having work function metal stack
- Patent number 11,948,800
- Issue date Apr 2, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Iintegrated fan-out packages with embedded heat dissipation structure
- Patent number 11,901,258
- Issue date Feb 13, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for detecting environmental parameter in semiconductor fabri...
- Patent number 11,892,382
- Issue date Feb 6, 2024
- Taiwan Semiconductor Manufacturing Company Ltd.
- Chih-Ming Tsao
- G08 - SIGNALLING
Information Patent Grant
Package structure
- Patent number 11,874,513
- Issue date Jan 16, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,862,577
- Issue date Jan 2, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 11,830,781
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacture
- Patent number 11,830,746
- Issue date Nov 28, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having work function metal stack
- Patent number 11,823,908
- Issue date Nov 21, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Yen-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Workpiece holder, wafer chuck, wafer holding method
- Patent number 11,791,192
- Issue date Oct 17, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,776,911
- Issue date Oct 3, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hung-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with warpage-control element
- Patent number 11,721,659
- Issue date Aug 8, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out packages and methods of forming the same
- Patent number 11,664,300
- Issue date May 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 11,585,992
- Issue date Feb 21, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Chia-Lun Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method for fabricating the same
- Patent number 11,569,362
- Issue date Jan 31, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Chia-Ming Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and manufacturing method thereof
- Patent number 11,515,274
- Issue date Nov 29, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure with porous conductive structure and manufacturin...
- Patent number 11,482,491
- Issue date Oct 25, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Wei-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFET device and methods of forming
- Patent number 11,450,757
- Issue date Sep 20, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Yu-Chang Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabricating the same
- Patent number 11,374,303
- Issue date Jun 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Fang-Yu Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of package on package structure
- Patent number 11,342,321
- Issue date May 24, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
FinFETs having epitaxial capping layer on fin and methods for formi...
- Patent number 11,211,477
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ming-Hua Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and method of fabrcating the same
- Patent number 11,211,341
- Issue date Dec 28, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240389240
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
- Publication number 20240387346
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAKEUP AIR HANDLING UNIT IN SEMICONDUCTOR FABRICATION BUILDING AND...
- Publication number 20240384881
- Publication date Nov 21, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER
- Publication number 20240379806
- Publication date Nov 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia-Ming HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20240371813
- Publication date Nov 7, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS
- Publication number 20240363329
- Publication date Oct 31, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING TSAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20240332215
- Publication date Oct 3, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS
- Publication number 20240312941
- Publication date Sep 19, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chao-Wei Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE
- Publication number 20240274589
- Publication date Aug 15, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsuan-Ting Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Treatment System for Uniform Processing of Semiconductor...
- Publication number 20240234192
- Publication date Jul 11, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE LAYER OF SEMICONDUCTOR DEVICE
- Publication number 20240222431
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE STACK OF FORKSHEET STRUCTURE
- Publication number 20240222377
- Publication date Jul 4, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Che-Chia HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING WORK FUNCTION METAL STACK
- Publication number 20240203738
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yen-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURE WITH TREATED GATE DIELECTRIC LAYER AND METH...
- Publication number 20240204073
- Publication date Jun 20, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chi HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DETECTING ENVIRONMENTAL PARAMETER IN SEMICONDUCTOR FABRI...
- Publication number 20240175788
- Publication date May 30, 2024
- Taiwan Semiconductor Manufacturing company Ltd.
- CHIH-MING TSAO
- G08 - SIGNALLING
Information Patent Application
Integrated Fan-Out Packages with Embedded Heat Dissipation Structure
- Publication number 20240153842
- Publication date May 9, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...
- Publication number 20240107682
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company Limited
- Chao-Wei Chiu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME
- Publication number 20240105642
- Publication date Mar 28, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FAST STARTING UP TELEVISION DISPLAY FUNCTION AND TELEVIS...
- Publication number 20240098336
- Publication date Mar 21, 2024
- Realtek Semiconductor Corp.
- YEN-HSING WU
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20240088062
- Publication date Mar 14, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan Pei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20240071952
- Publication date Feb 29, 2024
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Chiang Tsao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20240063287
- Publication date Feb 22, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Chia Ming Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME
- Publication number 20240047446
- Publication date Feb 8, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Mao-Yen Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THRESHOLD VOLTAGE MODULATION BY GATE HEIGHT VARIATION
- Publication number 20240014256
- Publication date Jan 11, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ta-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20230387024
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hung-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE
- Publication number 20230386862
- Publication date Nov 30, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Wei-Yu Chen
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
TOOL EXHAUST SYSTEM AND TREATMENT METHOD
- Publication number 20230364550
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Chih-Ming TSAO
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...
- Publication number 20230369094
- Publication date Nov 16, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Cheng-Shiuan Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT
- Publication number 20230335525
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hao-Jan PEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230335523
- Publication date Oct 19, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Jen-Jui Yu
- H01 - BASIC ELECTRIC ELEMENTS

