David Danovitch

Person

Canton-de-Granby, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,679,966
- Issue date Jun 9, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gallium liquid metal embrittlement for device rework
- Patent number 10,559,549
- Issue date Feb 11, 2020
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for forming integrated circuit assembly
- Patent number 8,689,437
- Issue date Apr 8, 2014
- International Business Machines Corporation
- Bing Dang
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,559,474
- Issue date Oct 15, 2013
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,421,217
- Issue date Apr 16, 2013
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carrier optoelectronic packaging
- Patent number 8,290,008
- Issue date Oct 16, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Grant
Achieving mechanical and thermal stability in a multi-chip package
- Patent number 8,202,765
- Issue date Jun 19, 2012
- International Business Machines Corporation
- Jon A. Casey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold shave apparatus and injection molded soldering process
- Patent number 8,162,199
- Issue date Apr 24, 2012
- International Business Machines Corporation
- Eric E. Bourchard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Injection molded soldering process and arrangement for three-dimens...
- Patent number 7,952,205
- Issue date May 31, 2011
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Injection molded soldering process and arrangement for three-dimens...
- Patent number 7,820,483
- Issue date Oct 26, 2010
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Techniques for forming interconnects
- Patent number 7,819,376
- Issue date Oct 26, 2010
- International Business Machines Corporation
- David H. Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Composite interconnect structure using injection molded solder tech...
- Patent number 7,786,588
- Issue date Aug 31, 2010
- International Business Machines Corporation
- David D. Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary structure to reduce stress and warpage in a flip chip org...
- Patent number 7,538,432
- Issue date May 26, 2009
- International Business Machines Corporation
- David Danovitch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and method for stress reduction in flip chip microelectro...
- Patent number 7,498,198
- Issue date Mar 3, 2009
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temporary structure to reduce stress and warpage in a flip chip org...
- Patent number 7,473,618
- Issue date Jan 6, 2009
- International Business Machines Corporation
- David Danovitch
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Techniques for forming interconnects
- Patent number 7,348,270
- Issue date Mar 25, 2008
- International Business Machines Corporation
- David H. Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for transferring solder bumps
- Patent number 7,070,087
- Issue date Jul 4, 2006
- International Business Machines Corporation
- Guy Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for electrical commoning of circuits
- Patent number 7,038,462
- Issue date May 2, 2006
- International Business Machines Corporation
- David Danovitch
- G01 - MEASURING TESTING
Information Patent Grant
Bilayer wafer-level underfill
- Patent number 6,924,171
- Issue date Aug 2, 2005
- International Business Machines Corporation
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual-solder flip-chip solder bump
- Patent number 6,893,799
- Issue date May 17, 2005
- International Business Machines Corporation
- David Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid molds for molten solder screening process
- Patent number 6,832,747
- Issue date Dec 21, 2004
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Grounding and thermal dissipation for integrated circuit packages
- Patent number 6,819,566
- Issue date Nov 16, 2004
- International Business Machines Corporation
- David Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,566,612
- Issue date May 20, 2003
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid molds for molten solder screening process
- Patent number 6,390,439
- Issue date May 21, 2002
- International Business Machines Corporation
- Steven A. Cordes
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for direct chip attach by solder bumps and an underfill layer
- Patent number 6,341,418
- Issue date Jan 29, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making interconnect for low temperature chip attachment
- Patent number 6,340,630
- Issue date Jan 22, 2002
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low temperature solder column attach by injection molded solder and...
- Patent number 6,276,596
- Issue date Aug 21, 2001
- International Business Machines Corporation
- Peter A. Gruber
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 6,149,122
- Issue date Nov 21, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for building interconnect structures by injection molded sol...
- Patent number 6,133,633
- Issue date Oct 17, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect for low temperature chip attachment
- Patent number 6,127,735
- Issue date Oct 3, 2000
- International Business Machines Corporation
- Daniel George Berger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
- Publication number 20180233482
- Publication date Aug 16, 2018
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK
- Publication number 20180233483
- Publication date Aug 16, 2018
- International Business Machines Corporation
- David Danovitch
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20120326290
- Publication date Dec 27, 2012
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
MULTISTACK SOLDER WAFER FILLING
- Publication number 20120234902
- Publication date Sep 20, 2012
- International Business Machines Corporation
- S. Jay Chey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...
- Publication number 20120175766
- Publication date Jul 12, 2012
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTISTACK SOLDER WAFER FILLING
- Publication number 20110079632
- Publication date Apr 7, 2011
- International Business Machines Corporation
- S. Jay Chey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SILICON CARRIER OPTOELECTRONIC PACKAGING
- Publication number 20110044369
- Publication date Feb 24, 2011
- International Business Machines Corporation
- Paul S. Andry
- G02 - OPTICS
Information Patent Application
INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...
- Publication number 20100276813
- Publication date Nov 4, 2010
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and Method of Achieving Mechanical and Thermal Stability in...
- Publication number 20100181665
- Publication date Jul 22, 2010
- International Business Machines Corporation
- Jon A. CASEY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
- Publication number 20090294090
- Publication date Dec 3, 2009
- International Business Machines Corporation
- Eric E. Bouchard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...
- Publication number 20080265435
- Publication date Oct 30, 2008
- International Business Machines Corporation
- Sylvie S. Charles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...
- Publication number 20080185703
- Publication date Aug 7, 2008
- International Business Machines Corporation
- Luc Belanger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUES FOR FORMING INTERCONNECTS
- Publication number 20080175939
- Publication date Jul 24, 2008
- International Business Machines Corporation
- David H. Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS
- Publication number 20080156849
- Publication date Jul 3, 2008
- International Business Machines Corporation
- Eric E. Bouchard
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
COMPOSITE INTERCONNECT STRUCTURE USING INJECTION MOLDED SOLDER TECH...
- Publication number 20070178625
- Publication date Aug 2, 2007
- International Business Machines Corporation
- David D. Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Composite solder transfer moldplate structure and method of making...
- Publication number 20060289607
- Publication date Dec 28, 2006
- Stephen L. Buchwalter
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTRICAL COMMONING OF CIRCUITS
- Publication number 20050062493
- Publication date Mar 24, 2005
- International Business Machines Corporation
- David Danovitch
- G01 - MEASURING TESTING
Information Patent Application
IMPROVEMENTS IN GROUNDING AND THERMAL DISSIPATION FOR INTEGRATED CI...
- Publication number 20040233638
- Publication date Nov 25, 2004
- International Business Machines Corporation
- David Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS
- Publication number 20040214420
- Publication date Oct 28, 2004
- International Business Machines Corporation
- Guy Brouillette
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
DUAL-SOLDER FLIP-CHIP SOLDER BUMP
- Publication number 20040175657
- Publication date Sep 9, 2004
- International Business Machines Corporation
- David Danovitch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid molds for molten solder screening process
- Publication number 20020125402
- Publication date Sep 12, 2002
- International Business Machines Corporation
- Steven A. Cordes
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
Bilayer wafer-level underfill
- Publication number 20020109228
- Publication date Aug 15, 2002
- Stephen L. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for direct chip attach by solder bumps and an underfill layer
- Publication number 20020062556
- Publication date May 30, 2002
- International Business Machines Corporation
- Guy P. Brouillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low temperature solder column attach by injection molded solder and...
- Publication number 20020023945
- Publication date Feb 28, 2002
- International Business Machines Corporation
- Peter A. Gruber
- H01 - BASIC ELECTRIC ELEMENTS

