Christopher James Kapusta

Person

Delanson, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor system and method
- Patent number 11,982,645
- Issue date May 14, 2024
- General Electric Company
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Grant
Liquid-cooled assembly and method
- Patent number 11,950,394
- Issue date Apr 2, 2024
- GE Aviation Systems LLC
- Brian Magann Rush
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mechanical punched via formation in electronics package and electro...
- Patent number 11,824,030
- Issue date Nov 21, 2023
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor system and method
- Patent number 11,630,086
- Issue date Apr 18, 2023
- General Electric Company
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Grant
Power overlay module and method of assembling
- Patent number 11,551,993
- Issue date Jan 10, 2023
- GE Aviation Systems LLC
- David Richard Esler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
High voltage semiconductor devices having improved electric field s...
- Patent number 11,538,769
- Issue date Dec 27, 2022
- General Electric Company
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for hybrid glass and organic packaging for radi...
- Patent number 11,503,704
- Issue date Nov 15, 2022
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for piston rod monitoring
- Patent number 11,499,545
- Issue date Nov 15, 2022
- General Electric Company
- Joseph Alfred Iannotti
- F04 - POSITIVE DISPLACEMENT MACHINES FOR LIQUIDS PUMPS FOR LIQUIDS OR ELASTIC...
Information Patent Grant
Mechanical punched via formation in electronics package and electro...
- Patent number 11,398,445
- Issue date Jul 26, 2022
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable electronic package and method of fabricating same
- Patent number 11,309,304
- Issue date Apr 19, 2022
- General Electric Company
- James Sabatini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor system and method
- Patent number 11,079,359
- Issue date Aug 3, 2021
- General Electric Company
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Grant
Electronics package for light emitting semiconductor devices and me...
- Patent number 10,957,832
- Issue date Mar 23, 2021
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package including integrated electromagnetic interferen...
- Patent number 10,892,231
- Issue date Jan 12, 2021
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating high voltage semiconductor devices having im...
- Patent number 10,892,237
- Issue date Jan 12, 2021
- General Electric Company
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,804,115
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,804,116
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Non-magnetic package and method of manufacture
- Patent number 10,804,174
- Issue date Oct 13, 2020
- General Electric Company
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
True time delay beam former module and method of making the same
- Patent number 10,784,576
- Issue date Sep 22, 2020
- General Electric Company
- Joseph Alfred Iannotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low inductance stackable solid-state switching module and method of...
- Patent number 10,770,382
- Issue date Sep 8, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded dry film battery module and method of manufacturing thereof
- Patent number 10,660,208
- Issue date May 19, 2020
- General Electric Company
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor system and method
- Patent number 10,605,785
- Issue date Mar 31, 2020
- General Electric Company
- Joseph Iannotti
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics package with integrated interconnect structure and meth...
- Patent number 10,541,153
- Issue date Jan 21, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package including integrated electromagnetic interferen...
- Patent number 10,541,209
- Issue date Jan 21, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable electronic package and method of fabricating same
- Patent number RE47651
- Issue date Oct 15, 2019
- General Electric Company
- James Sabatini
Information Patent Grant
Systems and methods for quartz wafer bonding
- Patent number 10,432,168
- Issue date Oct 1, 2019
- General Electric Company
- Christopher James Kapusta
- G01 - MEASURING TESTING
Information Patent Grant
Non-magnetic package and method of manufacture
- Patent number 10,431,509
- Issue date Oct 1, 2019
- General Electric Company
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Embedded RF filter package structure and method of manufacturing th...
- Patent number 10,333,493
- Issue date Jun 25, 2019
- General Electric Company
- Kaustubh Ravindra Nagarkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of manufacturing an electronics package using device-last or...
- Patent number 10,332,832
- Issue date Jun 25, 2019
- General Electric Company
- Christopher James Kapusta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for making a seam-sealable non-magnetic lid and package
- Patent number 10,208,382
- Issue date Feb 19, 2019
- General Electric Company
