Chun-Hsien Li

Person

Hsin-Yin, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Dynamic random access memory with adhesion layer and method of manu...
- Patent number 11,690,217
- Issue date Jun 27, 2023
- Winbond Electronics Corp.
- Shou-Chi Tsai
Information Patent Grant
Semiconductor connection structure and method for manufacturing the...
- Patent number 11,468,920
- Issue date Oct 11, 2022
- Winbond Electronics Corp.
- Chun-Lin Li
- G11 - INFORMATION STORAGE
Information Patent Grant
Flexure stage with modularized flexure units
- Patent number 11,183,951
- Issue date Nov 23, 2021
- HIWIN MTKROSYSTEM CORP.
- Chun-Hsiang Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package on package structure and fabrication method thereof
- Patent number 9,362,217
- Issue date Jun 7, 2016
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package having electrical conne...
- Patent number 9,177,837
- Issue date Nov 3, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating leadframe-based semiconductor package with c...
- Patent number 9,130,064
- Issue date Sep 8, 2015
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,981,575
- Issue date Mar 17, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure
- Patent number 8,873,244
- Issue date Oct 28, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,716,861
- Issue date May 6, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe-based semiconductor package
- Patent number 8,618,641
- Issue date Dec 31, 2013
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure
- Patent number 8,421,199
- Issue date Apr 16, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Semiconductor package having electrical connecting structures and f...
- Patent number 8,390,118
- Issue date Mar 5, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication method of semiconductor package structure
- Patent number 8,304,268
- Issue date Nov 6, 2012
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Package structure fabrication method
- Patent number 7,934,313
- Issue date May 3, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Carrier-free semiconductor package and fabrication method thereof
- Patent number 7,314,820
- Issue date Jan 1, 2008
- Siliconware Precision Industries Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ground-enhanced semiconductor package and lead frame for the same
- Patent number 7,230,323
- Issue date Jun 12, 2007
- Siliconware Precision Industries Co., Ltd.
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire-bonding method and semiconductor package using the same
- Patent number 7,126,229
- Issue date Oct 24, 2006
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation-sensitive resin composition for spacer
- Patent number 6,680,158
- Issue date Jan 20, 2004
- Chi Mei Corporation
- Chun-Hsien Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Developer solution and edge bead remover composition
- Patent number 6,503,694
- Issue date Jan 7, 2003
- Chi Mei Corporation
- Chun-Hsien Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Hand operated bicycle gear transmission device
- Patent number 6,467,368
- Issue date Oct 22, 2002
- National Science Council of Republic of China
- Chan-Hua Feng
- B62 - LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
- Publication number 20230024465
- Publication date Jan 26, 2023
- WINBOND ELECTRONICS CORP.
- Chun-Lin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME
- Publication number 20230009397
- Publication date Jan 12, 2023
- WINBOND ELECTRONICS CORP.
- Shou-Chi Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE...
- Publication number 20220254381
- Publication date Aug 11, 2022
- WINBOND ELECTRONICS CORP.
- Chun-Lin LI
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220246625
- Publication date Aug 4, 2022
- WINBOND ELECTRONICS CORP.
- Chun-Lin LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXURE STAGE
- Publication number 20200252008
- Publication date Aug 6, 2020
- HIWIN MIKROSYSTEM CORP.
- Chun-Hsiang LI
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
FLEXURE STAGE
- Publication number 20200246924
- Publication date Aug 6, 2020
- HIWIN MIKROSYSTEM CORP.
- Chun-Hsiang LI
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SHOWER HEAD
- Publication number 20190143347
- Publication date May 16, 2019
- Globe Union Industrial Corp.
- Chun-Hung LI
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF
- Publication number 20150091150
- Publication date Apr 2, 2015
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...
- Publication number 20140206146
- Publication date Jul 24, 2014
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE
- Publication number 20140080264
- Publication date Mar 20, 2014
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20130200508
- Publication date Aug 8, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20130161802
- Publication date Jun 27, 2013
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...
- Publication number 20110156252
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20110159643
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE
- Publication number 20110156227
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE
- Publication number 20110157851
- Publication date Jun 30, 2011
- Siliconware Precision Industries Co., Ltd.
- Pang-Chun Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20090039488
- Publication date Feb 12, 2009
- Siliconware Precision Industries Co., Ltd.
- Chang-Yueh Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package and method for fabricating the same
- Publication number 20080303134
- Publication date Dec 11, 2008
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Method of manufacturing quad flat non-leaded semiconductor package
- Publication number 20070059863
- Publication date Mar 15, 2007
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20070007669
- Publication date Jan 11, 2007
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead-frame-based semiconductor package and lead frame thereof
- Publication number 20060151862
- Publication date Jul 13, 2006
- SILICONWARE PRECISON INDUSTRIES CO., LTD.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Carrier-free semiconductor package and fabrication method thereof
- Publication number 20060121647
- Publication date Jun 8, 2006
- Siliconware Precision Industries Co., Ltd.
- Yu-Wei Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wire-bonding method and semiconductor package using the same
- Publication number 20050173791
- Publication date Aug 11, 2005
- Siliconware Precision Industries Co., Ltd.
- Chin-Teng Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ground-enhanced semiconductor package and lead frame for the same
- Publication number 20040238921
- Publication date Dec 2, 2004
- Silicon Precision Industries Co., Ltd
- Yi-Shiung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe-based non-leaded semiconductor package and method of fabr...
- Publication number 20040217450
- Publication date Nov 4, 2004
- Siliconware Precision Industries Co., Ltd.
- Chun-Yuan Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation-sensitive resin composition for spacer
- Publication number 20030036018
- Publication date Feb 20, 2003
- Chun-Hsien Li
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Chun-Hsien Li

