Chin-Tsai Yao

Person

Taichung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing substrate structure with filling material f...
- Patent number 11,973,014
- Issue date Apr 30, 2024
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a substrate for packaging
- Patent number 10,679,932
- Issue date Jun 9, 2020
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure with filling material formed in concave portion
- Patent number 10,522,453
- Issue date Dec 31, 2019
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package and method for fabricating the same
- Patent number 10,510,720
- Issue date Dec 17, 2019
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate and structure
- Patent number 9,900,996
- Issue date Feb 20, 2018
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof and semiconduct...
- Patent number 9,842,771
- Issue date Dec 12, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and a substrate for packaging
- Patent number 9,666,453
- Issue date May 30, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication method thereof
- Patent number 9,607,963
- Issue date Mar 28, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaging substrate and package structure
- Patent number 9,520,351
- Issue date Dec 13, 2016
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating EMI shielding package structure
- Patent number 9,425,152
- Issue date Aug 23, 2016
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure and semiconductor package using the same
- Patent number 9,368,467
- Issue date Jun 14, 2016
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating quad flat non-leaded package structure with...
- Patent number 9,190,387
- Issue date Nov 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure for semiconductor package
- Patent number 9,013,042
- Issue date Apr 21, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding package structure and method for fabricating the same
- Patent number 8,963,298
- Issue date Feb 24, 2015
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quad flat non-leaded package structure with electromagnetic interfe...
- Patent number 8,736,030
- Issue date May 27, 2014
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...
- Publication number 20200091059
- Publication date Mar 19, 2020
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STACK STRUCTURE
- Publication number 20180130774
- Publication date May 10, 2018
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180061810
- Publication date Mar 1, 2018
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING
- Publication number 20170294371
- Publication date Oct 12, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20170207161
- Publication date Jul 20, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR STRUC...
- Publication number 20170148679
- Publication date May 25, 2017
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE, PACKAGE STRUCTURE, AND METHODS OF FABRICATING TH...
- Publication number 20160099204
- Publication date Apr 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING SUBSTRATE AND PACKAGE STRUCTURE
- Publication number 20150332998
- Publication date Nov 19, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION ME...
- Publication number 20150235914
- Publication date Aug 20, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR FABRICATING EMI SHIELDING PACKAGE STRUCTURE
- Publication number 20150155240
- Publication date Jun 4, 2015
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND SEMICONDUCT...
- Publication number 20150069605
- Publication date Mar 12, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF
- Publication number 20150014848
- Publication date Jan 15, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR STRUC...
- Publication number 20150004752
- Publication date Jan 1, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH...
- Publication number 20140227830
- Publication date Aug 14, 2014
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE
- Publication number 20140061928
- Publication date Mar 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME
- Publication number 20130341806
- Publication date Dec 26, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE
- Publication number 20130334684
- Publication date Dec 19, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING
- Publication number 20130299968
- Publication date Nov 14, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFE...
- Publication number 20110198737
- Publication date Aug 18, 2011
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI SHIELDING PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110175210
- Publication date Jul 21, 2011
- Siliconware Precision Industries Co., Ltd.
- Chin-Tsai Yao
- H01 - BASIC ELECTRIC ELEMENTS

Chin-Tsai Yao

Person

Patents Grantslast 30 patents

Method of manufacturing substrate structure with filling material f...

Semiconductor package and a substrate for packaging

Substrate structure with filling material formed in concave portion

Electronic package and method for fabricating the same

Package substrate and structure

Semiconductor device and fabrication method thereof and semiconduct...

Semiconductor package and a substrate for packaging

Semiconductor device and fabrication method thereof

Packaging substrate and package structure

Method for fabricating EMI shielding package structure

Substrate structure and semiconductor package using the same

Method for fabricating quad flat non-leaded package structure with...

Interconnection structure for semiconductor package

EMI shielding package structure and method for fabricating the same

Quad flat non-leaded package structure with electromagnetic interfe...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING SUBSTRATE STRUCTURE WITH FILLING MATERIAL F...

PACKAGE STACK STRUCTURE

ELECTRONIC PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING

SUBSTRATE STRUCTURE AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR STRUC...

PACKAGE SUBSTRATE, PACKAGE STRUCTURE, AND METHODS OF FABRICATING TH...

PACKAGING SUBSTRATE AND PACKAGE STRUCTURE

FLIP-CHIP PACKAGING SUBSTRATE, FLIP-CHIP PACKAGE AND FABRICATION ME...

METHOD FOR FABRICATING EMI SHIELDING PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF AND SEMICONDUCT...

SEMICONDUCTOR DEVICE AND FABRICATION METHOD THEREOF

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR STRUC...

METHOD FOR FABRICATING QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH...

INTERCONNECTION STRUCTURE FOR SEMICONDUCTOR PACKAGE

SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE USING THE SAME

SUBSTRATE STRUCTURE AND PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE AND A SUBSTRATE FOR PACKAGING

QUAD FLAT NON-LEADED PACKAGE STRUCTURE WITH ELECTROMAGNETIC INTERFE...

EMI SHIELDING PACKAGE STRUCTURE AND METHOD FOR FABRICATING THE SAME