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC CONNECTION ASSEMBLY
- Publication number 20230420901
- Publication date Dec 28, 2023
- GE AVIATION SYSTEMS LLC
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM AND METHOD
- Publication number 20230273160
- Publication date Aug 31, 2023
- GENERAL ELECTRIC COMPANY
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Application
LIQUID-COOLED ASSEMBLY AND METHOD
- Publication number 20230114057
- Publication date Apr 13, 2023
- GE AVIATION SYSTEMS LLC
- Brian Magann Rush
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRO...
- Publication number 20220302063
- Publication date Sep 22, 2022
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY MODULE AND METHOD OF ASSEMBLING
- Publication number 20220070996
- Publication date Mar 3, 2022
- GE AVIATION SYSTEMS LLC
- David Richard Esler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRO...
- Publication number 20210375813
- Publication date Dec 2, 2021
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM AND METHOD
- Publication number 20210325348
- Publication date Oct 21, 2021
- GENERAL ELECTRIC COMPANY
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR HYBRID GLASS AND ORGANIC PACKAGING FOR RADI...
- Publication number 20210204397
- Publication date Jul 1, 2021
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT
- Publication number 20210104812
- Publication date Apr 8, 2021
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR PISTON ROD MONITORING
- Publication number 20210017979
- Publication date Jan 21, 2021
- GENERAL ELECTRIC COMPANY
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Application
SYSTEMS AND METHODS FOR SAW WAFER LEVEL ASSEMBLY WITH TOP SIDE CONT...
- Publication number 20210013866
- Publication date Jan 14, 2021
- GENERAL ELECTRIC COMPANY
- Joseph Alfred Iannotti
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HIGH VOLTAGE SEMICONDUCTOR DEVICES HAVING IMPROVED ELECTRIC FIELD U...
- Publication number 20200194387
- Publication date Jun 18, 2020
- GENERAL ELECTRIC COMPANY
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING HIGH VOLTAGE SEMICONDUCTOR DEVICES HAVING IM...
- Publication number 20200194388
- Publication date Jun 18, 2020
- GENERAL ELECTRIC COMPANY
- Stephen Daley Arthur
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW INDUCTANCE STACKABLE SOLID-STATE SWITCHING MODULE AND METHOD OF...
- Publication number 20200176360
- Publication date Jun 4, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM AND METHOD
- Publication number 20200124573
- Publication date Apr 23, 2020
- GENERAL ELECTRIC COMPANY
- Joseph Alfred Iannotti
- G01 - MEASURING TESTING
Information Patent Application
ELECTRONICS PACKAGE FOR LIGHT EMITTING SEMICONDUCTOR DEVICES AND ME...
- Publication number 20200127178
- Publication date Apr 23, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...
- Publication number 20200066544
- Publication date Feb 27, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...
- Publication number 20200066652
- Publication date Feb 27, 2020
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AN...
- Publication number 20190148279
- Publication date May 16, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRUE TIME DELAY BEAM FORMER MODULE AND METHOD OF MAKING THE SAME
- Publication number 20190115658
- Publication date Apr 18, 2019
- GENERAL ELECTRIC COMPANY
- Joseph Alfred Iannotti
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NON-MAGNETIC PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20190103331
- Publication date Apr 4, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED STRUCTURE WITH BACKSIDE FU...
- Publication number 20190043794
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...
- Publication number 20190043733
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...
- Publication number 20190043810
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...
- Publication number 20190043734
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING AN ELECTRONICS PACKAGE USING DEVICE-LAST OR...
- Publication number 20190043802
- Publication date Feb 7, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR SYSTEM AND METHOD
- Publication number 20180356368
- Publication date Dec 13, 2018
- GENERAL ELECTRIC COMPANY
- Joseph Iannotti
- G01 - MEASURING TESTING
Information Patent Application
STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME
- Publication number 20180240789
- Publication date Aug 23, 2018
- GENERAL ELECTRIC COMPANY
- James Sabatini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED RF FILTER PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...
- Publication number 20180062618
- Publication date Mar 1, 2018
- GENERAL ELECTRIC COMPANY
- Kaustubh Ravindra Nagarkar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
EMBEDDED DRY FILM BATTERY MODULE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180020548
- Publication date Jan 18, 2018
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS

Christopher James Kapusta

Person

Patents Grantslast 30 patents

Sensor system and method

Liquid-cooled assembly and method

Mechanical punched via formation in electronics package and electro...