Chih-Ming TSAO

Person

Patents Grantslast 30 patents

Package structure and method of forming the same

Package structure with warpage-control element

Airborne contaminant management method and system

Makeup air handling unit in semiconductor fabrication building and...

Semiconductor package and manufacturing method thereof

Particle removal method in semiconductor fabrication process

Package structure and method of forming the same

Package structure and manufacturing method thereof

Manufacturing method of package on package structure

Semiconductor device having work function metal stack

Iintegrated fan-out packages with embedded heat dissipation structure

Method for detecting environmental parameter in semiconductor fabri...

Package structure

Package structure and method of fabricating the same

Package structure and manufacturing method thereof

Semiconductor device and method of manufacture

Semiconductor device having work function metal stack

Workpiece holder, wafer chuck, wafer holding method

Semiconductor device and manufacturing method thereof

Package structure with warpage-control element

Fan-out packages and methods of forming the same

Package structure

Semiconductor device and a method for fabricating the same

Semiconductor package and manufacturing method thereof

Package structure with porous conductive structure and manufacturin...

FinFET device and methods of forming

Package structure and method of fabricating the same

Manufacturing method of package on package structure

FinFETs having epitaxial capping layer on fin and methods for formi...

Package structure and method of fabrcating the same

Patents Applicationslast 30 patents

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME

MAKEUP AIR HANDLING UNIT IN SEMICONDUCTOR FABRICATION BUILDING AND...

SEMICONDUCTOR DEVICES HAVING SILICIDE LAYER

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

PARTICLE REMOVAL METHOD IN SEMICONDUCTOR FABRICATION PROCESS

PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME

ELECTRONIC APPARATUS AND METHOD FOR FORMING CONDUCTIVE BUMPS

MANUFACTURING METHOD OF PACKAGE ON PACKAGE STRUCTURE

Method and Treatment System for Uniform Processing of Semiconductor...

SILICIDE LAYER OF SEMICONDUCTOR DEVICE

GATE STACK OF FORKSHEET STRUCTURE

SEMICONDUCTOR DEVICE HAVING WORK FUNCTION METAL STACK

SEMICONDUCTOR STRUCTURE WITH TREATED GATE DIELECTRIC LAYER AND METH...

METHOD FOR DETECTING ENVIRONMENTAL PARAMETER IN SEMICONDUCTOR FABRI...

Integrated Fan-Out Packages with Embedded Heat Dissipation Structure

MATERIALS FOR SEMICONDUCTOR PACKAGE MOUNT APPLICATIONS AND METHODS...

PACKAGE STRUCTURE AND METHOD OF FABRICATING THE SAME

METHOD FOR FAST STARTING UP TELEVISION DISPLAY FUNCTION AND TELEVIS...

PACKAGE STRUCTURE

INTEGRATED CIRCUIT DEVICE AND METHOD OF FORMING THE SAME

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD OF THE SAME

THRESHOLD VOLTAGE MODULATION BY GATE HEIGHT VARIATION

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURE

TOOL EXHAUST SYSTEM AND TREATMENT METHOD

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE, METHOD OF HANDLING W...

PACKAGE STRUCTURE WITH WARPAGE-CONTROL ELEMENT

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF