Dai Fukushima

Person

Kanagawa, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Polishing device, polishing method, and record medium
- Patent number 11,097,397
- Issue date Aug 24, 2021
- TOSHIBA MEMORY CORPORATION
- Takashi Watanabe
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus, polishing method, and semiconductor manufactur...
- Patent number 9,902,038
- Issue date Feb 27, 2018
- TOSHIBA MEMORY CORPORATION
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing pad dresser, polishing apparatus and polishing pad dressi...
- Patent number 9,849,558
- Issue date Dec 26, 2017
- TOSHIBA MEMORY CORPORATION
- Takayuki Nakayama
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor manufacturing apparatus and manufacturing method of s...
- Patent number 9,748,090
- Issue date Aug 29, 2017
- TOSHIBA MEMORY CORPORATION
- Shinichi Hirasawa
- B24 - GRINDING POLISHING
Information Patent Grant
Retainer ring, polish apparatus, and polish method
- Patent number 9,539,696
- Issue date Jan 10, 2017
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Polish apparatus, polish method, and method of manufacturing semico...
- Patent number 9,502,318
- Issue date Nov 22, 2016
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 9,296,083
- Issue date Mar 29, 2016
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing method and method for fabricating semiconductor device
- Patent number 8,778,802
- Issue date Jul 15, 2014
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 8,506,362
- Issue date Aug 13, 2013
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
CMP slurry for metallic film, polishing method and method of manufa...
- Patent number 8,337,715
- Issue date Dec 25, 2012
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 8,174,125
- Issue date May 8, 2012
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate treating method and substrate treating apparatus
- Patent number 8,152,598
- Issue date Apr 10, 2012
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
CMP slurry for metallic film, polishing method and method of manufa...
- Patent number 7,842,191
- Issue date Nov 30, 2010
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Aqueous dispersion for CMP, polishing method and method for manufac...
- Patent number 7,833,431
- Issue date Nov 16, 2010
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor device fabrication method
- Patent number 7,682,975
- Issue date Mar 23, 2010
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of a semiconductor device
- Patent number 7,521,350
- Issue date Apr 21, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating semiconductor device and polishing method
- Patent number 7,494,931
- Issue date Feb 24, 2009
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,465,668
- Issue date Dec 16, 2008
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Slurry for CMP, polishing method and method of manufacturing semico...
- Patent number 7,419,910
- Issue date Sep 2, 2008
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Polishing method of Cu film and method for manufacturing semiconduc...
- Patent number 7,307,023
- Issue date Dec 11, 2007
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,144,804
- Issue date Dec 5, 2006
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device containing a dummy wire
- Patent number 7,042,099
- Issue date May 9, 2006
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making semiconductor device by polishing with intermediat...
- Patent number 6,984,582
- Issue date Jan 10, 2006
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing aqueous dispersion and chemical mecha...
- Patent number 6,935,928
- Issue date Aug 30, 2005
- JSR Corporation
- Kazuhito Uchikura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device including two-step pol...
- Patent number 6,897,143
- Issue date May 24, 2005
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an improved construction in the interla...
- Patent number 6,858,936
- Issue date Feb 22, 2005
- Kabushiki Kaisha Toshiba
- Gaku Minamihaba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having a damascene type wiring layer
- Patent number 6,611,060
- Issue date Aug 26, 2003
- Kabushiki Kaisha Toshiba
- Hiroshi Toyoda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for CMP, method of forming thereof and method of manufacturi...
- Patent number 6,576,554
- Issue date Jun 10, 2003
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Polishing apparatus
- Patent number 6,312,321
- Issue date Nov 6, 2001
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING DEVICE, POLISHING METHOD, AND RECORD MEDIUM
- Publication number 20190039206
- Publication date Feb 7, 2019
- Toshiba Memory Corporation
- Takashi Watanabe
- B24 - GRINDING POLISHING
Information Patent Application
CLEANING APPARATUS AND CLEANING METHOD
- Publication number 20170053816
- Publication date Feb 23, 2017
- KABUSHIKI KAISHA TOSHIBA
- Jun TAKAGI
- B08 - CLEANING
