Christian Witt

Person

Woodbridge, CT, US

People

Patents Grantslast 30 patents

Information Patent Grant
High-electron-mobility transistors with inactive gate blocks
- Patent number 12,199,177
- Issue date Jan 14, 2025
- GLOBALFOUNDRIES U.S. Inc.
- Abhinay Sandupatla
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnects formed by a metal displacement reaction
- Patent number 10,580,696
- Issue date Mar 3, 2020
- GLOBALFOUNDRIES Inc.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soluble self aligned barrier layer for interconnect structure
- Patent number 10,224,284
- Issue date Mar 5, 2019
- GLOBALFOUNDRIES Inc.
- Christian A. Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessing of liner and conductor for via formation
- Patent number 10,109,524
- Issue date Oct 23, 2018
- GLOBALFOUNDRIES Inc.
- Christian A. Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming air gaps in metallization layers on integrated c...
- Patent number 9,768,058
- Issue date Sep 19, 2017
- GLOBALFOUNDRIES Inc.
- Zhiguo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a metal cap layer on copper-based conductive str...
- Patent number 9,236,299
- Issue date Jan 12, 2016
- GLOBALFOUNDRIES Inc.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integration of pore stuffing material
- Patent number 9,054,052
- Issue date Jun 9, 2015
- Global Foundries Inc.
- Nicholas Vincent Licausi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of self-forming barrier integration with pore stuffed ULK m...
- Patent number 8,932,934
- Issue date Jan 13, 2015
- Global Foundries Inc.
- Moosung M. Chae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MOSFET integrated circuit having doped conductive interconnects and...
- Patent number 8,580,665
- Issue date Nov 12, 2013
- GLOBALFOUNDRIES, INC.
- Christian Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming copper interconnects for semiconductor devices
- Patent number 7,696,093
- Issue date Apr 13, 2010
- Advanced Micro Devices, Inc.
- Christian A. Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,615,491
- Issue date Nov 10, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,987
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,611,988
- Issue date Nov 3, 2009
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Defectivity and process control of electroless deposition in microe...
- Patent number 7,410,899
- Issue date Aug 12, 2008
- Enthone, Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,393,781
- Issue date Jul 1, 2008
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cobalt and nickel electroless plating in microelectronic devices
- Patent number 7,332,193
- Issue date Feb 19, 2008
- Enthone, Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Capping of metal interconnects in integrated circuit electronic dev...
- Patent number 7,268,074
- Issue date Sep 11, 2007
- Enthone, Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECTS FORMED BY A METAL DISPLACEMENT REACTION
- Publication number 20200066585
- Publication date Feb 27, 2020
- GLOBALFOUNDRIES INC.
- Sean Xuan Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECESSING OF LINER AND CONDUCTOR FOR VIA FORMATION
- Publication number 20180211873
- Publication date Jul 26, 2018
- GLOBALFOUNDRIES INC.
- Christian A. Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING AIR GAPS IN METALLIZATION LAYERS ON INTEGRATED C...
- Publication number 20170047242
- Publication date Feb 16, 2017
- GLOBALFOUNDRIES INC.
- Zhiguo Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLAYER BALLISTIC CONDUCTOR SIGNAL LINES
- Publication number 20160104670
- Publication date Apr 14, 2016
- GLOBALFOUNDRIES Inc.
- Roderick A. Augur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CAPACITANCE BALLISTIC CONDUCTOR SIGNAL LINES
- Publication number 20160104672
- Publication date Apr 14, 2016
- GLOBALFOUNDRIES INC.
- Roderick A. Augur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING A METAL CAP LAYER ON COPPER-BASED CONDUCTIVE STR...
- Publication number 20150255339
- Publication date Sep 10, 2015
- GLOBALFOUNDRIES INC.
- Xunyuan Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SEMICONDUCTOR CONTAMINANT REMOVAL USING SUPERCRITICAL FLUID
- Publication number 20140353805
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Errol Todd RYAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL
- Publication number 20140353802
- Publication date Dec 4, 2014
- GLOBALFOUNDRIES INC.
- Nicholas Vincent LICAUSI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF SELF-FORMING BARRIER INTEGRATION WITH PORE STUFFED ULK M...
- Publication number 20140353835
- Publication date Dec 4, 2014
- Moosung M. CHAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING GRAPHENE LINERS AND/OR CAP LAYERS ON COPPER-BASE...
- Publication number 20140145332
- Publication date May 29, 2014
- GLOBALFOUNDRIES INC.
- Errol T. Ryan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOSFET INTEGRATED CIRCUIT HAVING DOPED CONDUCTIVE INTERCONNECTS AND...
- Publication number 20130089980
- Publication date Apr 11, 2013
- GLOBALFOUNDRIES INC.
- Christian Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING THIN METAL FILMS
- Publication number 20110281431
- Publication date Nov 17, 2011
- GLOBALFOUNDRIES INC.
- Christian A. WITT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR FORMING COPPER INTERCONNECTS FOR SEMICONDUCTOR DEVICES
- Publication number 20100041230
- Publication date Feb 18, 2010
- Advanced Micro Devices, Inc.
- Christian A. Witt
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...
- Publication number 20070298609
- Publication date Dec 27, 2007
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper electrodeposition in microelectronics
- Publication number 20070178697
- Publication date Aug 2, 2007
- Enthone Inc.
- Vincent Paneccasio
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066057
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066059
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070062408
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Defectivity and process control of electroless deposition in microe...
- Publication number 20070066058
- Publication date Mar 22, 2007
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt electroless plating in microelectronic devices
- Publication number 20060280860
- Publication date Dec 14, 2006
- Enthone Inc.
- Vincent Paneccasio
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt self-initiated electroless via fill for stacked memory cells
- Publication number 20060188659
- Publication date Aug 24, 2006
- Enthone Inc.
- Qingyun Chen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cobalt and nickel electroless plating in microelectronic devices
- Publication number 20060083850
- Publication date Apr 20, 2006
- Enthone Inc.
- Charles Valverde
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Capping of metal interconnects in integrated circuit electronic dev...
- Publication number 20050275100
- Publication date Dec 15, 2005
- Enthone Inc.
- Eric Yakobson
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Christian Witt

