Christopher Parks

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Contact using multilayer liner
- Patent number 10,483,205
- Issue date Nov 19, 2019
- GLOBALFOUNDRIES Inc.
- Donghun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact using multilayer liner
- Patent number 9,960,118
- Issue date May 1, 2018
- GLOBALFOUNDRIES Inc.
- Donghun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and its formation
- Patent number 9,589,894
- Issue date Mar 7, 2017
- International Business Machines Corporation
- Daniel Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect structure and its formation
- Patent number 8,969,197
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Scaling of metal gate with aluminum containing metal layer for thre...
- Patent number 8,901,674
- Issue date Dec 2, 2014
- International Business Machines Corporation
- Keith Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to create a buried plate in embedded dynamic random acces...
- Patent number 8,563,446
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Ashima B. Chakravarti
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method to prevent surface decomposition of III-V compound semicondu...
- Patent number 8,431,476
- Issue date Apr 30, 2013
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent surface decomposition of III-V compound semicondu...
- Patent number 8,415,772
- Issue date Apr 9, 2013
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to prevent surface decomposition of III-V compound semicondu...
- Patent number 8,273,649
- Issue date Sep 25, 2012
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique to create a buried plate in embedded dynamic random acces...
- Patent number 8,236,710
- Issue date Aug 7, 2012
- International Business Machines Corporation
- Ashima B. Chakravarti
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method and structure of integrated rhodium contacts with copper int...
- Patent number 7,843,067
- Issue date Nov 30, 2010
- International Business Machines Corporation
- John M. Cotte
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Formation of oxidation-resistant seed layer for interconnect applic...
- Patent number 7,585,765
- Issue date Sep 8, 2009
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Formation of oxidation-resistant seed layer for interconnect applic...
- Patent number 7,276,796
- Issue date Oct 2, 2007
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroplated copper interconnection structure, process for making...
- Patent number 7,227,265
- Issue date Jun 5, 2007
- International Business Machines Corporation
- Panayotis C. Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trench isolation employing a doped oxide trench fill
- Patent number 6,890,833
- Issue date May 10, 2005
- Infineon Technologies AG
- Michael Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas treatment of thin film structures with catalytic action
- Patent number 6,815,343
- Issue date Nov 9, 2004
- International Business Machines Corporation
- John D. Baniecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical thermal nitride mask (anti-collar) and processing thereof
- Patent number 6,797,582
- Issue date Sep 28, 2004
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for removing dopant ions from a substrate
- Patent number 6,764,551
- Issue date Jul 20, 2004
- International Business Machines Corporation
- David B. Riggs
- B08 - CLEANING
Information Patent Grant
Method for forming electromigration-resistant structures by doping
- Patent number 6,589,874
- Issue date Jul 8, 2003
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant copper microstructure
- Patent number 6,572,982
- Issue date Jun 3, 2003
- International Business Machines Corporation
- Cyprian E. Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Doped structures containing diffusion barriers
- Patent number 6,399,434
- Issue date Jun 4, 2002
- International Business Machines Corporation
- Susan E. Chaloux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clean method for recessed conductive barriers
- Patent number 6,358,855
- Issue date Mar 19, 2002
- Infineon Technologies AG
- Ravikumar Ramachandran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of depositing a multilayer thin film by means of magnetron s...
- Patent number 6,342,131
- Issue date Jan 29, 2002
- Kabushiki Kaisha Toshiba
- Viraj Y. Sardesai
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming electromigration-resistant structures by doping
- Patent number 6,268,291
- Issue date Jul 31, 2001
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench cell capacitor with inverting counter electrode
- Patent number 6,265,278
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Johann Alsmeier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Quantum conductive recrystallization barrier layers
- Patent number 6,194,736
- Issue date Feb 27, 2001
- International Business Machines Corporation
- Susan E. Chaloux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration-resistant copper microstructure and process of making
- Patent number 6,123,825
- Issue date Sep 26, 2000
- International Business Machines Corporation
- Cyprian E. Uzoh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Titanium polycide stabilization with a porous barrier
- Patent number 6,057,220
- Issue date May 2, 2000
- International Business Machines Corporation
- Atul C. Ajmera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a dopant outdiffusion control structure including...
- Patent number 5,998,253
- Issue date Dec 7, 1999
- Siemens Aktiengesellschaft
- Stephen K. Loh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming field effect transistors having different thresh...
- Patent number 5,907,777
- Issue date May 25, 1999
- International Business Machines Corporation
- Thomas W. Joseph
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CONTACT USING MULTILAYER LINER
- Publication number 20180182711
- Publication date Jun 28, 2018
- GLOBALFOUNDRIES INC.
- Donghun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT USING MULTILAYER LINER
- Publication number 20170207175
- Publication date Jul 20, 2017
- GLOBALFOUNDRIES INC.
- Donghun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
- Publication number 20140210089
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Daniel Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER INTERCONNECT STRUCTURE AND ITS FORMATION
- Publication number 20130307150
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Daniel C. Edelstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PREVENT SURFACE DECOMPOSITION OF III-V COMPOUND SEMICONDU...
- Publication number 20120309153
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PREVENT SURFACE DECOMPOSITION OF III-V COMPOUND SEMICONDU...
- Publication number 20120305989
- Publication date Dec 6, 2012
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...
- Publication number 20120228736
- Publication date Sep 13, 2012
- International Business Machines Corporation
- ASHIMA B. CHAKRAVARTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...
- Publication number 20120086103
- Publication date Apr 12, 2012
- International Business Machines Corporation
- ASHIMA B. CHAKRAVARTI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD TO PREVENT SURFACE DECOMPOSITION OF III-V COMPOUND SEMICONDU...
- Publication number 20100123205
- Publication date May 20, 2010
- International Business Machines Corporation
- Joel P. de Souza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND STRUCTURE OF INTEGRATED RHODIUM CONTACTS WITH COPPER INT...
- Publication number 20090239062
- Publication date Sep 24, 2009
- John M. Cotte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...
- Publication number 20070275557
- Publication date Nov 29, 2007
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...
- Publication number 20070216031
- Publication date Sep 20, 2007
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROLESS COBALT-CONTAINING LINER FOR MIDDLE-OF-THE-LINE (MOL) AP...
- Publication number 20070210448
- Publication date Sep 13, 2007
- International Business Machines Corporation
- Keith Kwong Hon Wong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESS FOR REMOVING DOPANT IONS FROM A SUBSTRATE
- Publication number 20040194813
- Publication date Oct 7, 2004
- David B. Riggs
- B08 - CLEANING
Information Patent Application
Trench isolation employing a doped oxide trench fill
- Publication number 20040192009
- Publication date Sep 30, 2004
- Infineon Technologies North America Corp.
- Michael Belyansky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178078
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Electroplated copper interconnection structure, process for making...
- Publication number 20040178077
- Publication date Sep 16, 2004
- International Business Machines Corporation
- Panayotis C. Andricacos
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Gas treatment of thin film structures with catalytic action
- Publication number 20040126939
- Publication date Jul 1, 2004
- John D. Baniecki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical thermal nitride mask (anti-collar) and processing thereof
- Publication number 20030203587
- Publication date Oct 30, 2003
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A 3-D MICROELECTRONIC STRUCTURE INCLUDING A VERTICAL THERMAL NITRID...
- Publication number 20030107111
- Publication date Jun 12, 2003
- International Business Machines Corporation
- Oleg Gluschenkov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for removing dopant ions from a substrate
- Publication number 20030066542
- Publication date Apr 10, 2003
- International Business Machines Corporation
- David B. Riggs
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming electromigration-resistant structures by doping
- Publication number 20020115292
- Publication date Aug 22, 2002
- International Business Machines Corporation
- Panayotis Constantinou Andricacos
- H01 - BASIC ELECTRIC ELEMENTS

