Da-Pan Chen

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic structure having a transformer
- Patent number 12,094,644
- Issue date Sep 17, 2024
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic module and method to make the same
- Patent number 11,848,146
- Issue date Dec 19, 2023
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,744,009
- Issue date Aug 29, 2023
- Cyntec Co., Ltd.
- Kaipeng Chiang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic structure having a transformer
- Patent number 11,651,890
- Issue date May 16, 2023
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,153,973
- Issue date Oct 19, 2021
- Cyntec Co., Ltd.
- Kaipeng Chiang
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Semiconductor device having magnetic tunnel junction (MTJ) stack
- Patent number 11,127,788
- Issue date Sep 21, 2021
- Taiwan Semiconductor Manufacturing Company Limited
- Baohua Niu
- G01 - MEASURING TESTING
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 11,031,255
- Issue date Jun 8, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module
- Patent number 11,017,934
- Issue date May 25, 2021
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure
- Patent number 10,991,681
- Issue date Apr 27, 2021
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to form a stacked electronic structure
- Patent number 10,741,531
- Issue date Aug 11, 2020
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 10,593,561
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure
- Patent number 10,593,656
- Issue date Mar 17, 2020
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronic structure
- Patent number 10,199,361
- Issue date Feb 5, 2019
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacked electronic structure
- Patent number 10,034,379
- Issue date Jul 24, 2018
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,978,611
- Issue date May 22, 2018
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,741,590
- Issue date Aug 22, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure comprising a magnetic body and an indu...
- Patent number 9,734,944
- Issue date Aug 15, 2017
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,735,091
- Issue date Aug 15, 2017
- Cyntec Co., Ltd.
- Han-Hsiang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional package structure
- Patent number 9,601,412
- Issue date Mar 21, 2017
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure
- Patent number 9,538,660
- Issue date Jan 3, 2017
- Cyntec Co., Ltd.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,514,964
- Issue date Dec 6, 2016
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure
- Patent number 9,451,701
- Issue date Sep 20, 2016
- Cyntec Co., Ltd.
- Da-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal core printed circuit board and electronic package structure
- Patent number 9,386,686
- Issue date Jul 5, 2016
- Cyntec Co., Ltd.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Power supply module
- Patent number 9,271,398
- Issue date Feb 23, 2016
- Cyntec Co., Ltd.
- Da-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and the method to manufacture thereof
- Patent number 9,171,818
- Issue date Oct 27, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Stack frame for electrical connections and the method to fabricate...
- Patent number 9,142,426
- Issue date Sep 22, 2015
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power conversion module
- Patent number 9,111,954
- Issue date Aug 18, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Electronic package structure
- Patent number 9,001,527
- Issue date Apr 7, 2015
- Cyntec Co., Ltd.
- Da-Jung Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package structure and manufacturing method thereof
- Patent number 9,000,576
- Issue date Apr 7, 2015
- Cyntec Co., Ltd.
- Han-Hsiang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package structure having side-wing parts outside of a pa...
- Patent number 8,906,741
- Issue date Dec 9, 2014
- Cyntec Co., Ltd.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Electronic Module
- Publication number 20240049391
- Publication date Feb 8, 2024
- CYNTEC CO., LTD.
- Chien Ming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC STRUCTURE HAVING A TRANSFORMER
- Publication number 20230245818
- Publication date Aug 3, 2023
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC MODULE
- Publication number 20230049094
- Publication date Feb 16, 2023
- CYNTEC CO., LTD.
- Chien Ming Chen
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
STACKED ELECTRONIC MODULE AND METHOD TO MAKE THE SAME
- Publication number 20220130585
- Publication date Apr 28, 2022
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20220007502
- Publication date Jan 6, 2022
- CYNTEC CO., LTD.
- KAIPENG CHIANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC STRUCTURE HAVING A TRANSFORMER
- Publication number 20210272747
- Publication date Sep 2, 2021
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20210105898
- Publication date Apr 8, 2021
- CYNTEC CO., LTD.
- KAIPENG CHIANG
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
A Stack Frame for Electrical Connections and the Method to Fabricat...
- Publication number 20200176270
- Publication date Jun 4, 2020
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE
- Publication number 20200176429
- Publication date Jun 4, 2020
- CYNTEC CO., LTD.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATION
- Publication number 20200135803
- Publication date Apr 30, 2020
- Taiwan Semiconductor Manufacturing Company Limited
- Baohua NIU
- G11 - INFORMATION STORAGE
Information Patent Application
Method to Form a Stacked Electronic Structure
- Publication number 20190131286
- Publication date May 2, 2019
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Electronic Structure
- Publication number 20180308829
- Publication date Oct 25, 2018
- CYNTEC CO., LTD.
- Chi-Feng Huang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20180240738
- Publication date Aug 23, 2018
- CYNTEC CO., LTD.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20180233380
- Publication date Aug 16, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Module
- Publication number 20180168045
- Publication date Jun 14, 2018
- CYNTEC CO., LTD.
- BAU-RU LU
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Electronic Module
- Publication number 20180166200
- Publication date Jun 14, 2018
- CYNTEC CO., LTD.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack Frame for Electrical Connections and the Method to Fabricate...
- Publication number 20170316954
- Publication date Nov 2, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONIC STRUCTURE
- Publication number 20170223834
- Publication date Aug 3, 2017
- CYNTEC CO., LTD.
- CHI-FENG HUANG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE
- Publication number 20170133355
- Publication date May 11, 2017
- CYNTEC CO., LTD.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20170047229
- Publication date Feb 16, 2017
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20150348801
- Publication date Dec 3, 2015
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20150116960
- Publication date Apr 30, 2015
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20150116973
- Publication date Apr 30, 2015
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150102475
- Publication date Apr 16, 2015
- CYNTEC CO., LTD.
- Han-Hsiang Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic package structure and method for making the same
- Publication number 20150055315
- Publication date Feb 26, 2015
- CYNTEC CO., LTD.
- Bau-Ru Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF
- Publication number 20130146341
- Publication date Jun 13, 2013
- CYNTEC CO., LTD.
- DA-JUNG CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE STRUCTURE
- Publication number 20130141886
- Publication date Jun 6, 2013
- CYNTEC CO., LTD.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL PACKAGE STRUCTURE
- Publication number 20130001756
- Publication date Jan 3, 2013
- CYNTEC CO., LTD.
- Da-Jung Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...
- Publication number 20120319258
- Publication date Dec 20, 2012
- CYNTEC CO., LTD.
- BAU-RU LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20120313229
- Publication date Dec 13, 2012
- CYNTEC CO., LTD.
- Han-Hsiang Lee
- H01 - BASIC ELECTRIC ELEMENTS

