Chintan BUCH

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Package core assembly and fabrication methods
- Patent number 12,087,679
- Issue date Sep 10, 2024
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Glass core package substrates
- Patent number 12,080,632
- Issue date Sep 3, 2024
- Advanced Micro Devices, Inc.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarization methods for packaging substrates
- Patent number 11,931,855
- Issue date Mar 19, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- B24 - GRINDING POLISHING
Information Patent Grant
Fluoropolymer stamp fabrication method
- Patent number 11,927,885
- Issue date Mar 12, 2024
- Applied Materials, Inc.
- Roman Gouk
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 11,881,447
- Issue date Jan 23, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package core assembly and fabrication methods
- Patent number 11,862,546
- Issue date Jan 2, 2024
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming microvias with reduced diameter
- Patent number 11,798,903
- Issue date Oct 24, 2023
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structures with built-in EMI shielding
- Patent number 11,521,937
- Issue date Dec 6, 2022
- Applied Materials, Inc.
- Steven Verhaverbeke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluoropolymer stamp fabrication method
- Patent number 11,454,884
- Issue date Sep 27, 2022
- Applied Materials, Inc.
- Roman Gouk
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved polymer-copper adhesion
- Patent number 11,388,822
- Issue date Jul 12, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Grant
Methods of forming microvias with reduced diameter
- Patent number 11,315,890
- Issue date Apr 26, 2022
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via formation by micro-imprinting
- Patent number 11,281,094
- Issue date Mar 22, 2022
- Applied Materials, Inc.
- Roman Gouk
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Package structure with embedded core
- Patent number 10,937,726
- Issue date Mar 2, 2021
- Applied Materials, Inc.
- Han-Wen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for via formation in flowable epoxy materials by micro-imprint
- Patent number 10,727,083
- Issue date Jul 28, 2020
- Applied Materials, Inc.
- Roman Gouk
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
GLASS CORE PACKAGE SUBSTRATES
- Publication number 20250029900
- Publication date Jan 23, 2025
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...
- Publication number 20240113070
- Publication date Apr 4, 2024
- ADVANCED MICRO DEVICES, INC.
- CHINTAN BUCH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...
- Publication number 20230120305
- Publication date Apr 20, 2023
- ADVANCED MICRO DEVICES, INC.
- CHIA-HAO CHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PACKAGE SUBSTRATES
- Publication number 20230102183
- Publication date Mar 30, 2023
- ADVANCED MICRO DEVICES, INC.
- Deepak Vasant Kulkarni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUOROPOLYMER STAMP FABRICATION METHOD
- Publication number 20220373883
- Publication date Nov 24, 2022
- APPLIED MATERIALS, INC.
- Roman GOUK
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
Methods Of Forming Microvias With Reduced Diameter
- Publication number 20220246558
- Publication date Aug 4, 2022
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
- Publication number 20220171281
- Publication date Jun 2, 2022
- Applied Materials, Inc.
- Roman GOUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURES WITH BUILT-IN EMI SHIELDING
- Publication number 20220157740
- Publication date May 19, 2022
- Applied Materials, Inc.
- Steven VERHAVERBEKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Improved Polymer-Copper Adhesion
- Publication number 20220071023
- Publication date Mar 3, 2022
- Applied Materials, Inc.
- Tapash Chakraborty
- B32 - LAYERED PRODUCTS
Information Patent Application
Methods Of Forming Microvias With Reduced Diameter
- Publication number 20220051999
- Publication date Feb 17, 2022
- Applied Materials, Inc.
- Chintan Buch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLUOROPOLYMER STAMP FABRICATION METHOD
- Publication number 20210325776
- Publication date Oct 21, 2021
- Applied Materials, Inc.
- Roman GOUK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210257289
- Publication date Aug 19, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210249345
- Publication date Aug 12, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210159160
- Publication date May 27, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE CORE ASSEMBLY AND FABRICATION METHODS
- Publication number 20210159158
- Publication date May 27, 2021
- Applied Materials, Inc.
- Han-Wen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZATION METHODS FOR PACKAGING SUBSTRATES
- Publication number 20200391343
- Publication date Dec 17, 2020
- Applied Materials, Inc.
- Han-Wen CHEN
- B24 - GRINDING POLISHING
Information Patent Application
METHOD FOR VIA FORMATION BY MICRO-IMPRINTING
- Publication number 20200159113
- Publication date May 21, 2020
- Applied Materials, Inc.
- Roman GOUK
- H01 - BASIC ELECTRIC ELEMENTS

Chintan BUCH

Person

Patents Grantslast 30 patents

Package core assembly and fabrication methods

Glass core package substrates

Planarization methods for packaging substrates

Fluoropolymer stamp fabrication method

Package core assembly and fabrication methods

Package core assembly and fabrication methods

Methods of forming microvias with reduced diameter

Package structures with built-in EMI shielding

Fluoropolymer stamp fabrication method

Methods for improved polymer-copper adhesion

Methods of forming microvias with reduced diameter

Method for via formation by micro-imprinting

Package structure with embedded core

Method for via formation in flowable epoxy materials by micro-imprint

Patents Applicationslast 30 patents

GLASS CORE PACKAGE SUBSTRATES

INTEGRATING DEVICES INTO A CARRIER WAFER FOR THREE DIMENSIONALLY ST...

TESTING A SEMICONDUCTOR DIE USING TEMPORARY TEST PADS APPLIED TO CO...

GLASS CORE PACKAGE SUBSTRATES

FLUOROPOLYMER STAMP FABRICATION METHOD

Methods Of Forming Microvias With Reduced Diameter

METHOD FOR VIA FORMATION BY MICRO-IMPRINTING

PACKAGE STRUCTURES WITH BUILT-IN EMI SHIELDING

Methods for Improved Polymer-Copper Adhesion

Methods Of Forming Microvias With Reduced Diameter

FLUOROPOLYMER STAMP FABRICATION METHOD

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PACKAGE CORE ASSEMBLY AND FABRICATION METHODS

PLANARIZATION METHODS FOR PACKAGING SUBSTRATES

METHOD FOR VIA FORMATION BY MICRO-IMPRINTING