David Clark

Person

Ipswich, GB

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with transmissive layer and manufacturing meth...
- Patent number 11,942,581
- Issue date Mar 26, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with transmissive layer and manufacturing meth...
- Patent number 11,437,552
- Issue date Sep 6, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optically-transmissive layer and manufact...
- Patent number 10,784,422
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with optically-transmissive layer and manufact...
- Patent number 10,490,716
- Issue date Nov 26, 2019
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 9,960,328
- Issue date May 1, 2018
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level applied thermal heat sink
- Patent number 8,686,556
- Issue date Apr 1, 2014
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...
- Publication number 20230074157
- Publication date Mar 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...
- Publication number 20210020813
- Publication date Jan 21, 2021
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20200083418
- Publication date Mar 12, 2020
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180233641
- Publication date Aug 16, 2018
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180069163
- Publication date Mar 8, 2018
- Amkor Technology, Inc.
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGING
- Publication number 20130244382
- Publication date Sep 19, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED RF SHIELDS
- Publication number 20130093067
- Publication date Apr 18, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL APPLIED THERMAL HEAT SINK
- Publication number 20130087904
- Publication date Apr 11, 2013
- FlipChip International, LLC
- David Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Optoelectronic device having a Discrete Bragg Reflector and an elec...
- Publication number 20050185689
- Publication date Aug 25, 2005
- David James Clark
- H01 - BASIC ELECTRIC ELEMENTS

David Clark

Person

Patents Grantslast 30 patents

Semiconductor device with transmissive layer and manufacturing meth...

Semiconductor device with transmissive layer and manufacturing meth...

Semiconductor device with optically-transmissive layer and manufact...

Semiconductor device with optically-transmissive layer and manufact...

Semiconductor device and manufacturing method thereof

Wafer level applied thermal heat sink

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...

SEMICONDUCTOR DEVICE WITH OPTICALLY-TRANSMISSIVE LAYER AND MANUFACT...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

HIGH PRECISION SELF ALIGNING DIE FOR EMBEDDED DIE PACKAGING

WAFER LEVEL APPLIED RF SHIELDS

WAFER LEVEL APPLIED THERMAL HEAT SINK

Optoelectronic device having a Discrete Bragg Reflector and an elec...