Da-Pan Chen

Person

Patents Grantslast 30 patents

Electronic structure having a transformer

Stacked electronic module and method to make the same

Electronic module

Electronic structure having a transformer

Electronic module

Semiconductor device having magnetic tunnel junction (MTJ) stack

Stack frame for electrical connections and the method to fabricate...

Electronic module

Three-dimensional package structure

Method to form a stacked electronic structure

Stack frame for electrical connections and the method to fabricate...

Three-dimensional package structure

Stacked electronic structure

Stacked electronic structure

Stack frame for electrical connections and the method to fabricate...

Stack frame for electrical connections and the method to fabricate...

Electronic package structure comprising a magnetic body and an indu...

Package structure and manufacturing method thereof

Three-dimensional package structure

Electronic package structure

Stack frame for electrical connections and the method to fabricate...

Electronic package structure

Metal core printed circuit board and electronic package structure

Power supply module

Package structure and the method to manufacture thereof

Stack frame for electrical connections and the method to fabricate...

Power conversion module

Electronic package structure

Package structure and manufacturing method thereof

Electronic package structure having side-wing parts outside of a pa...

Patents Applicationslast 30 patents

Electronic Module

ELECTRONIC STRUCTURE HAVING A TRANSFORMER

ELECTRONIC MODULE

STACKED ELECTRONIC MODULE AND METHOD TO MAKE THE SAME

Electronic Module

ELECTRONIC STRUCTURE HAVING A TRANSFORMER

Electronic Module

A Stack Frame for Electrical Connections and the Method to Fabricat...

THREE-DIMENSIONAL PACKAGE STRUCTURE

SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATION

Method to Form a Stacked Electronic Structure

Stacked Electronic Structure

ELECTRONIC PACKAGE AND FABRICATION METHOD THEREOF

Stack Frame for Electrical Connections and the Method to Fabricate...

Electronic Module

Electronic Module

Stack Frame for Electrical Connections and the Method to Fabricate...

STACKED ELECTRONIC STRUCTURE

THREE-DIMENSIONAL PACKAGE STRUCTURE

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

ELECTRONIC PACKAGE STRUCTURE

ELECTRONIC PACKAGE STRUCTURE

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF

Electronic package structure and method for making the same

PACKAGE STRUCTURE AND THE METHOD TO MANUFACTURE THEREOF

ELECTRONIC PACKAGE STRUCTURE

THREE-DIMENSIONAL PACKAGE STRUCTURE

STACK FRAME FOR ELECTRICAL CONNECTIONS AND THE METHOD TO FABRICATE...

PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF