Chirag Suryakant Patel

Person

Peekekill, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon carrier space transformer and temporary chip attach burn-in...
- Patent number 9,159,616
- Issue date Oct 13, 2015
- International Business Machines Corporation
- Harvey Hamel
- G01 - MEASURING TESTING
Information Patent Grant
Silicon based optical vias
- Patent number 8,755,644
- Issue date Jun 17, 2014
- International Business Machines Corporation
- Russell A. Budd
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of making semiconductor device
- Patent number 8,405,226
- Issue date Mar 26, 2013
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming solder bump interconnects
- Patent number 8,328,156
- Issue date Dec 11, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon carrier space transformer and temporary chip attach burn-in...
- Patent number 8,310,259
- Issue date Nov 13, 2012
- International Business Machines Corporation
- Harvey Hamel
- G01 - MEASURING TESTING
Information Patent Grant
Silicon carrier structure and method of forming same
- Patent number 8,295,056
- Issue date Oct 23, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,290,008
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Semiconductor device and method of making semiconductor device
- Patent number 8,222,079
- Issue date Jul 17, 2012
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier substrate including capacitor and method for fabricati...
- Patent number 8,173,541
- Issue date May 8, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming solder bump interconnects
- Patent number 8,148,255
- Issue date Apr 3, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and method of making semiconductor device
- Patent number 8,143,726
- Issue date Mar 27, 2012
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and manufacture of silicon based package and devices manufac...
- Patent number 8,097,492
- Issue date Jan 17, 2012
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit chip module with microchannel cooling device hav...
- Patent number 7,948,077
- Issue date May 24, 2011
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module comprising memory and integrated circuit processo...
- Patent number 7,888,786
- Issue date Feb 15, 2011
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon based package
- Patent number 7,855,442
- Issue date Dec 21, 2010
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive through via structure and process for electronic device...
- Patent number 7,820,521
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Paul S. Andry
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Versatile Si-based packaging with integrated passive components for...
- Patent number 7,808,798
- Issue date Oct 5, 2010
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip carrier substrate capacitor and method for fabrication thereof
- Patent number 7,719,079
- Issue date May 18, 2010
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Versatile Si-based packaging with integrated passive components for...
- Patent number 7,518,229
- Issue date Apr 14, 2009
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip system architecture for performance enhancement, power reducti...
- Patent number 7,518,225
- Issue date Apr 14, 2009
- International Business Machines Corporation
- Philip G. Emma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive through via process for electronic device carriers
- Patent number 7,488,680
- Issue date Feb 10, 2009
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to create flexible connections for integrated circuits
- Patent number 7,456,046
- Issue date Nov 25, 2008
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Grant
Silicon based optical vias
- Patent number 7,352,066
- Issue date Apr 1, 2008
- International Business Machines Corporation
- Russell A. Budd
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Silicon chip carrier with conductive through-vias and method for fa...
- Patent number 7,276,787
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor integrated circuit chip packages having integrated mi...
- Patent number 7,230,334
- Issue date Jun 12, 2007
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture of silicon based package and devices manufact...
- Patent number 7,189,595
- Issue date Mar 13, 2007
- International Business Machines Corporation
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices having compliant wafer-level packages with pillars and meth...
- Patent number 7,132,736
- Issue date Nov 7, 2006
- Georgia Tech Research Corporation
- Muhannad S. Bakir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for thermal isolation, circuit cooling and ele...
- Patent number 7,033,927
- Issue date Apr 25, 2006
- International Business Machines Corporation
- Guy M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of semiconductor dies with micro-pins and structures pr...
- Patent number 6,972,243
- Issue date Dec 6, 2005
- International Business Machines Corporation
- Chirag S. Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Guided-wave optical interconnections embedded within a microelectro...
- Patent number 6,954,576
- Issue date Oct 11, 2005
- Georgia Tech Research Corporation
- Tony Mule′
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN...
- Publication number 20140235027
- Publication date Aug 21, 2014
- International Business Machines Corporation
- Harvey Hamel
- G01 - MEASURING TESTING
Information Patent Application
SILICON CARRIER STRUCTURE AND METHOD OF FORMING SAME
- Publication number 20120301977
- Publication date Nov 29, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN...
- Publication number 20120249173
- Publication date Oct 4, 2012
- HARVEY HAMEL
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE
- Publication number 20120248629
- Publication date Oct 4, 2012
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques for Forming Solder Bump Interconnects
- Publication number 20120138769
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20110044369
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
Silicon Carrier Structure and Method of Forming Same
- Publication number 20110019368
- Publication date Jan 27, 2011
- International Business Machines Corporation
- Paul Stephen Andry
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Silicon based optical vias
- Publication number 20100322551
- Publication date Dec 23, 2010
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE
- Publication number 20090309234
- Publication date Dec 17, 2009
- International Business Machines Corporation
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER SUBSTRATE INCLUDING CAPACITOR AND METHOD FOR FABRICATI...
- Publication number 20090301992
- Publication date Dec 10, 2009
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND MANUFACTURE OF SILICON BASED PACKAGE AND DEVICES MANUFAC...
- Publication number 20090174059
- Publication date Jul 9, 2009
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE THROUGH VIA STRUCTURE AND PROCESS FOR ELECTRONIC DEVICE...
- Publication number 20090120679
- Publication date May 14, 2009
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE
- Publication number 20090085217
- Publication date Apr 2, 2009
- John U. Knickerbocker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Techniques For Forming Solder Bump Interconnects
- Publication number 20090072392
- Publication date Mar 19, 2009
- International Business Machines Corporation
- Bing Dang
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS AND METHODS FOR COOLING SEMICONDUCTOR INTEGRATED CIRCUIT...
- Publication number 20080315403
- Publication date Dec 25, 2008
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
- Publication number 20080217778
- Publication date Sep 11, 2008
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Application
VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR...
- Publication number 20080186247
- Publication date Aug 7, 2008
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP CARRIER SUBSTRATE CAPACITOR AND METHOD FOR FABRICATION THEREOF
- Publication number 20080173993
- Publication date Jul 24, 2008
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Versatile Si-based packaging with integrated passive components for...
- Publication number 20080029886
- Publication date Feb 7, 2008
- International Business Machines Corporation
- John Michael Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS
- Publication number 20080029889
- Publication date Feb 7, 2008
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and Methods For Cooling Semiconductor Integrated Circuit...
- Publication number 20070210446
- Publication date Sep 13, 2007
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacture of silicon based package and devices manufact...
- Publication number 20070111385
- Publication date May 17, 2007
- John H. Magerlein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon based optical vias
- Publication number 20070085215
- Publication date Apr 19, 2007
- Russell A. Budd
- G02 - OPTICS
Information Patent Application
Conductive through via structure and process for electronic device...
- Publication number 20070048896
- Publication date Mar 1, 2007
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method to create flexible connections for integrated circuits
- Publication number 20060186540
- Publication date Aug 24, 2006
- International Business Machines Corporation
- Leena Paivikki Buchwalter
- G01 - MEASURING TESTING
Information Patent Application
Apparatus and methods for cooling semiconductor integrated circuit...
- Publication number 20060103011
- Publication date May 18, 2006
- International Business Machines Incorporated
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20060027934
- Publication date Feb 9, 2006
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for thermal isolation, circuit cooling and ele...
- Publication number 20050282381
- Publication date Dec 22, 2005
- Guy M. Cohen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon chip carrier with conductive through-vias and method for fa...
- Publication number 20050121768
- Publication date Jun 9, 2005
- International Business Machines Corporation
- Daniel Charles Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabrication of semiconductor dies with micro-pins and structures pr...
- Publication number 20050067685
- Publication date Mar 31, 2005
- Chirag S. Patel
- H01 - BASIC ELECTRIC ELEMENTS