Information Patent Application
POLISHING PAD DRESSER, POLISHING APPARATUS AND POLISHING PAD DRESSI...
- Publication number 20160243672
- Publication date Aug 25, 2016
- KABUSHIKI KAISHA TOSHIBA
- Takayuki NAKAYAMA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS, POLISHING METHOD, AND SEMICONDUCTOR MANUFACTUR...
- Publication number 20160233101
- Publication date Aug 11, 2016
- KABUSHIKI KAISHA TOSHIBA
- Dai FUKUSHIMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF S...
- Publication number 20160218001
- Publication date Jul 28, 2016
- KABUSHIKI KAISHA TOSHIBA
- Shinichi HIRASAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISH APPARATUS, POLISH METHOD, AND METHOD OF MANUFACTURING SEMICO...
- Publication number 20150364389
- Publication date Dec 17, 2015
- KABUSHIKI KAISHA TOSHIBA
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETAINER RING, POLISH APPARATUS, AND POLISH METHOD
- Publication number 20150183082
- Publication date Jul 2, 2015
- KABUSHIKI KAISHA TOSHIBA
- Dai FUKUSHIMA
- B24 - GRINDING POLISHING
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20140342640
- Publication date Nov 20, 2014
- KABUSHIKI KAISHA TOSHIBA
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECH...
- Publication number 20110250756
- Publication date Oct 13, 2011
- KABUSHIKI KAISHA TOSHIBA
- Kazuhito UCHIKURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP slurry for metallic film, polishing method and method of manufa...
- Publication number 20110062374
- Publication date Mar 17, 2011
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20110003537
- Publication date Jan 6, 2011
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20100203806
- Publication date Aug 12, 2010
- Kabushiki Kaisha Toshiba
- Tomonori KITAKURA
- B24 - GRINDING POLISHING
Information Patent Application
MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE
- Publication number 20090184415
- Publication date Jul 23, 2009
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECH...
- Publication number 20090124172
- Publication date May 14, 2009
- JSR Corporation
- Kazuhito Uchikura
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20090124174
- Publication date May 14, 2009
- Dai FUKUSHIMA
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20080254719
- Publication date Oct 16, 2008
- Atsushi SHIGETA
- B24 - GRINDING POLISHING
Information Patent Application
Polishing method for semiconductor wafer and polishing apparatus fo...
- Publication number 20080113590
- Publication date May 15, 2008
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Application
Polishing method and method for fabricating semiconductor device
- Publication number 20070293047
- Publication date Dec 20, 2007
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
Slurry for CMP of Cu film, polishing method and method for manufact...
- Publication number 20070293049
- Publication date Dec 20, 2007
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for touch-up CMP and method of manufacturing semiconductor d...
- Publication number 20070232068
- Publication date Oct 4, 2007
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
AQUEOUS DISPERSION FOR CMP, POLISHING METHOD AND METHOD FOR MANUFAC...
- Publication number 20070128873
- Publication date Jun 7, 2007
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing method of Cu film and method for manufacturing semiconduc...
- Publication number 20070093064
- Publication date Apr 26, 2007
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
Method for fabricating semiconductor device and polishing method
- Publication number 20070072427
- Publication date Mar 29, 2007
- Dai Fukushima
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Aqueous dispersion for chemical mechanical polishing, kit for prepa...
- Publication number 20070049180
- Publication date Mar 1, 2007
- JSR Corporation
- Hirotaka Shida
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor device fabrication method
- Publication number 20060293191
- Publication date Dec 28, 2006
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CMP slurry for metallic film, polishing method and method of manufa...
- Publication number 20060243702
- Publication date Nov 2, 2006
- Gaku Minamihaba
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20060175296
- Publication date Aug 10, 2006
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
Manufacturing method of a semiconductor device
- Publication number 20060151888
- Publication date Jul 13, 2006
- Kabushiki Kaisha Toshiba
- Nobuyuki Kurashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing semiconductor device
- Publication number 20050218008
- Publication date Oct 6, 2005
- Dai Fukushima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for CMP, polishing method and method of manufacturing semico...
- Publication number 20050118821
- Publication date Jun 2, 2005
- Gaku Minamihaba
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Dai Fukushima

