Cynthia Melton

Person

Bolingbrook, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Microelectronic package comprising tin copper solder bump interconn...
- Patent number 6,436,730
- Issue date Aug 20, 2002
- Motorola, Inc.
- Cynthia Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile microelectronic package
- Patent number 6,194,250
- Issue date Feb 27, 2001
- Motorola, Inc.
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package including a polymer encapsulated die
- Patent number 6,093,972
- Issue date Jul 25, 2000
- Motorola, Inc.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assembly having slidable contacts and method for ma...
- Patent number 6,046,910
- Issue date Apr 4, 2000
- Motorola, Inc.
- Sanjar Ghaem
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package including a polymer encapsulated die, and m...
- Patent number 5,895,229
- Issue date Apr 20, 1999
- Motorola, Inc.
- Francis J. Carney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low-profile microelectronic package
- Patent number 5,844,315
- Issue date Dec 1, 1998
- Motorola Corporation
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively filled adhesive film containing a fluxing agent
- Patent number 5,814,401
- Issue date Sep 29, 1998
- Motorola, Inc.
- Daniel R. Gamota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for forming a solder bump by solder-jetting or the like
- Patent number 5,597,110
- Issue date Jan 28, 1997
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-zinc solder connection to a printed circuit board or the like
- Patent number 5,452,842
- Issue date Sep 26, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Immersion plating of tin-bismuth solder
- Patent number 5,435,838
- Issue date Jul 25, 1995
- Motorola, Inc.
- Cynthia M. Melton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin bismuth solder paste, and method using paste to form connection...
- Patent number 5,429,292
- Issue date Jul 4, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microelectronic package comprising tin-copper solder bump interconn...
- Patent number 5,410,184
- Issue date Apr 25, 1995
- Motorola
- Cynthia Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Immersion plating of tin-bismuth solder
- Patent number 5,391,402
- Issue date Feb 21, 1995
- Motorola
- Cynthia M. Melton
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Tin bismuth solder paste, and method using paste to form connection...
- Patent number 5,389,160
- Issue date Feb 14, 1995
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-zinc solder connection to a printed circuit board of the like
- Patent number 5,390,080
- Issue date Feb 14, 1995
- Motorola
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tin-bismuth solder connection having improved high temperature prop...
- Patent number 5,320,272
- Issue date Jun 14, 1994
- Motorola, Inc.
- Cynthia Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming gold bump connection using tin-bismuth solder
- Patent number 5,316,205
- Issue date May 31, 1994
- Motorola, Inc.
- Cynthia Melton
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump interconnection formed using spaced solder deposit and...
- Patent number 5,282,565
- Issue date Feb 1, 1994
- Motorola, Inc.
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature method for forming solder bump interconnections to...
- Patent number 5,269,453
- Issue date Dec 14, 1993
- Motorola, Inc.
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Noncollapsing multisolder interconnection
- Patent number 5,233,504
- Issue date Aug 3, 1993
- Motorola, Inc.
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature-wetting tin-base solder paste
- Patent number 5,229,070
- Issue date Jul 20, 1993
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming tin-indium or tin-bismuth solder connection havi...
- Patent number 5,221,038
- Issue date Jun 22, 1993
- Motorola, Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming solder bump interconnections to a solder-plated...
- Patent number 5,186,383
- Issue date Feb 16, 1993
- Motorola, Inc.
- Cynthia Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Noncollapsing multisolder interconnection
- Patent number 5,154,341
- Issue date Oct 13, 1992
- Motorola Inc.
- Cynthia M. Melton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-coated solder ball
- Patent number 5,086,966
- Issue date Feb 11, 1992
- Motorola Inc.
- Cynthia M. Melton
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Cynthia Melton

Person

Patents Grantslast 30 patents

Microelectronic package comprising tin copper solder bump interconn...

Low-profile microelectronic package

Microelectronic package including a polymer encapsulated die

Microelectronic assembly having slidable contacts and method for ma...

Microelectronic package including a polymer encapsulated die, and m...

Low-profile microelectronic package

Selectively filled adhesive film containing a fluxing agent

Method for forming a solder bump by solder-jetting or the like

Tin-zinc solder connection to a printed circuit board or the like

Immersion plating of tin-bismuth solder

Tin bismuth solder paste, and method using paste to form connection...

Microelectronic package comprising tin-copper solder bump interconn...

Immersion plating of tin-bismuth solder

Tin bismuth solder paste, and method using paste to form connection...

Tin-zinc solder connection to a printed circuit board of the like

Tin-bismuth solder connection having improved high temperature prop...

Method for forming gold bump connection using tin-bismuth solder

Solder bump interconnection formed using spaced solder deposit and...

Low temperature method for forming solder bump interconnections to...

Noncollapsing multisolder interconnection

Low temperature-wetting tin-base solder paste

Method for forming tin-indium or tin-bismuth solder connection havi...

Method for forming solder bump interconnections to a solder-plated...

Noncollapsing multisolder interconnection

Palladium-coated solder ball