Chung Hsien Hsin

Person

Hsinchu Hsien, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Sensor package structure
- Patent number 11,309,275
- Issue date Apr 19, 2022
- KINGPAK TECHNOLOGY INC.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,720,370
- Issue date Jul 21, 2020
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,692,917
- Issue date Jun 23, 2020
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package base core and sensor package structure
- Patent number 10,600,829
- Issue date Mar 24, 2020
- KINGPAK TECHNOLOGY INC.
- Chung-Hsin Hsin
- G01 - MEASURING TESTING
Information Patent Grant
Sensor package structure
- Patent number 10,600,830
- Issue date Mar 24, 2020
- KINGPAK TECHNOLOGY INC.
- Jian-Ru Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,411,055
- Issue date Sep 10, 2019
- KINGPAK TECHNOLOGY INC.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,236,313
- Issue date Mar 19, 2019
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 10,186,538
- Issue date Jan 22, 2019
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical package structure
- Patent number 10,170,508
- Issue date Jan 1, 2019
- KINGPAK TECHNOLOGY INC.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor package structure
- Patent number 9,905,597
- Issue date Feb 27, 2018
- KINGPAK TECHNOLOGY INC.
- Jo-Wei Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of optical unit during manufacture of imag...
- Patent number 9,184,331
- Issue date Nov 10, 2015
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with black encapsulant
- Patent number 8,928,104
- Issue date Jan 6, 2015
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with casing including a vent without...
- Patent number 8,847,146
- Issue date Sep 30, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor packaging structure and manufacturing meth...
- Patent number 8,828,777
- Issue date Sep 9, 2014
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level image sensor packaging structure and manufacturing meth...
- Patent number 8,563,350
- Issue date Oct 22, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of molded image sensor packaging structure wit...
- Patent number 8,481,343
- Issue date Jul 9, 2013
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing tilt of transparent window during manufacturing...
- Patent number 8,450,137
- Issue date May 28, 2013
- Kingpak Technology Inc.
- Chun-Hua Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure for wafer level image sensor mod...
- Patent number 8,440,488
- Issue date May 14, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor packaging structure with predetermined focal length
- Patent number 8,441,086
- Issue date May 14, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure with large air cavity
- Patent number 8,390,087
- Issue date Mar 5, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method and structure of a wafer level image sensor mo...
- Patent number 8,378,441
- Issue date Feb 19, 2013
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate structure for an image sensor package and method for manu...
- Patent number 8,314,481
- Issue date Nov 20, 2012
- Kingpak Technology Inc.
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method for molding image sensor package structure and...
- Patent number 8,093,674
- Issue date Jan 10, 2012
- Kingpak Technology, Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor structure and integrated lens module thereof
- Patent number 8,004,602
- Issue date Aug 23, 2011
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module package structure with supporting element
- Patent number 7,598,580
- Issue date Oct 6, 2009
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module with air escape hole and a method for manufactu...
- Patent number 7,554,599
- Issue date Jun 30, 2009
- Kingpak Technology, Inc.
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Image sensor module structure with lens holder having vertical inne...
- Patent number 7,511,261
- Issue date Mar 31, 2009
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor and method for manufacturing the same
- Patent number 7,440,263
- Issue date Oct 21, 2008
- Kingpak Technology Inc.
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor module with a protection layer and a method for manufa...
- Patent number 7,423,334
- Issue date Sep 9, 2008
- Kingpak Technology Inc.
- Hsiu Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package structure
- Patent number 7,402,839
- Issue date Jul 22, 2008
- Kingpak Technology Inc.
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20210398934
- Publication date Dec 23, 2021
- Kingpak Technology Inc.
- CHUNG-HSIEN HSIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190355639
- Publication date Nov 21, 2019
- Kingpak Technology Inc.
- JIAN-RU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190074310
- Publication date Mar 7, 2019
- Kingpak Technology Inc.
- CHUN-HUA CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190057992
- Publication date Feb 21, 2019
- Kingpak Technology Inc.
- JIAN-RU CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20190019834
- Publication date Jan 17, 2019
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE BASE CORE AND SENSOR PACKAGE STRUCTURE
- Publication number 20180068912
- Publication date Mar 8, 2018
- Kingpak Technology Inc.
- CHUNG-HSIEN HSIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20180019274
- Publication date Jan 18, 2018
- Kingpak Technology Inc.
- JO-WEI YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20180012920
- Publication date Jan 11, 2018
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SENSOR PACKAGE STRUCTURE
- Publication number 20180012919
- Publication date Jan 11, 2018
- Kingpak Technology Inc.
- HSIU-WEN TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL PACKAGE STRUCTURE
- Publication number 20170365632
- Publication date Dec 21, 2017
- Kingpak Technology Inc.
- Hsiu Wen TU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...
- Publication number 20130149805
- Publication date Jun 13, 2013
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING...
- Publication number 20120220065
- Publication date Aug 30, 2012
- KINGPAK TECHNOLOGY INC.
- Chun-Hua CHUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...
- Publication number 20120068288
- Publication date Mar 22, 2012
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20110291215
- Publication date Dec 1, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MOD...
- Publication number 20110279815
- Publication date Nov 17, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...
- Publication number 20110241147
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...
- Publication number 20110241146
- Publication date Oct 6, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT
- Publication number 20110156188
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH
- Publication number 20110156187
- Publication date Jun 30, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...
- Publication number 20110024861
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY
- Publication number 20110024862
- Publication date Feb 3, 2011
- KINGPAK TECHNOLOGY INC.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE STRUCTURE
- Publication number 20110024610
- Publication date Feb 3, 2011
- Kingpak Technology Inc.
- Hsiu-Wen Tu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor structure and integrated lens module thereof
- Publication number 20090283809
- Publication date Nov 19, 2009
- Kingpak Technology Inc.
- Chung-Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20090045476
- Publication date Feb 19, 2009
- KINGPAK TECHNOLOGY INC.
- Chen Pin PENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20080067334
- Publication date Mar 20, 2008
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package
- Publication number 20080036025
- Publication date Feb 14, 2008
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure and method for manufacturing the same
- Publication number 20070241272
- Publication date Oct 18, 2007
- Jason Chuang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor package structure
- Publication number 20070215972
- Publication date Sep 20, 2007
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Structure of stacked integrated circuits and method for manufacturi...
- Publication number 20070210434
- Publication date Sep 13, 2007
- Chung Hsien Hsin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image sensor module with air escape hole and a method for manufactu...
- Publication number 20070206109
- Publication date Sep 6, 2007
- Hsiu wen Tu
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Chung Hsien Hsin