Person

Patents Grantslast 30 patents

Polishing device, polishing method, and record medium

Polishing apparatus, polishing method, and semiconductor manufactur...

Polishing pad dresser, polishing apparatus and polishing pad dressi...

Semiconductor manufacturing apparatus and manufacturing method of s...

Retainer ring, polish apparatus, and polish method

Polish apparatus, polish method, and method of manufacturing semico...

Polishing apparatus and polishing method

Polishing method and method for fabricating semiconductor device

Polishing apparatus and polishing method

CMP slurry for metallic film, polishing method and method of manufa...

Manufacturing method of a semiconductor device

Substrate treating method and substrate treating apparatus

CMP slurry for metallic film, polishing method and method of manufa...

Aqueous dispersion for CMP, polishing method and method for manufac...

Semiconductor device fabrication method

Manufacturing method of a semiconductor device

Method for fabricating semiconductor device and polishing method

Method of manufacturing semiconductor device

Slurry for CMP, polishing method and method of manufacturing semico...

Polishing method of Cu film and method for manufacturing semiconduc...

Semiconductor device and method of manufacturing the same

Semiconductor device containing a dummy wire

Method of making semiconductor device by polishing with intermediat...

Chemical mechanical polishing aqueous dispersion and chemical mecha...

Method of manufacturing semiconductor device including two-step pol...

Semiconductor device having an improved construction in the interla...

Semiconductor device having a damascene type wiring layer

Slurry for CMP, method of forming thereof and method of manufacturi...

Polishing apparatus

Patents Applicationslast 30 patents

POLISHING DEVICE, POLISHING METHOD, AND RECORD MEDIUM

CLEANING APPARATUS AND CLEANING METHOD

POLISHING PAD DRESSER, POLISHING APPARATUS AND POLISHING PAD DRESSI...

POLISHING APPARATUS, POLISHING METHOD, AND SEMICONDUCTOR MANUFACTUR...

SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF S...

POLISH APPARATUS, POLISH METHOD, AND METHOD OF MANUFACTURING SEMICO...

RETAINER RING, POLISH APPARATUS, AND POLISH METHOD

POLISHING APPARATUS AND POLISHING METHOD

AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECH...

CMP slurry for metallic film, polishing method and method of manufa...

POLISHING APPARATUS AND POLISHING METHOD

SEMICONDUCTOR MANUFACTURING APPARATUS

MANUFACTURING METHOD OF A SEMICONDUCTOR DEVICE

AQUEOUS DISPERSION FOR CHEMICAL MECHANICAL POLISHING, CHEMICAL MECH...

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

SUBSTRATE PROCESSING METHOD

Polishing method for semiconductor wafer and polishing apparatus fo...

Polishing method and method for fabricating semiconductor device

Slurry for CMP of Cu film, polishing method and method for manufact...

Slurry for touch-up CMP and method of manufacturing semiconductor d...

AQUEOUS DISPERSION FOR CMP, POLISHING METHOD AND METHOD FOR MANUFAC...

Polishing method of Cu film and method for manufacturing semiconduc...

Method for fabricating semiconductor device and polishing method

Aqueous dispersion for chemical mechanical polishing, kit for prepa...

Semiconductor device fabrication method

CMP slurry for metallic film, polishing method and method of manufa...

Method of manufacturing semiconductor device

Manufacturing method of a semiconductor device

Method of manufacturing semiconductor device

Slurry for CMP, polishing method and method of manufacturing semico...