Dale C. McHerron

Person

Staatsburg, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Direct bonded heterogeneous integration silicon bridge
- Patent number 11,791,270
- Issue date Oct 17, 2023
- International Business Machines Corporation
- Kamal K Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Oxide-bonded wafer pair separation using laser debonding
- Patent number 11,355,379
- Issue date Jun 7, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple chip bridge connector
- Patent number 10,991,635
- Issue date Apr 27, 2021
- International Business Machines Corporation
- Dale Curtis McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deflection analysis system and method for circuit design
- Patent number 7,475,368
- Issue date Jan 6, 2009
- International Business Machines Corporation
- Matthew S. Angyal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and apparatus for application of pressure to a workpiece by...
- Patent number 6,892,781
- Issue date May 17, 2005
- International Business Machines Corporation
- Dale C McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric compositions, preparation thereof, and integrated circui...
- Patent number 6,518,392
- Issue date Feb 11, 2003
- International Business Machines Corporation
- Kenneth R. Carter
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for forming an integrated circuit
- Patent number 6,342,455
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Kenneth R. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect dielectric compositions, preparation thereof, and inte...
- Patent number 6,265,753
- Issue date Jul 24, 2001
- International Business Machines Corporation
- Kenneth R. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Repair process for aluminum nitride substrates
- Patent number 6,262,390
- Issue date Jul 17, 2001
- International Business Machines Corporation
- David B. Goland
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
High density Z-axis connector
- Patent number 6,174,175
- Issue date Jan 16, 2001
- International Business Machines Corporation
- Alex A. Behfar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hermetic thin film metallized sealband for SCM and MCM-D modules
- Patent number 6,046,074
- Issue date Apr 4, 2000
- International Business Machines Corporation
- Dale C. McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Large area multiple-chip probe assembly and method of making the same
- Patent number 5,977,787
- Issue date Nov 2, 1999
- International Business Machines Corporation
- Gobina Das
- G01 - MEASURING TESTING
Information Patent Grant
Hermetic thin film metallized sealband for SCM and MCM-D modules
- Patent number 5,744,752
- Issue date Apr 28, 1998
- International Business Machines Corporation
- Dale C. McHerron
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY
- Publication number 20240332239
- Publication date Oct 3, 2024
- International Business Machines Corporation
- Nicholas Alexander Polomoff
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER
- Publication number 20230268275
- Publication date Aug 24, 2023
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE
- Publication number 20220359401
- Publication date Nov 10, 2022
- International Business Machines Corporation
- Kamal K. Sikka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OXIDE-BONDED WAFER PAIR SEPARATION USING LASER DEBONDING
- Publication number 20220165601
- Publication date May 26, 2022
- International Business Machines Corporation
- Mukta Ghate Farooq
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTIPLE CHIP BRIDGE CONNECTOR
- Publication number 20210020529
- Publication date Jan 21, 2021
- International Business Machines Corporation
- Dale Curtis McHerron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GRADIENT DEPOSITION OF LOW-K CVD MATERIALS
- Publication number 20090026587
- Publication date Jan 29, 2009
- International Business Machines Corporation
- Matthew Angyal
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Deflection analysis system and method for circuit design
- Publication number 20070174796
- Publication date Jul 26, 2007
- International Business Machines Corporation
- Matthew S. Angyal
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method and apparatus for application of pressure to a workpiece by...
- Publication number 20030221777
- Publication date Dec 4, 2003
- International Business Machines Corporation
- Dale C. McHerron
- B30 - PRESSES
Information Patent Application
Novel dielectric compositions, preparation thereof, and integrated...
- Publication number 20010009293
- Publication date Jul 26, 2001
- Kenneth R. Carter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for forming an integrated circuit
- Publication number 20010009296
- Publication date Jul 26, 2001
- Kenneth R. Carter
- H01 - BASIC ELECTRIC ELEMENTS

Dale C. McHerron

Person

Patents Grantslast 30 patents

Direct bonded heterogeneous integration silicon bridge

Oxide-bonded wafer pair separation using laser debonding

Multiple chip bridge connector

Deflection analysis system and method for circuit design

Method and apparatus for application of pressure to a workpiece by...

Dielectric compositions, preparation thereof, and integrated circui...

Process for forming an integrated circuit

Interconnect dielectric compositions, preparation thereof, and inte...

Repair process for aluminum nitride substrates

High density Z-axis connector

Hermetic thin film metallized sealband for SCM and MCM-D modules

Large area multiple-chip probe assembly and method of making the same

Hermetic thin film metallized sealband for SCM and MCM-D modules

Patents Applicationslast 30 patents

HYBRID BOND INTEGRATION FOR MULTI-DIE ASSEMBLY

RESIST PATTERNED REDISTRIBUTION WIRING ON COPPER POLYIMIDE VIA LAYER

DIRECT BONDED HETEROGENEOUS INTEGRATION SILICON BRIDGE

OXIDE-BONDED WAFER PAIR SEPARATION USING LASER DEBONDING

MULTIPLE CHIP BRIDGE CONNECTOR

GRADIENT DEPOSITION OF LOW-K CVD MATERIALS

Deflection analysis system and method for circuit design

Method and apparatus for application of pressure to a workpiece by...

Novel dielectric compositions, preparation thereof, and integrated...

Process for forming an integrated circuit