Chung-Hsiung Ho

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Packaged component with composite pin structure and manufacturing m...
- Patent number 12,224,228
- Issue date Feb 11, 2025
- PANJIT INTERNATIONAL INC.
- Yung-Hui Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor package unit of surface mount technology includ...
- Patent number 12,148,675
- Issue date Nov 19, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing side wettable package
- Patent number 11,916,030
- Issue date Feb 27, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor package having a conductiv...
- Patent number 11,848,254
- Issue date Dec 19, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package element
- Patent number 11,664,345
- Issue date May 30, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package structure and fabricating method of the same
- Patent number 11,594,425
- Issue date Feb 28, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a conductive pad with an anchor flange
- Patent number 11,562,947
- Issue date Jan 24, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Side wettable package
- Patent number 11,387,203
- Issue date Jul 12, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-scale package device
- Patent number 11,049,781
- Issue date Jun 29, 2021
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with conductive film shielding
- Patent number 10,825,781
- Issue date Nov 3, 2020
- NXP B.V.
- Chia Hao Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solderless inter-component joints
- Patent number 10,390,440
- Issue date Aug 20, 2019
- NXP B.V.
- Tsung Nan Lo
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wafer table chuck having a particle recess
- Patent number 10,310,390
- Issue date Jun 4, 2019
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Yung-Hsiang Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
IC packaging method and a packaged IC device
- Patent number 10,211,071
- Issue date Feb 19, 2019
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-via redistribution layer for integrated circuits having solde...
- Patent number 10,192,837
- Issue date Jan 29, 2019
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits and methods therefor
- Patent number 10,177,021
- Issue date Jan 8, 2019
- NXP B.V.
- Chung Hsiung Ho
- G01 - MEASURING TESTING
Information Patent Grant
Wafer level package with EMI shielding
- Patent number 10,008,454
- Issue date Jun 26, 2018
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer-level chip scale package with side protection
- Patent number 9,892,989
- Issue date Feb 13, 2018
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20250056902
- Publication date Feb 13, 2025
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE WITH EMBEDDED TRACES
- Publication number 20240387350
- Publication date Nov 21, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SU...
- Publication number 20240355716
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE
- Publication number 20240355703
- Publication date Oct 24, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIVERSAL PROBE CARD AND TESTING METHOD
- Publication number 20240310412
- Publication date Sep 19, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS
- Publication number 20240290668
- Publication date Aug 29, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION
- Publication number 20240274484
- Publication date Aug 15, 2024
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF
- Publication number 20240128185
- Publication date Apr 18, 2024
- PANJIT INTERNATIONAL INC.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...
- Publication number 20240120241
- Publication date Apr 11, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE SUCTION ASSISTANCE DEVICE
- Publication number 20240112943
- Publication date Apr 4, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL CHIP SCALE PACKAGE UNIT
- Publication number 20240030155
- Publication date Jan 25, 2024
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS
- Publication number 20230402515
- Publication date Dec 14, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL
- Publication number 20230395465
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGING UNIT
- Publication number 20230395469
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE DEVICE PREVENTING SOLDER OVERFLOW
- Publication number 20230395553
- Publication date Dec 7, 2023
- PANJIT INTERNATIONAL INC.
- CHUNG-HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING M...
- Publication number 20230326833
- Publication date Oct 12, 2023
- PANJIT INTERNATIONAL INC.
- Yung-Hui WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE ELEMENT
- Publication number 20220406750
- Publication date Dec 22, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING METHOD FOR WAFER LEVEL SEMICONDUCTOR PACKAGE DEVICE AND...
- Publication number 20220406620
- Publication date Dec 22, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Semiconductor Package Unit of Surface Mount Technology and Ma...
- Publication number 20220344228
- Publication date Oct 27, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SIDE WETTABLE PACKAGE
- Publication number 20220246561
- Publication date Aug 4, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20220157707
- Publication date May 19, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIV...
- Publication number 20220122904
- Publication date Apr 21, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDE WETTABLE PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220077086
- Publication date Mar 10, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20220005749
- Publication date Jan 6, 2022
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATING METHOD OF THE SAME
- Publication number 20210225662
- Publication date Jul 22, 2021
- PANJIT INTERNATIONAL INC.
- Chung-Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH CONDUCTIVE FILM SHIELDING
- Publication number 20200043862
- Publication date Feb 6, 2020
- NXP B.V.
- Chia Hao Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDERLESS INTER-COMPONENT JOINTS
- Publication number 20190239361
- Publication date Aug 1, 2019
- NXP B.V.
- Tsung Nan Lo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE AND METHOD OF ASSEMBLING SAME
- Publication number 20190088504
- Publication date Mar 21, 2019
- NXP B.V.
- CHUNG HSIUNG HO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER TABLE CHUCK HAVING A PARTICLE RECESS
- Publication number 20190049849
- Publication date Feb 14, 2019
- Taiwan Semiconductor Manufacturing Co., LTD
- Yung-Hsiang Chen
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
IC PACKAGING METHOD AND A PACKAGED IC DEVICE
- Publication number 20170221728
- Publication date Aug 3, 2017
- NXP B.V.
- Chung Hsiung Ho
- H01 - BASIC ELECTRIC ELEMENTS