Christopher Parks

Person

Patents Grantslast 30 patents

Contact using multilayer liner

Contact using multilayer liner

Copper interconnect structure and its formation

Copper interconnect structure and its formation

Scaling of metal gate with aluminum containing metal layer for thre...

Technique to create a buried plate in embedded dynamic random acces...

Method to prevent surface decomposition of III-V compound semicondu...

Method to prevent surface decomposition of III-V compound semicondu...

Method to prevent surface decomposition of III-V compound semicondu...

Technique to create a buried plate in embedded dynamic random acces...

Method and structure of integrated rhodium contacts with copper int...

Formation of oxidation-resistant seed layer for interconnect applic...

Formation of oxidation-resistant seed layer for interconnect applic...

Electroplated copper interconnection structure, process for making...

Trench isolation employing a doped oxide trench fill

Gas treatment of thin film structures with catalytic action

Vertical thermal nitride mask (anti-collar) and processing thereof

Process for removing dopant ions from a substrate

Method for forming electromigration-resistant structures by doping

Electromigration-resistant copper microstructure

Doped structures containing diffusion barriers

Clean method for recessed conductive barriers

Method of depositing a multilayer thin film by means of magnetron s...

Method for forming electromigration-resistant structures by doping

Deep trench cell capacitor with inverting counter electrode

Quantum conductive recrystallization barrier layers

Electromigration-resistant copper microstructure and process of making

Titanium polycide stabilization with a porous barrier

Method of forming a dopant outdiffusion control structure including...

Method for forming field effect transistors having different thresh...

Patents Applicationslast 30 patents

CONTACT USING MULTILAYER LINER

CONTACT USING MULTILAYER LINER

COPPER INTERCONNECT STRUCTURE AND ITS FORMATION

COPPER INTERCONNECT STRUCTURE AND ITS FORMATION

METHOD TO PREVENT SURFACE DECOMPOSITION OF III-V COMPOUND SEMICONDU...

METHOD TO PREVENT SURFACE DECOMPOSITION OF III-V COMPOUND SEMICONDU...

TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...

TECHNIQUE TO CREATE A BURIED PLATE IN EMBEDDED DYNAMIC RANDOM ACCES...

METHOD TO PREVENT SURFACE DECOMPOSITION OF III-V COMPOUND SEMICONDU...

METHOD AND STRUCTURE OF INTEGRATED RHODIUM CONTACTS WITH COPPER INT...

FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...

FORMATION OF OXIDATION-RESISTANT SEED LAYER FOR INTERCONNECT APPLIC...

ELECTROLESS COBALT-CONTAINING LINER FOR MIDDLE-OF-THE-LINE (MOL) AP...

PROCESS FOR REMOVING DOPANT IONS FROM A SUBSTRATE

Trench isolation employing a doped oxide trench fill

Electroplated copper interconnection structure, process for making...

Electroplated copper interconnection structure, process for making...

Gas treatment of thin film structures with catalytic action

Vertical thermal nitride mask (anti-collar) and processing thereof

A 3-D MICROELECTRONIC STRUCTURE INCLUDING A VERTICAL THERMAL NITRID...

Process for removing dopant ions from a substrate

Method for forming electromigration-resistant structures by doping