David Hiner

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 12,159,823
- Issue date Dec 3, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 12,136,565
- Issue date Nov 5, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with routing patch and conductive interconnec...
- Patent number 11,901,335
- Issue date Feb 13, 2024
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 11,848,214
- Issue date Dec 19, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods of manufacturing semiconductor de...
- Patent number 11,694,906
- Issue date Jul 4, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 11,676,941
- Issue date Jun 13, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with front side and back side redistribution...
- Patent number 11,652,038
- Issue date May 16, 2023
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 11,424,155
- Issue date Aug 23, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 11,289,451
- Issue date Mar 29, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 11,094,560
- Issue date Aug 17, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing an encapsulated semiconductor device
- Patent number 11,081,370
- Issue date Aug 3, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,943,858
- Issue date Mar 9, 2021
- Amkor Technology Singapore Holding Pte Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 10,811,277
- Issue date Oct 20, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,784,232
- Issue date Sep 22, 2020
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,714,378
- Issue date Jul 14, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 10,672,740
- Issue date Jun 2, 2020
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,497,674
- Issue date Dec 3, 2019
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 10,461,006
- Issue date Oct 29, 2019
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,312,220
- Issue date Jun 4, 2019
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,283,400
- Issue date May 7, 2019
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,192,816
- Issue date Jan 29, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Trace stacking structure and method
- Patent number 10,128,194
- Issue date Nov 13, 2018
- Amkor Technology, Inc.
- David Jon Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 10,090,234
- Issue date Oct 2, 2018
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with high routing density patch
- Patent number 10,074,630
- Issue date Sep 11, 2018
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 10,032,748
- Issue date Jul 24, 2018
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded component package and fabrication method
- Patent number 10,014,240
- Issue date Jul 3, 2018
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package and manufacturing method thereof
- Patent number 9,966,300
- Issue date May 8, 2018
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and fabricating method thereof
- Patent number 9,852,976
- Issue date Dec 26, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with a plurality of redistribution structures hav...
- Patent number 9,818,684
- Issue date Nov 14, 2017
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Encapsulated semiconductor package
- Patent number 9,812,386
- Issue date Nov 7, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20250038042
- Publication date Jan 30, 2025
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20240266324
- Publication date Aug 8, 2024
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20230343607
- Publication date Oct 26, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230282560
- Publication date Sep 7, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20230154893
- Publication date May 18, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20230040553
- Publication date Feb 9, 2023
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20220223563
- Publication date Jul 14, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20210358770
- Publication date Nov 18, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210217692
- Publication date Jul 15, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...
- Publication number 20210066093
- Publication date Mar 4, 2021
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20210020605
- Publication date Jan 21, 2021
- Amkor Technology Singapore Holding Pte. Ltd
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20200411475
- Publication date Dec 31, 2020
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20200343129
- Publication date Oct 29, 2020
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20200227385
- Publication date Jul 16, 2020
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20200066547
- Publication date Feb 27, 2020
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20190326161
- Publication date Oct 24, 2019
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCAPSULATED SEMICONDUCTOR PACKAGE
- Publication number 20190287818
- Publication date Sep 19, 2019
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190189552
- Publication date Jun 20, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20190115319
- Publication date Apr 18, 2019
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20190043829
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180240744
- Publication date Aug 23, 2018
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20180005987
- Publication date Jan 4, 2018
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE IN PANEL METHOD AND STRUCTURE
- Publication number 20170278810
- Publication date Sep 28, 2017
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20170271307
- Publication date Sep 21, 2017
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20170263544
- Publication date Sep 14, 2017
- Amkor Technology, Inc.
- David Hiner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device Package and Manufacturing Method Thereof
- Publication number 20170186679
- Publication date Jun 29, 2017
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20170133310
- Publication date May 11, 2017
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing a semiconductor package
- Publication number 20170005070
- Publication date Jan 5, 2017
- Amkor Technology, Inc.
- Michael G. Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH
- Publication number 20160307870
- Publication date Oct 20, 2016
- Amkor Technology, Inc.
- Michael Kelly
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUTOR DEVICE WITH THROUGH-SILICON VIA-LESS DEEP WELLS
- Publication number 20150137384
- Publication date May 21, 2015
- Amkor Technology, Inc.
- Ronald Patrick Huemoeller
- H01 - BASIC ELECTRIC ELEMENTS

David Hiner

Person

Patents Grantslast 30 patents

Semiconductor package with front side and back side redistribution...

Semiconductor device package and manufacturing method thereof

Semiconductor package with routing patch and conductive interconnec...

Encapsulated semiconductor package

Semiconductor devices and methods of manufacturing semiconductor de...

Semiconductor package and fabricating method thereof

Semiconductor package with front side and back side redistribution...

Semiconductor device package and manufacturing method thereof

Semiconductor package with high routing density patch

Encapsulated semiconductor package

Methods of manufacturing an encapsulated semiconductor device

Semiconductor package and fabricating method thereof

Encapsulated semiconductor package

Semiconductor package and fabricating method thereof

Semiconductor device package and manufacturing method thereof

Semiconductor package with high routing density patch

Semiconductor package and fabricating method thereof

Encapsulated semiconductor package

Semiconductor package and fabricating method thereof

Semiconductor device package and manufacturing method thereof

Semiconductor package and fabricating method thereof

Trace stacking structure and method

Semiconductor device package and manufacturing method thereof

Semiconductor package with high routing density patch

Semiconductor package and fabricating method thereof

Embedded component package and fabrication method

Semiconductor device package and manufacturing method thereof

Semiconductor package and fabricating method thereof

Electronic device with a plurality of redistribution structures hav...

Encapsulated semiconductor package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR DEVICES AND METHODS OF MANUFACTURING SEMICONDUCTOR DE...

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE AND MANUFACTURING METHOD THEREOF

ENCAPSULATED SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

EMBEDDED DIE IN PANEL METHOD AND STRUCTURE

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF

Semiconductor Device Package and Manufacturing Method Thereof

SEMICONDUCTOR PACKAGE AND FABRICATING METHOD THEREOF

Method of manufacturing a semiconductor package

SEMICONDUCTOR PACKAGE WITH HIGH ROUTING DENSITY PATCH

SEMICONDUTOR DEVICE WITH THROUGH-SILICON VIA-LESS DEEP WELLS