Chung-Hsiung Ho

Person

Patents Grantslast 30 patents

Packaged component with composite pin structure and manufacturing m...

Power semiconductor package unit of surface mount technology includ...

Method for manufacturing side wettable package

Method for manufacturing a semiconductor package having a conductiv...

Semiconductor package element

Semiconductor package structure and fabricating method of the same

Semiconductor package having a conductive pad with an anchor flange

Side wettable package

Chip-scale package device

Semiconductor device with conductive film shielding

Solderless inter-component joints

Wafer table chuck having a particle recess

IC packaging method and a packaged IC device

Multi-via redistribution layer for integrated circuits having solde...

Integrated circuits and methods therefor

Wafer level package with EMI shielding

Wafer-level chip scale package with side protection

Patents Applicationslast 30 patents

SOLAR CELL MODULE AND METHOD FOR MANUFACTURING THE SAME

PACKAGE WITH EMBEDDED TRACES

SIDE-WETTABLE SEMICONDUCTOR PACKAGE DEVICE WITH HEAT DISSIPATION SU...

HEAT DISSIPATIVE SEMICONDUCTOR PACKAGE

UNIVERSAL PROBE CARD AND TESTING METHOD

SEMICONDUCTOR DEVICE WITHOUT RESISTANCE TRIMMING PADS

WAFER-LEVEL-PACKAGE DEVICE WITH PERIPHERAL SIDE WALL PROTECTION

SEMICONDUCTOR DEVICE AND PRE-FORMING ADAPTOR THEREOF

PACKAGING DEVICE CAPABLE OF DETECTING RISK OF IMPACT OF ELECTROSTAT...

DIE SUCTION ASSISTANCE DEVICE

WAFER LEVEL CHIP SCALE PACKAGE UNIT

METAL OXIDE SEMICONDUCTOR WITH MULTIPLE DRAIN VIAS

SEMICONDUCTOR PACKAGE WITH SOLDERABLE SIDEWALL

THIN SEMICONDUCTOR PACKAGING UNIT

PACKAGE DEVICE PREVENTING SOLDER OVERFLOW

PACKAGED COMPONENT WITH COMPOSITE PIN STRUCTURE AND MANUFACTURING M...

SEMICONDUCTOR PACKAGE ELEMENT

FABRICATING METHOD FOR WAFER LEVEL SEMICONDUCTOR PACKAGE DEVICE AND...

Power Semiconductor Package Unit of Surface Mount Technology and Ma...

METHOD FOR MANUFACTURING SIDE WETTABLE PACKAGE

THIN SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE HAVING A CONDUCTIV...

SIDE WETTABLE PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME

SEMICONDUCTOR PACKAGE STRUCTURE AND FABRICATING METHOD OF THE SAME

SEMICONDUCTOR DEVICE WITH CONDUCTIVE FILM SHIELDING

SOLDERLESS INTER-COMPONENT JOINTS

WAFER LEVEL PACKAGE AND METHOD OF ASSEMBLING SAME

WAFER TABLE CHUCK HAVING A PARTICLE RECESS

IC PACKAGING METHOD AND A PACKAGED IC DEVICE