Chirag Suryakant Patel

Person

Patents Grantslast 30 patents

Silicon carrier space transformer and temporary chip attach burn-in...

Silicon based optical vias

Semiconductor device and method of making semiconductor device

Techniques for forming solder bump interconnects

Silicon carrier space transformer and temporary chip attach burn-in...

Silicon carrier structure and method of forming same

Silicon carrier optoelectronic packaging

Semiconductor device and method of making semiconductor device

Chip carrier substrate including capacitor and method for fabricati...

Techniques for forming solder bump interconnects

Semiconductor device and method of making semiconductor device

Method and manufacture of silicon based package and devices manufac...

Integrated circuit chip module with microchannel cooling device hav...

Electronic module comprising memory and integrated circuit processo...

Silicon based package

Conductive through via structure and process for electronic device...

Versatile Si-based packaging with integrated passive components for...

Chip carrier substrate capacitor and method for fabrication thereof

Versatile Si-based packaging with integrated passive components for...

Chip system architecture for performance enhancement, power reducti...

Conductive through via process for electronic device carriers

Method to create flexible connections for integrated circuits

Silicon based optical vias

Silicon chip carrier with conductive through-vias and method for fa...

Semiconductor integrated circuit chip packages having integrated mi...

Method of manufacture of silicon based package and devices manufact...

Devices having compliant wafer-level packages with pillars and meth...

Apparatus and method for thermal isolation, circuit cooling and ele...

Fabrication of semiconductor dies with micro-pins and structures pr...

Guided-wave optical interconnections embedded within a microelectro...

Patents Applicationslast 30 patents

SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN...

SILICON CARRIER STRUCTURE AND METHOD OF FORMING SAME

SILICON CARRIER SPACE TRANSFORMER AND TEMPORARY CHIP ATTACH BURN-IN...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE

Techniques for Forming Solder Bump Interconnects

SILICON CARRIER OPTOELECTRONIC PACKAGING

Silicon Carrier Structure and Method of Forming Same

Silicon based optical vias

SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE

CHIP CARRIER SUBSTRATE INCLUDING CAPACITOR AND METHOD FOR FABRICATI...

METHOD AND MANUFACTURE OF SILICON BASED PACKAGE AND DEVICES MANUFAC...

CONDUCTIVE THROUGH VIA STRUCTURE AND PROCESS FOR ELECTRONIC DEVICE...

SEMICONDUCTOR DEVICE AND METHOD OF MAKING SEMICONDUCTOR DEVICE

Techniques For Forming Solder Bump Interconnects

APPARATUS AND METHODS FOR COOLING SEMICONDUCTOR INTEGRATED CIRCUIT...

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

VERSATILE Si-BASED PACKAGING WITH INTEGRATED PASSIVE COMPONENTS FOR...

CHIP CARRIER SUBSTRATE CAPACITOR AND METHOD FOR FABRICATION THEREOF

Versatile Si-based packaging with integrated passive components for...

METHOD TO CREATE FLEXIBLE CONNECTIONS FOR INTEGRATED CIRCUITS

Apparatus and Methods For Cooling Semiconductor Integrated Circuit...

Method of manufacture of silicon based package and devices manufact...

Silicon based optical vias

Conductive through via structure and process for electronic device...

Method to create flexible connections for integrated circuits

Apparatus and methods for cooling semiconductor integrated circuit...

Silicon chip carrier with conductive through-vias and method for fa...

Apparatus and method for thermal isolation, circuit cooling and ele...

Silicon chip carrier with conductive through-vias and method for fa...

Fabrication of semiconductor dies with micro-pins and structures pr...