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Darko Grujicic
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Chandler, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for forming embedded grounding planes on interconnect layers
Patent number
11,791,228
Issue date
Oct 17, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective deposition of embedded thin-film resistors for semiconduc...
Patent number
11,728,265
Issue date
Aug 15, 2023
Intel Corporation
Brandon C. Marin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package architecture with tunable magnetic properties for embedded...
Patent number
11,574,993
Issue date
Feb 7, 2023
Intel Corporation
Rengarajan Shanmugam
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Selective metal deposition by patterning direct electroless metal p...
Patent number
11,501,967
Issue date
Nov 15, 2022
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus with a substrate provided with plasma treatment
Patent number
11,291,122
Issue date
Mar 29, 2022
Intel Corporation
Darko Grujicic
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SUBSTRATES WITH NITRIDED GLASS CORES
Publication number
20240006258
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGE WITH MULTI-LAYERED METALLIZATION LINES
Publication number
20240006327
Publication date
Jan 4, 2024
Intel Corporation
Jeremy Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METALLIZATION SURFACE TREATMENT FOR INTEGRATED CIRCUIT PACKAGES
Publication number
20240006380
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa Nad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EDGE DELAMINATION AND CRACK PREVENTION METHODS FOR SINX AND TI-CU E...
Publication number
20240006283
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattawa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATES HAVING ADHESION PROMOTOR LAYERS AND RELATED METHODS
Publication number
20240006300
Publication date
Jan 4, 2024
Intel Corporation
Yi Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SILICIDE AND SILICON NITRIDE LAYERS BETWEEN A DIELECTRIC AND COPPER
Publication number
20240006297
Publication date
Jan 4, 2024
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ORGANIC ADHESION PROMOTOR FOR DIELECTRIC ADHESION TO A COPPER TRACE
Publication number
20230420322
Publication date
Dec 28, 2023
Intel Corporation
Yi YANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
TECHNOLOGIES FOR THIN FILM RESISTORS IN VIAS
Publication number
20230402368
Publication date
Dec 14, 2023
Intel Corporation
Benjamin T. Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
AGITATION MONITORING SYSTEM FOR PLATING PROCESS
Publication number
20230304795
Publication date
Sep 28, 2023
Intel Corporation
Adrian BAYRAKTAROGLU
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MICROELECTRONIC STRUCTURE INCLUDING CONDUCTIVE POLYMER IN TRENCHES...
Publication number
20230298971
Publication date
Sep 21, 2023
Intel Corporation
Shayan Kaviani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
THROUGH GLASS VIA WITH A METAL WALL
Publication number
20230107096
Publication date
Apr 6, 2023
Intel Corporation
Darko GRUJICIC
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATES HAVING TRANSVERSE CAPACITORS FOR USE WITH SEMICOND...
Publication number
20230095846
Publication date
Mar 30, 2023
Intel Corporation
Benjamin T. Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CAPACITORS IN THROUGH GLASS VIAS
Publication number
20230091666
Publication date
Mar 23, 2023
Intel Corporation
Benjamin DUONG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
GLASS SUBSTRATE EMBEDDED PIC TO PIC AND OFF-CHIP PHOTONIC COMMUNICA...
Publication number
20230093438
Publication date
Mar 23, 2023
Intel Corporation
Benjamin DUONG
H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information
Patent Application
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A REVERSE...
Publication number
20230082385
Publication date
Mar 16, 2023
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEFECT-FREE THROUGH GLASS VIA METALLIZATION IMPLEMENTING A SACRIFIC...
Publication number
20230083425
Publication date
Mar 16, 2023
Jeremy D. Ecton
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIELECTRIC-TO-METAL ADHESION PROMOTION MATERIAL
Publication number
20220293509
Publication date
Sep 15, 2022
Intel Corporation
Rahul Manepalli
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
Publication number
20220093316
Publication date
Mar 24, 2022
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
Publication number
20220093534
Publication date
Mar 24, 2022
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC SUBSTRATES HAVING EMBEDDED INDUCTORS
Publication number
20220093535
Publication date
Mar 24, 2022
Intel Corporation
Benjamin Duong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTROLESS PLATING PROCESS
Publication number
20220010452
Publication date
Jan 13, 2022
Intel Corporation
Chandrasekharan NAIR
C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information
Patent Application
MULTIPLE LAYER COPPER SEEDING
Publication number
20210090946
Publication date
Mar 25, 2021
Intel Corporation
Darko GRUJICIC
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FORMING EMBEDDED GROUNDING PLANES ON INTERCONNECT LAYERS
Publication number
20200328131
Publication date
Oct 15, 2020
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COPPER INTERFACE FEATURES FOR HIGH SPEED INTERCONNECT APPLICATIONS
Publication number
20200315023
Publication date
Oct 1, 2020
Intel Corporation
Suddhasattwa NAD
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
PACKAGE ARCHITECTURE WITH TUNABLE MAGNETIC PROPERTIES FOR EMBEDDED...
Publication number
20200258975
Publication date
Aug 13, 2020
Intel Corporation
Rengarajan SHANMUGAM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SELECTIVE METAL DEPOSITION BY PATTERNING DIRECT ELECTROLESS METAL P...
Publication number
20200251332
Publication date
Aug 6, 2020
Intel Corporation
Suddhasattwa NAD
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
APPARATUS WITH A SUBSTRATE PROVIDED WITH PLASMA TREATMENT
Publication number
20200245472
Publication date
Jul 30, 2020
Intel Corporation
Darko GRUJICIC
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information
Patent Application
SELECTIVE DEPOSITION OF EMBEDDED THIN-FILM RESISTORS FOR SEMICONDUC...
Publication number
20200083164
Publication date
Mar 12, 2020
Intel Corporation
Brandon C. MARIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MATERIAL THICKNESS DEVICE AND METHOD
Publication number
20170170080
Publication date
Jun 15, 2017
Intel Corporation
Darko Grujicic
C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...