Christian Val

Person

78470 St Remy les Chevreuse, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Process for producing a high-frequency-compatible electronic module
- Patent number 11,587,911
- Issue date Feb 21, 2023
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the wafer-scale fabrication of hermetic electronic modules
- Patent number 10,483,180
- Issue date Nov 19, 2019
- PACKAGING SIP
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of miniaturized chip on chip interconnection of a 3D electro...
- Patent number 10,332,863
- Issue date Jun 25, 2019
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D electronic module comprising a ball grid array stack
- Patent number 10,064,278
- Issue date Aug 28, 2018
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of collective fabrication of 3D electronic modules configure...
- Patent number 9,899,250
- Issue date Feb 20, 2018
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing reconstituted wafers with support of the chips...
- Patent number 9,111,688
- Issue date Aug 18, 2015
- 3D Plus
- Christian Val
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Method for positioning chips during the production of a reconstitut...
- Patent number 8,735,220
- Issue date May 27, 2014
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for collective fabrication of 3D electronic modules comprisi...
- Patent number 8,716,036
- Issue date May 6, 2014
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for the vertical interconnection of 3D electronic modules b...
- Patent number 8,567,051
- Issue date Oct 29, 2013
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for positioning chips during the production of a reconstitut...
- Patent number 8,546,190
- Issue date Oct 1, 2013
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for the wafer-scale fabrication of electronic modules for s...
- Patent number 8,359,740
- Issue date Jan 29, 2013
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
3D electronic module
- Patent number 8,264,853
- Issue date Sep 11, 2012
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low-thickness electronic module comprising a stack of electronic pa...
- Patent number 8,243,468
- Issue date Aug 14, 2012
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of interconnecting electronic wafers
- Patent number 8,136,237
- Issue date Mar 20, 2012
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for the collective fabrication of 3D electronic modules
- Patent number 7,951,649
- Issue date May 31, 2011
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Process for the collective fabrication of 3D electronic modules
- Patent number 7,877,874
- Issue date Feb 1, 2011
- 3D Plus
- Christian Val
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for the interconnection of active and passive components and...
- Patent number 7,635,639
- Issue date Dec 22, 2009
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with integrated heat distributor
- Patent number 7,476,965
- Issue date Jan 13, 2009
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for interconnecting, in three dimensions, electronic components
- Patent number 6,809,367
- Issue date Oct 26, 2004
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Three dimensional interconnection method and electronic device obta...
- Patent number 6,716,672
- Issue date Apr 6, 2004
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the manufacturing of a semiconductor device which compri...
- Patent number 6,307,261
- Issue date Oct 23, 2001
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the 3D interconnection of packages of electronic compone...
- Patent number 5,885,850
- Issue date Mar 23, 1999
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and device for interconnecting integrated circuits in three...
- Patent number 5,847,448
- Issue date Dec 8, 1998
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for the 3D interconnection of packages of electronic compone...
- Patent number 5,640,760
- Issue date Jun 24, 1997
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for interconnecting semiconductor chips in three dimensions,...
- Patent number 5,637,536
- Issue date Jun 10, 1997
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D interconnection process for electronic component packages and re...
- Patent number 5,526,230
- Issue date Jun 11, 1996
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and device for hermetic encapsulation of electronic components
- Patent number 5,461,545
- Issue date Oct 24, 1995
- Thomson-CSF
- Michel Leroy
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Device for the 3D encapsulation of semiconductor chips
- Patent number 5,400,218
- Issue date Mar 21, 1995
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing coaxial connections for an electronic component...
- Patent number 5,323,533
- Issue date Jun 28, 1994
- Thomson-CSF
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electric potential distribution device and an electronic component...
- Patent number 5,237,204
- Issue date Aug 17, 1993
- Compagnie d'Informatique Militaire Spatiale et Aeronautique
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR PRODUCING A HIGH-FREQUENCY-COMPATIBLE ELECTRONIC MODULE
- Publication number 20210335755
- Publication date Oct 28, 2021
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHA...
- Publication number 20210040620
- Publication date Feb 11, 2021
- 3D PLUS
- Christian VAL
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD OF MINIATURIZED CHIP ON CHIP INTERCONNECTION OF A 3D ELECTRO...
- Publication number 20190103380
- Publication date Apr 4, 2019
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE WAFER-SCALE FABRICATION OF HERMETIC ELECTRONIC MODULES
- Publication number 20180182683
- Publication date Jun 28, 2018
- PACKAGING SIP
- Christian VAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CHIP DEVICE WITH IMPROVED THERMAL RESISTANCE AND ASSOCIA...
- Publication number 20180061731
- Publication date Mar 1, 2018
- 3D PLUS
- Christian VAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES CONFIGURE...
- Publication number 20170372935
- Publication date Dec 28, 2017
- 3D PLUS
- Christian VAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D ELECTRONIC MODULE COMPRISING A BALL GRID ARRAY STACK
- Publication number 20160381799
- Publication date Dec 29, 2016
- 3D PLUS
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS...
- Publication number 20140349008
- Publication date Nov 27, 2014
- 3D PLUS
- Christian Val
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
Method for Collective Fabrication of 3D Electronic Modules Comprisi...
- Publication number 20130171752
- Publication date Jul 4, 2013
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Positioning Chips During the Production of a Reconstitut...
- Publication number 20120094439
- Publication date Apr 19, 2012
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUT...
- Publication number 20110312132
- Publication date Dec 22, 2011
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE WAFER-SCALE FABRICATION OF ELECTRONIC MODULES FOR S...
- Publication number 20110247210
- Publication date Oct 13, 2011
- 3D PLUS
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF INTERCONNECTING ELECTRONIC WAFERS
- Publication number 20100276081
- Publication date Nov 4, 2010
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE VERTICAL INTERCONNECTION OF 3D ELECTRONIC MODULES B...
- Publication number 20090260228
- Publication date Oct 22, 2009
- 3D Plus
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR THE COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES
- Publication number 20090209052
- Publication date Aug 20, 2009
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D Electronic Module
- Publication number 20080316727
- Publication date Dec 25, 2008
- 3D Plus
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Process for the Collective Fabrication of 3D Electronic Modules
- Publication number 20080289174
- Publication date Nov 27, 2008
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low-Thickness Electronic Module Comprising a Stack of Electronic Pa...
- Publication number 20080170374
- Publication date Jul 17, 2008
- 3D PLUS
- Christian Val
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Electronic Device with Integrated Heat Distributor
- Publication number 20070262443
- Publication date Nov 15, 2007
- 3D PLUS
- Christian Val
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for interconnecting active and passive components, and a res...
- Publication number 20070117369
- Publication date May 24, 2007
- 3D PLUS
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for distributed shielding and/or bypass for electronic devic...
- Publication number 20030173673
- Publication date Sep 18, 2003
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three dimensionals interconnection method and electronic device obt...
- Publication number 20030013231
- Publication date Jan 16, 2003
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and device for interconnecting, electronic components in thr...
- Publication number 20020191380
- Publication date Dec 19, 2002
- Christian Val
- H01 - BASIC ELECTRIC ELEMENTS