David Danovitch

Person

Patents Grantslast 30 patents

Gallium liquid metal embrittlement for device rework

Gallium liquid metal embrittlement for device rework

Method for forming integrated circuit assembly

Silicon carrier optoelectronic packaging

Achieving mechanical and thermal stability in a multi-chip package

Silicon carrier optoelectronic packaging

Achieving mechanical and thermal stability in a multi-chip package

Mold shave apparatus and injection molded soldering process

Injection molded soldering process and arrangement for three-dimens...

Injection molded soldering process and arrangement for three-dimens...

Techniques for forming interconnects

Composite interconnect structure using injection molded solder tech...

Temporary structure to reduce stress and warpage in a flip chip org...

Structure and method for stress reduction in flip chip microelectro...

Temporary structure to reduce stress and warpage in a flip chip org...

Techniques for forming interconnects

Method and apparatus for transferring solder bumps

Method and apparatus for electrical commoning of circuits

Bilayer wafer-level underfill

Dual-solder flip-chip solder bump

Hybrid molds for molten solder screening process

Grounding and thermal dissipation for integrated circuit packages

Method for direct chip attach by solder bumps and an underfill layer

Hybrid molds for molten solder screening process

Method for direct chip attach by solder bumps and an underfill layer

Method for making interconnect for low temperature chip attachment

Low temperature solder column attach by injection molded solder and...

Method for building interconnect structures by injection molded sol...

Method for building interconnect structures by injection molded sol...

Interconnect for low temperature chip attachment

Patents Applicationslast 30 patents

GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK

GALLIUM LIQUID METAL EMBRITTLEMENT FOR DEVICE REWORK

SILICON CARRIER OPTOELECTRONIC PACKAGING

MULTISTACK SOLDER WAFER FILLING

SYSTEM AND METHOD OF ACHIEVING MECHANICAL AND THERMAL STABILITY IN...

MULTISTACK SOLDER WAFER FILLING

SILICON CARRIER OPTOELECTRONIC PACKAGING

INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...

System and Method of Achieving Mechanical and Thermal Stability in...

MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS

STRUCTURE AND METHOD FOR STRESS REDUCTION IN FLIP CHIP MICROELECTRO...

INJECTION MOLDED SOLDERING PROCESS AND ARRANGEMENT FOR THREE-DIMENS...

TECHNIQUES FOR FORMING INTERCONNECTS

MOLD SHAVE APPARATUS AND INJECTION MOLDED SOLDERING PROCESS

COMPOSITE INTERCONNECT STRUCTURE USING INJECTION MOLDED SOLDER TECH...

Composite solder transfer moldplate structure and method of making...

METHOD AND APPARATUS FOR ELECTRICAL COMMONING OF CIRCUITS

IMPROVEMENTS IN GROUNDING AND THERMAL DISSIPATION FOR INTEGRATED CI...

METHOD AND APPARATUS FOR TRANSFERRING SOLDER BUMPS

DUAL-SOLDER FLIP-CHIP SOLDER BUMP

Hybrid molds for molten solder screening process

Bilayer wafer-level underfill

Method for direct chip attach by solder bumps and an underfill layer

Low temperature solder column attach by injection molded solder and...