Person

Patents Grantslast 30 patents

Sensor package structure

Sensor package structure

Sensor package structure

Package base core and sensor package structure

Sensor package structure

Sensor package structure

Sensor package structure

Sensor package structure

Optical package structure

Sensor package structure

Method for reducing tilt of optical unit during manufacture of imag...

Image sensor packaging structure with black encapsulant

Image sensor package structure with casing including a vent without...

Wafer level image sensor packaging structure and manufacturing meth...

Wafer level image sensor packaging structure and manufacturing meth...

Manufacturing method of molded image sensor packaging structure wit...

Method for reducing tilt of transparent window during manufacturing...

Manufacturing method and structure for wafer level image sensor mod...

Image sensor packaging structure with predetermined focal length

Image sensor package structure with large air cavity

Manufacturing method and structure of a wafer level image sensor mo...

Substrate structure for an image sensor package and method for manu...

Manufacturing method for molding image sensor package structure and...

Image sensor structure and integrated lens module thereof

Image sensor module package structure with supporting element

Image sensor module with air escape hole and a method for manufactu...

Image sensor module structure with lens holder having vertical inne...

Image sensor and method for manufacturing the same

Image sensor module with a protection layer and a method for manufa...

Image sensor package structure

Patents Applicationslast 30 patents

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

PACKAGE BASE CORE AND SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

SENSOR PACKAGE STRUCTURE

OPTICAL PACKAGE STRUCTURE

METHOD FOR REDUCING TILT OF OPTICAL UNIT DURING MANUFACTURE OF IMAG...

METHOD FOR REDUCING TILT OF TRANSPARENT WINDOW DURING MANUFACTURING...

MANUFACTURING METHOD OF MOLDED IMAGE SENSOR PACKAGING STRUCTURE WIT...

WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...

MANUFACTURING METHOD AND STRUCTURE FOR WAFER LEVEL IMAGE SENSOR MOD...

WAFER LEVEL IMAGE SENSOR PACKAGING STRUCTURE AND MANUFACTURING METH...

MANUFACTURING METHOD AND STRUCTURE OF A WAFER LEVEL IMAGE SENSOR MO...

IMAGE SENSOR PACKAGING STRUCTURE WITH LOW TRANSMITTANCE ENCAPSULANT

IMAGE SENSOR PACKAGING STRUCTURE WITH PREDETERMINED FOCAL LENGTH

MANUFACTURING METHOD FOR MOLDING IMAGE SENSOR PACKAGE STRUCTURE AND...

IMAGE SENSOR PACKAGE STRUCTURE WITH LARGE AIR CAVITY

IMAGE SENSOR PACKAGE STRUCTURE

Image sensor structure and integrated lens module thereof

IMAGE SENSOR PACKAGE AND METHOD FOR FORMING THE SAME

Image sensor package structure and method for manufacturing the same

Image sensor package

Image sensor package structure and method for manufacturing the same

Image sensor package structure

Structure of stacked integrated circuits and method for manufacturi...

Image sensor module with air escape hole and a method for manufactu...