Number | Name | Date | Kind |
---|---|---|---|
3881971 | Greer et al. | May 1975 | |
3903590 | Yokogawa | Sep 1975 | |
4245273 | Feinberg et al. | Jan 1981 | |
4544989 | Nakabu et al. | Oct 1985 | |
4554229 | Small, Jr. | Nov 1985 | |
4617085 | Cole, Jr. et al. | Oct 1986 | |
4714516 | Eichelberger et al. | Dec 1987 | |
4725504 | Knudsen et al. | Feb 1988 | |
4752816 | Sussman et al. | Jun 1988 | |
4764485 | Loughran et al. | Aug 1988 | |
4780177 | Wojnarowski et al. | Oct 1988 | |
4783695 | Eichelberger et al. | Nov 1988 | |
4798918 | Kabadi et al. | Jan 1989 | |
4806395 | Walsh | Feb 1989 | |
4816422 | Yerman et al. | Mar 1989 | |
4824716 | Yerman | Apr 1989 | |
4835704 | Eichelberger et al. | May 1989 | |
4842677 | Wojnarowski et al. | Jun 1989 | |
4857382 | Liu et al. | Aug 1989 | |
4866508 | Eichelberger et al. | Sep 1989 | |
4878991 | Eichelberger et al. | Nov 1989 | |
4882200 | Liu et al. | Nov 1989 | |
4884122 | Eichelberger et al. | Nov 1989 | |
4894115 | Eichelberger et al. | Jan 1990 | |
4897153 | Cole et al. | Jan 1990 | |
4901136 | Neugebauer et al. | Feb 1990 | |
5048179 | Shindo et al. | Sep 1991 | |
5049978 | Bates et al. | Sep 1991 | |
5081563 | Feng et al. | Jan 1992 | |
5093879 | Bregman et al. | Mar 1992 | |
5144747 | Eichelberger et al. | Sep 1992 | |
5151776 | Wojnarowski et al. | Sep 1992 | |
5157255 | Kornrumof et al. | Oct 1992 | |
5161093 | Gorczyca et al. | Nov 1992 | |
5196371 | Kulesza et al. | Mar 1993 | |
5200631 | Austin et al. | Apr 1993 | |
5206712 | Kornrumpf et al. | Apr 1993 | |
5237434 | Feldman et al. | Aug 1993 | |
5241456 | Marcinkiewicz et al. | Aug 1993 | |
5249245 | Lebby et al. | Sep 1993 | |
5250843 | Eichelberger | Oct 1993 | |
5262351 | Bureau et al. | Nov 1993 | |
5355102 | Kornrumpf et al. | Oct 1994 |
Number | Date | Country |
---|---|---|
2810054 | Sep 1978 | DE |
2130794 | Jun 1984 | GB |
58-218176 | Dec 1983 | JP |
63-293965 | Nov 1988 | JP |
Entry |
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GE Technical Information Series; “The STD Process-New Developments and Applications”, R.J. Clark et al., Aug. '74.* |
Proceeding of ISHM; “High Density Interconnects Using Laser Lithography”, Levinson et al., Oct. '88.* |
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