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David N. Walter
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Richardson, TX, US
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Patents Grants
last 30 patents
Information
Patent Grant
Method for fabricating array-molded package-on-package
Patent number
8,574,967
Issue date
Nov 5, 2013
Texas Instruments Incorporated
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Array-molded package-on-package having redistribution lines
Patent number
8,304,285
Issue date
Nov 6, 2012
Texas Instruments Incorporated
Mark A. Gerber
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Array molded package-on-package having redistribution lines
Patent number
7,944,034
Issue date
May 17, 2011
Texas Instruments Incorporated
Mark A. Gerber
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Controlling flip-chip techniques for concurrent ball bonds in semic...
Patent number
7,776,653
Issue date
Aug 17, 2010
Texas Instruments Incorporated
David N. Walter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Controlling flip-chip techniques for concurrent ball bonds in semic...
Patent number
7,573,137
Issue date
Aug 11, 2009
Texas Instruments Incorporated
David N. Walter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Two-metal layer ball grid array and chip scale package having local...
Patent number
6,717,276
Issue date
Apr 6, 2004
Texas Instruments Incorporated
David N. Walter
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
HID land grid array packaged device having electrical and optical i...
Patent number
6,707,124
Issue date
Mar 16, 2004
Texas Instruments Incorporated
Kurt P. Wachtler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip integrated circuit module
Patent number
6,400,573
Issue date
Jun 4, 2002
Texas Instruments Incorporated
Larry J. Mowatt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
HDI land grid array packaged device having electrical and optical i...
Patent number
6,274,391
Issue date
Aug 14, 2001
Texas Instruments Incorporated
Kurt P. Wachtler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip integrated circuit module
Patent number
5,432,677
Issue date
Jul 11, 1995
Texas Instruments Incorporated
Larry J. Mowatt
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip integrated circuit module and method for fabrication the...
Patent number
5,306,670
Issue date
Apr 26, 1994
Texas Instruments Incorporated
Larry J. Mowatt
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Method for Fabricating Array-Molded Package-on-Package
Publication number
20140030851
Publication date
Jan 30, 2014
TEXAS INSTRUMENTS INCORPORATED
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating Array-Molded Package-on-Package
Publication number
20130189814
Publication date
Jul 25, 2013
TEXAS INSTRUMENTS INCORPORATED
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Array-Molded Package-On-Package Having Redistribution Lines
Publication number
20110183465
Publication date
Jul 28, 2011
TEXAS INSTRUMENTS INCORPORATED
Mark A. GERBER
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating Array-Molded Package-on-Package
Publication number
20110165731
Publication date
Jul 7, 2011
TEXAS INSTRUMENTS INCORPORATED
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semic...
Publication number
20090269883
Publication date
Oct 29, 2009
TEXAS INSTRUMENTS INCORPORATED
David N. Walter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Array molded package-on-package having redistribution lines
Publication number
20080315385
Publication date
Dec 25, 2008
TEXAS INSTRUMENTS INCORPORATED
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for Fabricating Array-Molded Package-On-Package
Publication number
20080284045
Publication date
Nov 20, 2008
TEXAS INSTRUMENTS INCORPORATED
Mark A. Gerber
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Controlling Flip-Chip Techniques for Concurrent Ball Bonds in Semic...
Publication number
20070228543
Publication date
Oct 4, 2007
TEXAS INSTRUMENTS INCORPORATED
David N. Walter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Two-metal layer ball grid array and chip scale package having local...
Publication number
20040217486
Publication date
Nov 4, 2004
David N. Walter
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
TWO-METAL LAYER BALL GRID ARRAY AND CHIP SCALE PACKAGE HAVING LOCAL...
Publication number
20040046265
Publication date
Mar 11, 2004
David N. Walter
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Application
HID land grid array packaged device having electrical and optical i...
Publication number
20010035576
Publication date
Nov 1, 2001
Kurt P. Wachtler
H01 - BASIC ELECTRIC ELEMENTS