Christian Val

Person

Patents Grantslast 30 patents

Process for producing a high-frequency-compatible electronic module

Process for the wafer-scale fabrication of hermetic electronic modules

Method of miniaturized chip on chip interconnection of a 3D electro...

3D electronic module comprising a ball grid array stack

Method of collective fabrication of 3D electronic modules configure...

Method for producing reconstituted wafers with support of the chips...

Method for positioning chips during the production of a reconstitut...

Method for collective fabrication of 3D electronic modules comprisi...

Process for the vertical interconnection of 3D electronic modules b...

Method for positioning chips during the production of a reconstitut...

Process for the wafer-scale fabrication of electronic modules for s...

3D electronic module

Low-thickness electronic module comprising a stack of electronic pa...

Method of interconnecting electronic wafers

Process for the collective fabrication of 3D electronic modules

Process for the collective fabrication of 3D electronic modules

Method for the interconnection of active and passive components and...

Electronic device with integrated heat distributor

Device for interconnecting, in three dimensions, electronic components

Three dimensional interconnection method and electronic device obta...

Method for the manufacturing of a semiconductor device which compri...

Method for the 3D interconnection of packages of electronic compone...

Method and device for interconnecting integrated circuits in three...

Method for the 3D interconnection of packages of electronic compone...

Method for interconnecting semiconductor chips in three dimensions,...

3D interconnection process for electronic component packages and re...

Process and device for hermetic encapsulation of electronic components

Device for the 3D encapsulation of semiconductor chips

Method of producing coaxial connections for an electronic component...

Electric potential distribution device and an electronic component...

Patents Applicationslast 30 patents

PROCESS FOR PRODUCING A HIGH-FREQUENCY-COMPATIBLE ELECTRONIC MODULE

PROCESS FOR METALLIZING HOLES OF AN ELECTRONIC MODULE BY LIQUID-PHA...

METHOD OF MINIATURIZED CHIP ON CHIP INTERCONNECTION OF A 3D ELECTRO...

PROCESS FOR THE WAFER-SCALE FABRICATION OF HERMETIC ELECTRONIC MODULES

ELECTRONIC CHIP DEVICE WITH IMPROVED THERMAL RESISTANCE AND ASSOCIA...

METHOD OF COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES CONFIGURE...

3D ELECTRONIC MODULE COMPRISING A BALL GRID ARRAY STACK

METHOD FOR PRODUCING RECONSTITUTED WAFERS WITH SUPPORT OF THE CHIPS...

Method for Collective Fabrication of 3D Electronic Modules Comprisi...

Method for Positioning Chips During the Production of a Reconstitut...

METHOD FOR POSITIONING CHIPS DURING THE PRODUCTION OF A RECONSTITUT...

PROCESS FOR THE WAFER-SCALE FABRICATION OF ELECTRONIC MODULES FOR S...

METHOD OF INTERCONNECTING ELECTRONIC WAFERS

PROCESS FOR THE VERTICAL INTERCONNECTION OF 3D ELECTRONIC MODULES B...

PROCESS FOR THE COLLECTIVE FABRICATION OF 3D ELECTRONIC MODULES

3D Electronic Module

Process for the Collective Fabrication of 3D Electronic Modules

Low-Thickness Electronic Module Comprising a Stack of Electronic Pa...

Electronic Device with Integrated Heat Distributor

Method for interconnecting active and passive components, and a res...

Method for distributed shielding and/or bypass for electronic devic...

Three dimensionals interconnection method and electronic device obt...

Method and device for interconnecting, electronic components in thr...