Daniel S. Niedrich

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Apalachin, NY, US

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Patents Grantslast 30 patents

Information Patent Grant
Applying solder to high density substrates
- Patent number 5,316,788
- Issue date May 31, 1994
- International Business Machines Corporation
- Eric P. Dibble
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Copper doped low melt solder for component assembly and rework
- Patent number 5,011,658
- Issue date Apr 30, 1991
- International Business Machines Corporation
- Daniel S. Niedrich
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR