Cong Zhang

Person

Shanghai, CN

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 12,051,660
- Issue date Jul 30, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including a suspended reinforcing layer and me...
- Patent number 12,033,958
- Issue date Jul 9, 2024
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Printed circuit board with stacked passive components
- Patent number 12,022,618
- Issue date Jun 25, 2024
- Western Digital Technologies, Inc.
- Chien Te Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device package with exposed bond wires
- Patent number 11,942,459
- Issue date Mar 26, 2024
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tombstone prevention for a surface mount device
- Patent number 11,917,761
- Issue date Feb 27, 2024
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for improving overlay metrology accuracy of self-aligned mul...
- Patent number 11,762,303
- Issue date Sep 19, 2023
- Shanghai Huali Integrated Circuit Corporation
- Yuyang Bian
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device including vertical wire bonds
- Patent number 11,749,647
- Issue date Sep 5, 2023
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having thermally conductive layers for...
- Patent number 11,488,883
- Issue date Nov 1, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated electronic element module, semiconductor package, and me...
- Patent number 11,456,279
- Issue date Sep 27, 2022
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic illumination method based on scan exposure machine
- Patent number 11,422,474
- Issue date Aug 23, 2022
- Shanghai Huali Integrated Circuit Corporation
- Yuyang Bian
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device including vertically stacked semiconductor dies
- Patent number 11,302,673
- Issue date Apr 12, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High capacity semiconductor device including bifurcated memory module
- Patent number 11,276,669
- Issue date Mar 15, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-module integrated interposer and semiconductor device formed...
- Patent number 11,257,785
- Issue date Feb 22, 2022
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond pad design for compact stacked-die package
- Patent number 11,189,582
- Issue date Nov 30, 2021
- WESTERN DIGITAL TECHNOLOGIES. INC.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including contact fingers on opposed surfaces
- Patent number 11,139,277
- Issue date Oct 5, 2021
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including through vias in molded columns
- Patent number 10,872,856
- Issue date Dec 22, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan out semiconductor device including a plurality of semiconductor...
- Patent number 10,177,119
- Issue date Jan 8, 2019
- SanDisk Information Technology (Shanghai) Co., Ltd.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE
- Publication number 20240304515
- Publication date Sep 12, 2024
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Concept for Providing Access to Remote Memory
- Publication number 20240289286
- Publication date Aug 29, 2024
- Intel Corporation
- Zhonghua SUN
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...
- Publication number 20240120317
- Publication date Apr 11, 2024
- Western Digital Technologies, Inc.
- Cheng-Hsiung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BIFACIAL SEMICONDUCTOR WAFER
- Publication number 20240063092
- Publication date Feb 22, 2024
- Western Digital Technologies, Inc.
- Sara Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laser Cutting With Electron Removal
- Publication number 20230411179
- Publication date Dec 21, 2023
- Western Digital Technologies, Inc.
- Cong ZHANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES
- Publication number 20230395438
- Publication date Dec 7, 2023
- Western Digital Technologies, Inc.
- Nagesh Vodrahalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA HANDLING FOR A RADIO ACCESS NETWORK CONTROLLER
- Publication number 20230379682
- Publication date Nov 23, 2023
- Intel Corporation
- Tingjie Chen
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE
- Publication number 20230284388
- Publication date Sep 7, 2023
- Western Digital Technologies, Inc.
- Joyce Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Device Package with Exposed Bond Wires
- Publication number 20230260975
- Publication date Aug 17, 2023
- Western Digital Technologies, Inc.
- Hua Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...
- Publication number 20230170312
- Publication date Jun 1, 2023
- Western Digital Technologies, Inc.
- Yangming Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Improving Overlay Metrology Accuracy of Self-Aligned Mul...
- Publication number 20230096180
- Publication date Mar 30, 2023
- Shanghai Huali Integrated Circuit Corporation
- Yuyang Bian
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
PRINTED CIRCUIT BOARD WITH STACKED PASSIVE COMPONENTS
- Publication number 20220346234
- Publication date Oct 27, 2022
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...
- Publication number 20220328374
- Publication date Oct 13, 2022
- Western Digital Technologies, Inc.
- Yazhou Zhang
- G11 - INFORMATION STORAGE
Information Patent Application
WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE
- Publication number 20220052002
- Publication date Feb 17, 2022
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS
- Publication number 20210366875
- Publication date Nov 25, 2021
- Western Digital Technologies, Inc.
- Xiaofeng Di
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE
- Publication number 20210151399
- Publication date May 20, 2021
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED ELECTRONIC ELEMENT MODULE, SEMICONDUCTOR PACKAGE, AND ME...
- Publication number 20210043602
- Publication date Feb 11, 2021
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE
- Publication number 20200411480
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING CONTACT FINGERS ON OPPOSED SURFACES
- Publication number 20200411478
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Chien Te Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING VERTICALLY STACKED SEMICONDUCTOR DIES
- Publication number 20200411481
- Publication date Dec 31, 2020
- Western Digital Technologies, Inc.
- Xuyi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-MODULE INTEGRATED INTERPOSER AND SEMICONDUCTOR DEVICE FORMED...
- Publication number 20200365554
- Publication date Nov 19, 2020
- Western Digital Technologies, Inc.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS IN MOLDED COLUMNS
- Publication number 20200006221
- Publication date Jan 2, 2020
- Western Digital Technologies, Inc.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY
- Publication number 20190189591
- Publication date Jun 20, 2019
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Yazhou Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...
- Publication number 20180019228
- Publication date Jan 18, 2018
- SANDISK INFORMATION TECHNOLOGY (SHANGHAI) CO., LTD.
- Cong Zhang
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wire bond pad design for compact stacked-die package

