David L. Dickerson

Person

  • Boise, ID, US

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    A method of forming semiconductor structures

    • Publication number 20060234469
    • Publication date Oct 19, 2006
    • Micron Technology, Inc.
    • David L. Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolation region forming methods

    • Publication number 20040241957
    • Publication date Dec 2, 2004
    • Micron Technology, Inc.
    • David L. Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolation region forming methods

    • Publication number 20030032258
    • Publication date Feb 13, 2003
    • David L Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolation region forming methods

    • Publication number 20030022459
    • Publication date Jan 30, 2003
    • David L Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolating region forming methods

    • Publication number 20020089034
    • Publication date Jul 11, 2002
    • David L Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolation region forming methods

    • Publication number 20020070422
    • Publication date Jun 13, 2002
    • David L Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolation Region forming methods

    • Publication number 20010012676
    • Publication date Aug 9, 2001
    • David L Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Isolation region forming methods

    • Publication number 20010009798
    • Publication date Jul 26, 2001
    • David L. Dickerson
    • H01 - BASIC ELECTRIC ELEMENTS