Ching-Li Yang

Person

Ping-Tung Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing method of connection structure of semiconductor device
- Patent number 11,916,018
- Issue date Feb 27, 2024
- United Microelectronics Corp.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing die seal ring
- Patent number 11,664,333
- Issue date May 30, 2023
- United Microelectronics Corp.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connection structure of semiconductor device and manufacturing meth...
- Patent number 10,978,391
- Issue date Apr 13, 2021
- United Microelectronics Corp.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring and manufacturing method thereof
- Patent number 10,892,235
- Issue date Jan 12, 2021
- United Microelectronics Corp.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitor and method for fabricating the same
- Patent number 9,773,860
- Issue date Sep 26, 2017
- United Microelectronics Corp.
- Yu-Tsung Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via structure
- Patent number 9,312,208
- Issue date Apr 12, 2016
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Die seal ring and method of forming the same
- Patent number 9,048,246
- Issue date Jun 2, 2015
- United Microelectronics Corp.
- Ming-Te Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via process
- Patent number 9,012,324
- Issue date Apr 21, 2015
- United Microelectronics Corp.
- Jia-Jia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming semiconductor structure having through silicon v...
- Patent number 8,916,471
- Issue date Dec 23, 2014
- United Microelectronics Corp.
- Ching-Li Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via structure and method of fabricating the same
- Patent number 8,900,996
- Issue date Dec 2, 2014
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Anti-fuse structure and programming method thereof
- Patent number 8,884,398
- Issue date Nov 11, 2014
- United Microelectronics Corp.
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and method of forming the same
- Patent number 8,841,755
- Issue date Sep 23, 2014
- United Microelectronics Corp.
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor structure
- Patent number 8,691,688
- Issue date Apr 8, 2014
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and method of forming the same
- Patent number 8,518,823
- Issue date Aug 27, 2013
- United Microelectronics Corp.
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal structure
- Patent number 7,696,606
- Issue date Apr 13, 2010
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer
- Patent number 7,649,268
- Issue date Jan 19, 2010
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a metal structure
- Patent number 7,387,950
- Issue date Jun 17, 2008
- United Microelectronics Corp.
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MANUFACTURING METHOD OF CONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE
- Publication number 20210193575
- Publication date Jun 24, 2021
- UNITED MICROELECTRONICS CORP.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING DIE SEAL RING
- Publication number 20210082839
- Publication date Mar 18, 2021
- United Microelectronics Corp.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SEAL RING AND MANUFACTURING METHOD THEREOF
- Publication number 20200066657
- Publication date Feb 27, 2020
- United Microelectronics Corp.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METH...
- Publication number 20190081000
- Publication date Mar 14, 2019
- UNITED MICROELECTRONICS CORP.
- Chen-Yi Weng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
- Publication number 20180061752
- Publication date Mar 1, 2018
- UNITED MICROELECTRONICS CORP.
- Shih-Che Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via structure
- Publication number 20150041961
- Publication date Feb 12, 2015
- UNITED MICROELECTRONICS CORP.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Die Seal Ring and Method of Forming the Same
- Publication number 20140367835
- Publication date Dec 18, 2014
- Ming-Te Wei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTI-FUSE STRUCTURE AND PROGRAMMING METHOD THEREOF
- Publication number 20140291801
- Publication date Oct 2, 2014
- Chu-Fu Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA PROCESS
- Publication number 20140057434
- Publication date Feb 27, 2014
- Jia-Jia Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via structure and method of fabricating the same
- Publication number 20130341799
- Publication date Dec 26, 2013
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE
- Publication number 20130337645
- Publication date Dec 19, 2013
- United Microelectronics Corp.
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through Silicon Via and Method of Forming the Same
- Publication number 20130299949
- Publication date Nov 14, 2013
- UNITED MICROELECTRONICS CORP.
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Through silicon via structure and method of fabricating the same
- Publication number 20130270712
- Publication date Oct 17, 2013
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER SAWING METHOD AND WAFER STRUCTURE BENEFICIAL FOR PERFORMING T...
- Publication number 20130256843
- Publication date Oct 3, 2013
- UNITED MICROELECTRONICS CORPORATION
- Hsin-Yu CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA AND METHOD OF FORMING THE SAME
- Publication number 20130161796
- Publication date Jun 27, 2013
- Kuo-Hsiung Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20130037953
- Publication date Feb 14, 2013
- Hsin-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR WAFER
- Publication number 20080142798
- Publication date Jun 19, 2008
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A METAL STRUCTURE
- Publication number 20080146024
- Publication date Jun 19, 2008
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL STRUCTURE
- Publication number 20080142997
- Publication date Jun 19, 2008
- Chien-Li Kuo
- H01 - BASIC ELECTRIC ELEMENTS

Ching-Li Yang

Person

Patents Grantslast 30 patents

Manufacturing method of connection structure of semiconductor device

Method of manufacturing die seal ring

Connection structure of semiconductor device and manufacturing meth...

Die seal ring and manufacturing method thereof

Capacitor and method for fabricating the same

Through silicon via structure

Die seal ring and method of forming the same

Through silicon via process

Method for forming semiconductor structure having through silicon v...

Through silicon via structure and method of fabricating the same

Anti-fuse structure and programming method thereof

Through silicon via and method of forming the same

Method of manufacturing semiconductor structure

Through silicon via and method of forming the same

Metal structure

Semiconductor wafer

Method for forming a metal structure

Patents Applicationslast 30 patents

MANUFACTURING METHOD OF CONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE

METHOD OF MANUFACTURING DIE SEAL RING

DIE SEAL RING AND MANUFACTURING METHOD THEREOF

CONNECTION STRUCTURE OF SEMICONDUCTOR DEVICE AND MANUFACTURING METH...

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME

Through silicon via structure

Die Seal Ring and Method of Forming the Same

ANTI-FUSE STRUCTURE AND PROGRAMMING METHOD THEREOF

THROUGH SILICON VIA PROCESS

Through silicon via structure and method of fabricating the same

METHOD OF MANUFACTURING SEMICONDUCTOR STRUCTURE

Through Silicon Via and Method of Forming the Same

Through silicon via structure and method of fabricating the same

WAFER SAWING METHOD AND WAFER STRUCTURE BENEFICIAL FOR PERFORMING T...

THROUGH SILICON VIA AND METHOD OF FORMING THE SAME

THROUGH SILICON VIA STRUCTURE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR WAFER

METHOD FOR FORMING A METAL STRUCTURE

METAL STRUCTURE