"Micro Dynamic Solder Pump: Drop On Demand Eutectic SnPb Solder Dispensing Device", IBM Personal Computer Company, by Tom Schiesser, Ed Menard, Ted Smith, and Jim Akin. (Date not known). |
Journal of Electronic Packaging, vol. 111, "Automated Electronic Circuit Manufacturing Using Ink-Jet Technology", D. B. Wallace (Jun., 1989). |
"Society of Manufacturing Engineers, Technical Paper AD87-539, :Application of Ink Jet Technology to Adhesive Dispensing", David B. Wallace and Donald J. Hayes (1987). |
ISHM '89 Proceedings, "Application of Ink Jet Technology to Microelectronic Packaging", Donald J. Hayes and David B. Wallace (1989). |