Craig James McLachlan

Person

Melbourne Beach, FL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Diamond SOI with thin silicon nitride layer and related methods
- Patent number 8,815,641
- Issue date Aug 26, 2014
- Soitec
- Rick C. Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device
- Patent number 8,691,670
- Issue date Apr 8, 2014
- Soitec
- Rick Carlton Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming a semiconductor device
- Patent number 8,476,150
- Issue date Jul 2, 2013
- Intersil Americas Inc.
- Rick C. Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer processing
- Patent number 5,801,084
- Issue date Sep 1, 1998
- Harris Corporation
- James Douglas Beasom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
bonded wafer processing
- Patent number 5,780,311
- Issue date Jul 14, 1998
- Harris Corporation
- James Douglas Beasom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-micron bonded SOI by trench planarization
- Patent number 5,585,661
- Issue date Dec 17, 1996
- Harris Corporation
- Craig J. McLachlan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding using trapped oxidizing vapor
- Patent number 5,334,273
- Issue date Aug 2, 1994
- Harris Corporation
- John P. Short
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer bonding process employing liquid oxidant
- Patent number 5,266,135
- Issue date Nov 30, 1993
- Harris Corporation
- John P. Short
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin circuit fabrication by controlled wafer debonding
- Patent number 5,091,331
- Issue date Feb 25, 1992
- Harris Corporation
- Jose A. Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including photo-optical devices and pressure tr...
- Patent number 5,070,596
- Issue date Dec 10, 1991
- Harris Corporation
- Stephen J. Gaul
- G02 - OPTICS
Information Patent Grant
Method of fabricating integrated circuits including photo optical d...
- Patent number 5,037,765
- Issue date Aug 6, 1991
- Harris Corporation
- Stephen J. Gaul
- G02 - OPTICS
Information Patent Grant
Manufacturing ultra-thin wafer using a handle wafer
- Patent number 5,034,343
- Issue date Jul 23, 1991
- Harris Corporation
- George V. Rouse
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating back diffused bonded oxide substrates
- Patent number 4,968,628
- Issue date Nov 6, 1990
- Harris Corporation
- Jose A. Delgado
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuits including photo-optical devices and pressure tr...
- Patent number 4,916,497
- Issue date Apr 10, 1990
- Harris Corporation
- Stephen J. Gaul
- G02 - OPTICS
Information Patent Grant
Electrochemical dielectric isolation technique
- Patent number 4,554,059
- Issue date Nov 19, 1985
- Harris Corporation
- John P. Short
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS OF FORMING A SEMICONDUCTOR DEVICE
- Publication number 20130157416
- Publication date Jun 20, 2013
- Intersil Americas Inc.
- Rick Carlton Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND SOI WITH THIN SILICON NITRIDE LAYER
- Publication number 20110186959
- Publication date Aug 4, 2011
- INTERSIL AMERICAS INC.
- Rick C. Jerome
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIAMOND SOI WITH THIN SILICON NITRIDE LAYER
- Publication number 20110186840
- Publication date Aug 4, 2011
- Rick C. Jerome
- H01 - BASIC ELECTRIC ELEMENTS

Craig James McLachlan

Person

Patents Grantslast 30 patents

Diamond SOI with thin silicon nitride layer and related methods

Methods of forming a semiconductor device

Methods of forming a semiconductor device

Bonded wafer processing

bonded wafer processing

Sub-micron bonded SOI by trench planarization

Wafer bonding using trapped oxidizing vapor

Wafer bonding process employing liquid oxidant

Ultra-thin circuit fabrication by controlled wafer debonding

Integrated circuits including photo-optical devices and pressure tr...

Method of fabricating integrated circuits including photo optical d...

Manufacturing ultra-thin wafer using a handle wafer

Method of fabricating back diffused bonded oxide substrates

Integrated circuits including photo-optical devices and pressure tr...

Electrochemical dielectric isolation technique

Patents Applicationslast 30 patents

METHODS OF FORMING A SEMICONDUCTOR DEVICE

DIAMOND SOI WITH THIN SILICON NITRIDE LAYER

DIAMOND SOI WITH THIN SILICON NITRIDE LAYER