Darko Grujicic

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electronic substrates having embedded inductors
- Patent number 12,057,252
- Issue date Aug 6, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming embedded grounding planes on interconnect layers
- Patent number 11,791,228
- Issue date Oct 17, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
- Patent number 11,728,265
- Issue date Aug 15, 2023
- Intel Corporation
- Brandon C. Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package architecture with tunable magnetic properties for embedded...
- Patent number 11,574,993
- Issue date Feb 7, 2023
- Intel Corporation
- Rengarajan Shanmugam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective metal deposition by patterning direct electroless metal p...
- Patent number 11,501,967
- Issue date Nov 15, 2022
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus with a substrate provided with plasma treatment
- Patent number 11,291,122
- Issue date Mar 29, 2022
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE
- Publication number 20240395661
- Publication date Nov 28, 2024
- Intel Corporation
- Numair Ahmed
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION
- Publication number 20240332153
- Publication date Oct 3, 2024
- Intel Corporation
- Tchefor NDUKUM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMS DIES EMBEDDED IN GLASS CORES
- Publication number 20240327201
- Publication date Oct 3, 2024
- Intel Corporation
- Numair Ahmed
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
- Publication number 20240331921
- Publication date Oct 3, 2024
- Intel Corporation
- Benjamin Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...
- Publication number 20240321657
- Publication date Sep 26, 2024
- Intel Corporation
- Darko Grujicic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312853
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VIA STRUCTURES IN BONDED GLASS SUBSTRATES
- Publication number 20240312888
- Publication date Sep 19, 2024
- Intel Corporation
- Sashi S. KANDANUR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION
- Publication number 20240222258
- Publication date Jul 4, 2024
- Intel Corporation
- Rachel Guia Parala Giron
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS
- Publication number 20240222035
- Publication date Jul 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS
- Publication number 20240222018
- Publication date Jul 4, 2024
- Intel Corporation
- Thomas Sounart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA
- Publication number 20240213132
- Publication date Jun 27, 2024
- Intel Corporation
- Kristof DARMAWIKARTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES
- Publication number 20240213301
- Publication date Jun 27, 2024
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FORMING A PACKAGE SUBSTRATE
- Publication number 20240188222
- Publication date Jun 6, 2024
- Intel Corporation
- Rahul MANEPALLI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES WITH NITRIDED GLASS CORES
- Publication number 20240006258
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES
- Publication number 20240006380
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa Nad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MULTI-LAYERED METALLIZATION LINES
- Publication number 20240006327
- Publication date Jan 4, 2024
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...
- Publication number 20240006283
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattawa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
- Publication number 20240006300
- Publication date Jan 4, 2024
- Intel Corporation
- Yi Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER
- Publication number 20240006297
- Publication date Jan 4, 2024
- Intel Corporation
- Suddhasattwa NAD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
- Publication number 20230420322
- Publication date Dec 28, 2023
- Intel Corporation
- Yi YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS
- Publication number 20230402368
- Publication date Dec 14, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
AGITATION MONITORING SYSTEM FOR PLATING PROCESS
- Publication number 20230304795
- Publication date Sep 28, 2023
- Intel Corporation
- Adrian BAYRAKTAROGLU
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES...
- Publication number 20230298971
- Publication date Sep 21, 2023
- Intel Corporation
- Shayan Kaviani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH GLASS VIA WITH A METAL WALL
- Publication number 20230107096
- Publication date Apr 6, 2023
- Intel Corporation
- Darko GRUJICIC
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
- Publication number 20230095846
- Publication date Mar 30, 2023
- Intel Corporation
- Benjamin T. Duong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITORS IN THROUGH GLASS VIAS
- Publication number 20230091666
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin DUONG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICA...
- Publication number 20230093438
- Publication date Mar 23, 2023
- Intel Corporation
- Benjamin DUONG
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE...
- Publication number 20230082385
- Publication date Mar 16, 2023
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A SACRIFIC...
- Publication number 20230083425
- Publication date Mar 16, 2023
- Jeremy D. Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC-TO-METAL ADHESION PROMOTION MATERIAL
- Publication number 20220293509
- Publication date Sep 15, 2022
- Intel Corporation
- Rahul Manepalli
- H01 - BASIC ELECTRIC ELEMENTS

Darko Grujicic

Person

Patents Grantslast 30 patents

Electronic substrates having embedded inductors

Method for forming embedded grounding planes on interconnect layers

Selective deposition of embedded thin-film resistors for semiconduc...

Package architecture with tunable magnetic properties for embedded...

Selective metal deposition by patterning direct electroless metal p...

Apparatus with a substrate provided with plasma treatment

Patents Applicationslast 30 patents

IN-SITU MICRO-FLUIDIC CHANNELS FOR HEAT DISSIPATION IN GLASS SUBSTRATE

DRY SEED REMOVAL BY LASER FOR LINE-SPACE AND VIA FORMATION

MEMS DIES EMBEDDED IN GLASS CORES

ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS

PHOTONIC INTEGRATED CIRCUIT PACKAGES AND METHODS OF MANUFACTURING T...

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

VIA STRUCTURES IN BONDED GLASS SUBSTRATES

GLASS SUBSTRATES WITH SELF-ASSEMBLED MONOLAYERS FOR COPPER ADHESION

PACKAGE SUBSTRATE EMBEDDED MULTI-LAYERED IN VIA CAPACITORS

SUBSTRATE PACKAGE-INTEGRATED OXIDE CAPACITORS AND RELATED METHODS

THIN FILM CAPACITORS (TFCS) IN ETCHED BACK DEEP VIA

THIN FILM CAPACITOR (TFC) ARCHITECTURES FOR PACKAGE SUBSTRATES

METHOD OF FORMING A PACKAGE SUBSTRATE

SUBSTRATES WITH NITRIDED GLASS CORES

METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES

INTEGRATED CIRCUIT PACKAGE WITH MULTI-LAYERED METALLIZATION LINES

EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...

SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS

SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER

ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE

TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS

AGITATION MONITORING SYSTEM FOR PLATING PROCESS

MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES...

THROUGH GLASS VIA WITH A METAL WALL

GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...

CAPACITORS IN THROUGH GLASS VIAS

GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICA...

DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE...

DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A SACRIFIC...

DIELECTRIC-TO-METAL ADHESION PROMOTION MATERIAL