Person

Patents Grantslast 30 patents

High-electron-mobility transistors with inactive gate blocks

Interconnects formed by a metal displacement reaction

Soluble self aligned barrier layer for interconnect structure

Recessing of liner and conductor for via formation

Methods of forming air gaps in metallization layers on integrated c...

Methods of forming a metal cap layer on copper-based conductive str...

Methods for integration of pore stuffing material

Methods of self-forming barrier integration with pore stuffed ULK m...

MOSFET integrated circuit having doped conductive interconnects and...

Methods for forming copper interconnects for semiconductor devices

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Capping of metal interconnects in integrated circuit electronic dev...

Cobalt and nickel electroless plating in microelectronic devices

Capping of metal interconnects in integrated circuit electronic dev...

Patents Applicationslast 30 patents

INTERCONNECTS FORMED BY A METAL DISPLACEMENT REACTION

RECESSING OF LINER AND CONDUCTOR FOR VIA FORMATION

METHODS OF FORMING AIR GAPS IN METALLIZATION LAYERS ON INTEGRATED C...

INTERLAYER BALLISTIC CONDUCTOR SIGNAL LINES

LOW CAPACITANCE BALLISTIC CONDUCTOR SIGNAL LINES

METHODS OF FORMING A METAL CAP LAYER ON COPPER-BASED CONDUCTIVE STR...

METHODS OF SEMICONDUCTOR CONTAMINANT REMOVAL USING SUPERCRITICAL FLUID

METHODS FOR INTEGRATION OF PORE STUFFING MATERIAL

METHODS OF SELF-FORMING BARRIER INTEGRATION WITH PORE STUFFED ULK M...

METHODS OF FORMING GRAPHENE LINERS AND/OR CAP LAYERS ON COPPER-BASE...

MOSFET INTEGRATED CIRCUIT HAVING DOPED CONDUCTIVE INTERCONNECTS AND...

METHOD OF PATTERNING THIN METAL FILMS

METHODS FOR FORMING COPPER INTERCONNECTS FOR SEMICONDUCTOR DEVICES

CAPPING OF METAL INTERCONNECTS IN INTEGRATED CIRCUIT ELECTRONIC DEV...

Copper electrodeposition in microelectronics

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Defectivity and process control of electroless deposition in microe...

Cobalt electroless plating in microelectronic devices

Cobalt self-initiated electroless via fill for stacked memory cells

Cobalt and nickel electroless plating in microelectronic devices

Capping of metal interconnects in integrated circuit electronic dev...