Person

Patents Grantslast 30 patents

Dynamic random access memory with adhesion layer and method of manu...

Semiconductor connection structure and method for manufacturing the...

Flexure stage with modularized flexure units

Package on package structure and fabrication method thereof

Fabrication method of semiconductor package having electrical conne...

Method for fabricating leadframe-based semiconductor package with c...

Semiconductor package structure

Package structure

Semiconductor package having electrical connecting structures and f...

Leadframe-based semiconductor package

Semiconductor package structure

Semiconductor package having electrical connecting structures and f...

Fabrication method of semiconductor package structure

Package structure fabrication method

Carrier-free semiconductor package and fabrication method thereof

Ground-enhanced semiconductor package and lead frame for the same

Wire-bonding method and semiconductor package using the same

Radiation-sensitive resin composition for spacer

Developer solution and edge bead remover composition

Hand operated bicycle gear transmission device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME

DYNAMIC RANDOM ACCESS MEMORY AND METHOD OF MANUFACTURING THE SAME

SEMICONDUCTOR CONNECTION STRUCTURE AND METHOD FOR MANUFACTURING THE...

MEMORY DEVICE AND METHOD FOR MANUFACTURING THE SAME

FLEXURE STAGE

FLEXURE STAGE

SHOWER HEAD

PACKAGE ON PACKAGE STRUCTURE AND FABRICATION METHOD THEREOF

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNE...

METHOD FOR FABRICATING LEADFRAME-BASED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

SEMICONDUCTOR PACKAGE HAVING ELECTRICAL CONNECTING STRUCTURES AND F...

FABRICATION METHOD OF SEMICONDUCTOR PACKAGE STRUCTURE

SEMICONDUCTOR PACKAGE STRUCTURE

PACKAGE STRUCTURE

Semiconductor package and method for fabricating the same

Semiconductor package and method for fabricating the same

Method of manufacturing quad flat non-leaded semiconductor package

Wire-bonding method and semiconductor package using the same

Lead-frame-based semiconductor package and lead frame thereof

Carrier-free semiconductor package and fabrication method thereof

Wire-bonding method and semiconductor package using the same

Ground-enhanced semiconductor package and lead frame for the same

Leadframe-based non-leaded semiconductor package and method of fabr...

Radiation-sensitive resin composition for spacer