Sensor system and method

Power overlay module and method of assembling

High voltage semiconductor devices having improved electric field s...

Systems and methods for hybrid glass and organic packaging for radi...

Systems and methods for piston rod monitoring

Mechanical punched via formation in electronics package and electro...

Stackable electronic package and method of fabricating same

Sensor system and method

Electronics package for light emitting semiconductor devices and me...

Electronics package including integrated electromagnetic interferen...

Methods of fabricating high voltage semiconductor devices having im...

Electronics package with integrated interconnect structure and meth...

Electronics package with integrated interconnect structure and meth...

Non-magnetic package and method of manufacture

True time delay beam former module and method of making the same

Low inductance stackable solid-state switching module and method of...

Embedded dry film battery module and method of manufacturing thereof

Electronics package having a self-aligning interconnect assembly an...

Sensor system and method

Electronics package with integrated interconnect structure and meth...

Electronics package including integrated electromagnetic interferen...

Stackable electronic package and method of fabricating same

Systems and methods for quartz wafer bonding

Non-magnetic package and method of manufacture

Embedded RF filter package structure and method of manufacturing th...

Method of manufacturing an electronics package using device-last or...

Method for making a seam-sealable non-magnetic lid and package

Patents Applicationslast 30 patents

ELECTRONIC CONNECTION ASSEMBLY

SENSOR SYSTEM AND METHOD

LIQUID-COOLED ASSEMBLY AND METHOD

MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRO...

POWER OVERLAY MODULE AND METHOD OF ASSEMBLING

MECHANICAL PUNCHED VIA FORMATION IN ELECTRONICS PACKAGE AND ELECTRO...

SENSOR SYSTEM AND METHOD

SYSTEMS AND METHODS FOR HYBRID GLASS AND ORGANIC PACKAGING FOR RADI...

SYSTEMS AND METHODS FOR ANTENNA PACKAGING FOR A WIRELESS ACCESS POINT

SYSTEMS AND METHODS FOR PISTON ROD MONITORING

SYSTEMS AND METHODS FOR SAW WAFER LEVEL ASSEMBLY WITH TOP SIDE CONT...

HIGH VOLTAGE SEMICONDUCTOR DEVICES HAVING IMPROVED ELECTRIC FIELD U...

METHODS OF FABRICATING HIGH VOLTAGE SEMICONDUCTOR DEVICES HAVING IM...

LOW INDUCTANCE STACKABLE SOLID-STATE SWITCHING MODULE AND METHOD OF...

SENSOR SYSTEM AND METHOD

ELECTRONICS PACKAGE FOR LIGHT EMITTING SEMICONDUCTOR DEVICES AND ME...

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...

ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...

ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AN...

TRUE TIME DELAY BEAM FORMER MODULE AND METHOD OF MAKING THE SAME

NON-MAGNETIC PACKAGE AND METHOD OF MANUFACTURE

ELECTRONICS PACKAGE INCLUDING INTEGRATED STRUCTURE WITH BACKSIDE FU...

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...

ELECTRONICS PACKAGE INCLUDING INTEGRATED ELECTROMAGNETIC INTERFEREN...

ELECTRONICS PACKAGE WITH INTEGRATED INTERCONNECT STRUCTURE AND METH...

METHOD OF MANUFACTURING AN ELECTRONICS PACKAGE USING DEVICE-LAST OR...

SENSOR SYSTEM AND METHOD

STACKABLE ELECTRONIC PACKAGE AND METHOD OF FABRICATING SAME

EMBEDDED RF FILTER PACKAGE STRUCTURE AND METHOD OF MANUFACTURING TH...

EMBEDDED DRY FILM BATTERY MODULE AND METHOD OF MANUFACTURING THEREOF