Semiconductor device including a suspended reinforcing layer and me...

Printed circuit board with stacked passive components

Semiconductor device package with exposed bond wires

Tombstone prevention for a surface mount device

Method for improving overlay metrology accuracy of self-aligned mul...

Semiconductor device including vertical wire bonds

Semiconductor device package having thermally conductive layers for...

Integrated electronic element module, semiconductor package, and me...

Dynamic illumination method based on scan exposure machine

Semiconductor device including vertically stacked semiconductor dies

High capacity semiconductor device including bifurcated memory module

Multi-module integrated interposer and semiconductor device formed...

Wire bond pad design for compact stacked-die package

Semiconductor device including contact fingers on opposed surfaces

Semiconductor device including through vias in molded columns

Fan out semiconductor device including a plurality of semiconductor...

Patents Applicationslast 30 patents

HIGH THERMAL DISSIPATION FEATURES FOR A FLIP CHIP STRUCTURE

A Concept for Providing Access to Remote Memory

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY INTERCONNECTED SEMICONDUC...

BIFACIAL SEMICONDUCTOR WAFER

Laser Cutting With Electron Removal

SEMICONDUCTOR DEVICE INCLUDING SELECT DIES OF KNOWN THICKNESSES

DATA HANDLING FOR A RADIO ACCESS NETWORK CONTROLLER

TOMBSTONE PREVENTION FOR A SURFACE MOUNT DEVICE

Semiconductor Device Package with Exposed Bond Wires

SEMICONDUCTOR DEVICE INCLUDING A SUSPENDED REINFORCING LAYER AND ME...

Method for Improving Overlay Metrology Accuracy of Self-Aligned Mul...

PRINTED CIRCUIT BOARD WITH STACKED PASSIVE COMPONENTS

SEMICONDUCTOR DEVICE PACKAGE HAVING THERMALLY CONDUCTIVE LAYERS FOR...

WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE

SEMICONDUCTOR DEVICE INCLUDING VERTICAL WIRE BONDS

WIRE BOND PAD DESIGN FOR COMPACT STACKED-DIE PACKAGE

INTEGRATED ELECTRONIC ELEMENT MODULE, SEMICONDUCTOR PACKAGE, AND ME...

HIGH CAPACITY SEMICONDUCTOR DEVICE INCLUDING BIFURCATED MEMORY MODULE

SEMICONDUCTOR DEVICE INCLUDING CONTACT FINGERS ON OPPOSED SURFACES

SEMICONDUCTOR DEVICE INCLUDING VERTICALLY STACKED SEMICONDUCTOR DIES

MULTI-MODULE INTEGRATED INTERPOSER AND SEMICONDUCTOR DEVICE FORMED...

SEMICONDUCTOR DEVICE INCLUDING THROUGH VIAS IN MOLDED COLUMNS

SEMICONDUCTOR STORAGE CUBE WITH ENHANCED SIDEWALL PLANARITY

FAN OUT SEMICONDUCTOR DEVICE INCLUDING A PLURALITY OF SEMICONDUCTOR...