Conor Puls

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Moisture hermetic guard ring for semiconductor on insulator devices
- Patent number 12,014,996
- Issue date Jun 18, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,690,211
- Issue date Jun 27, 2023
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic memory devices with layered electrodes and methods of fabr...
- Patent number 11,380,838
- Issue date Jul 5, 2022
- Intel Corporation
- Justin Brockman
- G11 - INFORMATION STORAGE
Information Patent Grant
Thin film transistor based memory cells on both sides of a layer of...
- Patent number 11,239,238
- Issue date Feb 1, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION
- Publication number 20250227993
- Publication date Jul 10, 2025
- Intel Corporation
- Willy RACHMADY
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
- Publication number 20250227968
- Publication date Jul 10, 2025
- Intel Corporation
- Marni NABORS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...
- Publication number 20250220991
- Publication date Jul 3, 2025
- Intel Corporation
- Shao Ming KOH
Information Patent Application
DOUBLE-SIDED CONDUCTIVE VIA
- Publication number 20250140748
- Publication date May 1, 2025
- Intel Corporation
- Payam Amin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS
- Publication number 20250142948
- Publication date May 1, 2025
- Intel Corporation
- Robin Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICALLY SELF-INSULATED VIA
- Publication number 20250132245
- Publication date Apr 24, 2025
- Intel Corporation
- Tofizur RAHMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING
- Publication number 20250112120
- Publication date Apr 3, 2025
- Intel Corporation
- Tao CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER...
- Publication number 20250105095
- Publication date Mar 27, 2025
- Intel Corporation
- Bozidar Marinkovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING
- Publication number 20250096114
- Publication date Mar 20, 2025
- Intel Corporation
- Robin Chao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATING PROXIMITY EFFECTS OF DEEP TRENCH VIAS
- Publication number 20250098249
- Publication date Mar 20, 2025
- Intel Corporation
- Avijit Barik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES HAVING THROUGH-STACK THERMAL SINK FOR...
- Publication number 20250029892
- Publication date Jan 23, 2025
- Intel Corporation
- Conor P. PULS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY US...
- Publication number 20250006579
- Publication date Jan 2, 2025
- Intel Corporation
- Avijit Barik
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN
- Publication number 20250006547
- Publication date Jan 2, 2025
- Intel Corporation
- Mohammad HASAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION
- Publication number 20240332301
- Publication date Oct 3, 2024
- Intel Corporation
- Willy RACHMADY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GATE CUT, AND SOURCE AND DRAIN CONTACTS
- Publication number 20240222447
- Publication date Jul 4, 2024
- Intel Corporation
- Reken Patel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES
- Publication number 20240145410
- Publication date May 2, 2024
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDA...
- Publication number 20230420360
- Publication date Dec 28, 2023
- Intel Corporation
- Mohit HARAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT...
- Publication number 20230317594
- Publication date Oct 5, 2023
- Tao CHU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIAS WITH VERTICALLY NON-UNIFORM OR DISCONTINUOUS STACK
- Publication number 20230317563
- Publication date Oct 5, 2023
- Intel Corporation
- Payam AMIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACKSIDE PROCESSING OF FINS IN FIN BASED TRANSISTOR DEVICES
- Publication number 20230307449
- Publication date Sep 28, 2023
- Intel Corporation
- Tao Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY
- Publication number 20230197779
- Publication date Jun 22, 2023
- Intel Corporation
- Marni NABORS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HERMETIC SEAL FOR TRANSISTORS WITH METAL ON BOTH SIDES
- Publication number 20230197538
- Publication date Jun 22, 2023
- Intel Corporation
- Mohammad Enamul KABIR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED TWO-LEVEL BACKEND MEMORY
- Publication number 20220415892
- Publication date Dec 29, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE...
- Publication number 20220399334
- Publication date Dec 15, 2022
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE VIA BAR SELF-ALIGNED TO GATE END
- Publication number 20220399445
- Publication date Dec 15, 2022
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING...
- Publication number 20220393013
- Publication date Dec 8, 2022
- Intel Corporation
- Leonard P. GULER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...
- Publication number 20220045065
- Publication date Feb 10, 2022
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES
- Publication number 20210407932
- Publication date Dec 30, 2021
- Intel Corporation
- Mohammad Kabir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...
- Publication number 20210125990
- Publication date Apr 29, 2021
- Intel Corporation
- Wilfred Gomes
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC MEMORY DEVICES WITH LAYERED ELECTRODES AND METHODS OF FABR...
- Publication number 20200006634
- Publication date Jan 2, 2020
- Intel Corporation
- Justin Brockman
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Moisture hermetic guard ring for semiconductor on insulator devices

Thin film transistor based memory cells on both sides of a layer of...

Magnetic memory devices with layered electrodes and methods of fabr...

Thin film transistor based memory cells on both sides of a layer of...

Patents Applicationslast 30 patents

INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY

INTEGRATED CIRCUIT STRUCTURE WITH DIRECT BACKSIDE SOURCE OR DRAIN C...

DOUBLE-SIDED CONDUCTIVE VIA

INTEGRATED CIRCUIT DEVICES WITH SELF-ALIGNED VIA-TO-JUMPER CONNECTIONS

ELECTRICALLY SELF-INSULATED VIA

INTEGRATED CIRCUIT STRUCTURE WITH DEEP VIA BAR WIDTH TUNING

INTEGRATED CIRCUIT DEVICES WITH VIAS HAVING WIDENED ENDS FOR POWER...

VIA STRUCTURE WITH IMPROVED SUBSTRATE GROUNDING

MITIGATING PROXIMITY EFFECTS OF DEEP TRENCH VIAS

INTEGRATED CIRCUIT STRUCTURES HAVING THROUGH-STACK THERMAL SINK FOR...

MITIGATION OF THRESHOLD VOLTAGE SHIFT IN BACKSIDE POWER DELIVERY US...

INTEGRATED CIRCUIT STRUCTURES WITH REMOVED SUB-FIN

INTEGRATED CIRCUIT STRUCTURES WITH SUB-FIN ISOLATION

GATE CUT, AND SOURCE AND DRAIN CONTACTS

MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES

INTEGRATED CIRCUIT STRUCTURE WITH RECESSED SELF-ALIGNED DEEP BOUNDA...

DEVICE PERFORMANCE TUNING BY DEEP TRENCH VIA (DVB) PROXIMITY EFFECT...

VIAS WITH VERTICALLY NON-UNIFORM OR DISCONTINUOUS STACK

BACKSIDE PROCESSING OF FINS IN FIN BASED TRANSISTOR DEVICES

INTEGRATED CIRCUIT STRUCTURE WITH BACKSIDE POWER DELIVERY

HERMETIC SEAL FOR TRANSISTORS WITH METAL ON BOTH SIDES

STACKED TWO-LEVEL BACKEND MEMORY

INTEGRATED CIRCUIT STRUCTURES WITH BACKSIDE SELF-ALIGNED CONDUCTIVE...

CONDUCTIVE VIA BAR SELF-ALIGNED TO GATE END

FABRICATION OF GATE-ALL-AROUND INTEGRATED CIRCUIT STRUCTURES HAVING...

THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...

MOISTURE HERMETIC GUARD RING FOR SEMICONDUCTOR ON INSULATOR DEVICES

THIN FILM TRANSISTOR BASED MEMORY CELLS ON BOTH SIDES OF A LAYER OF...

MAGNETIC MEMORY DEVICES WITH LAYERED ELECTRODES AND METHODS OF FABR...