David W. Porter

Person

Sherwood, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 11,549,192
- Issue date Jan 10, 2023
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective deposition with atomic layer etch reset
- Patent number 10,998,187
- Issue date May 4, 2021
- Lam Research Corporation
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 10,954,605
- Issue date Mar 23, 2021
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 10,920,335
- Issue date Feb 16, 2021
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wetting pretreatment for enhanced damascene metal filling
- Patent number 10,840,101
- Issue date Nov 17, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 10,662,545
- Issue date May 26, 2020
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective deposition with atomic layer etch reset
- Patent number 10,559,461
- Issue date Feb 11, 2020
- Lam Research Corporation
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
TSV bath evaluation using field versus feature contrast
- Patent number 10,508,359
- Issue date Dec 17, 2019
- Lam Research Corporation
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and process for wafer level packaging
- Patent number 10,309,024
- Issue date Jun 4, 2019
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bubble and foam solutions using a completely immersed air-free feed...
- Patent number 10,208,395
- Issue date Feb 19, 2019
- Lam Research Corporation
- Richard Abraham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 10,106,907
- Issue date Oct 23, 2018
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatuses for cleaning electroplating substrate holders
- Patent number 10,092,933
- Issue date Oct 9, 2018
- Novellus Systems, Inc.
- Santosh Kumar
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 10,023,970
- Issue date Jul 17, 2018
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus for tailored uniformity profile
- Patent number 10,017,869
- Issue date Jul 10, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electroplating apparatus and process for wafer level packaging
- Patent number 9,982,357
- Issue date May 29, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for advanced packaging applications
- Patent number 9,899,230
- Issue date Feb 20, 2018
- Novellus Systems, Inc.
- Bryan L. Buckalew
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for remote plasma treatment for reducing metal...
- Patent number 9,865,501
- Issue date Jan 9, 2018
- Lam Research Corporation
- Tighe A. Spurlin
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Wetting pretreatment for enhanced damascene metal filling
- Patent number 9,852,913
- Issue date Dec 26, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 9,834,852
- Issue date Dec 5, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Dynamic current distribution control apparatus and method for wafer...
- Patent number 9,822,461
- Issue date Nov 21, 2017
- Novellus Systems, Inc.
- Zhian He
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for electroplating semiconductor wafer when co...
- Patent number 9,816,196
- Issue date Nov 14, 2017
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Apparatus for wetting pretreatment for enhanced damascene metal fil...
- Patent number 9,721,800
- Issue date Aug 1, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
TSV bath evaluation using field versus feature contrast
- Patent number 9,689,083
- Issue date Jun 27, 2017
- Lam Research Corporation
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrofill vacuum plating cell
- Patent number 9,677,188
- Issue date Jun 13, 2017
- Novellus Systems, Inc.
- R. Marshall Stowell
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Bubble and foam solutions using a completely immersed air-free feed...
- Patent number 9,617,652
- Issue date Apr 11, 2017
- Lam Research Corporation
- Richard Abraham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Protecting anodes from passivation in alloy plating systems
- Patent number 9,534,308
- Issue date Jan 3, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Enhancement of electrolyte hydrodynamics for efficient mass transfe...
- Patent number 9,523,155
- Issue date Dec 20, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Control of electrolyte hydrodynamics for efficient mass transfer du...
- Patent number 9,464,361
- Issue date Oct 11, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Wet etching methods for copper removal and planarization in semicon...
- Patent number 9,447,505
- Issue date Sep 20, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatus for advanced packaging applications
- Patent number 9,449,808
- Issue date Sep 20, 2016
- Novellus Systems, Inc.
- Bryan L. Buckalew
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
CONTROL OF WAFER BOW DURING INTEGRATED CIRCUIT PROCESSING
- Publication number 20230136819
- Publication date May 4, 2023
- LAM RESEARCH CORPORATION
- David W. Porter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20210148001
- Publication date May 20, 2021
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET
- Publication number 20200118809
- Publication date Apr 16, 2020
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS
- Publication number 20180371637
- Publication date Dec 27, 2018
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20180350670
- Publication date Dec 6, 2018
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET
- Publication number 20180308680
- Publication date Oct 25, 2018
- LAM RESEARCH CORPORATION
- Kapu Sirish Reddy
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20180291517
- Publication date Oct 11, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20180237933
- Publication date Aug 23, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING
- Publication number 20180138044
- Publication date May 17, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...
- Publication number 20180105949
- Publication date Apr 19, 2018
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20180057955
- Publication date Mar 1, 2018
- Novellus Systems, Inc.
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...
- Publication number 20180030611
- Publication date Feb 1, 2018
- Novellus Systems, Inc.
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST
- Publication number 20170241041
- Publication date Aug 24, 2017
- LAM RESEARCH CORPORATION
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
BUBBLE AND FOAM SOLUTIONS USING A COMPLETELY IMMERSED AIR-FREE FEED...
- Publication number 20170167045
- Publication date Jun 15, 2017
- LAM RESEARCH CORPORATION
- Richard Abraham
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS
- Publication number 20170137960
- Publication date May 18, 2017
- Novellus Systems, Inc.
- Lee Peng Chua
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...
- Publication number 20170096745
- Publication date Apr 6, 2017
- Novellus Systems, Inc.
- Zhian HE
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...
- Publication number 20170029973
- Publication date Feb 2, 2017
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DU...
- Publication number 20160376722
- Publication date Dec 29, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20160343582
- Publication date Nov 24, 2016
- Novellus Systems, Inc.
- Bryan L. BUCKALEW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING
- Publication number 20160312373
- Publication date Oct 27, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20160115611
- Publication date Apr 28, 2016
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING
- Publication number 20150376792
- Publication date Dec 31, 2015
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE ME...
- Publication number 20150299886
- Publication date Oct 22, 2015
- LAM RESEARCH CORPORATION
- Natalia V. Doubina
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...
- Publication number 20150267306
- Publication date Sep 24, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING
- Publication number 20150179458
- Publication date Jun 25, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FIL...
- Publication number 20150096883
- Publication date Apr 9, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...
- Publication number 20150072538
- Publication date Mar 12, 2015
- LAM RESEARCH CORPORATION
- Tighe A. Spurlin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE
- Publication number 20150060291
- Publication date Mar 5, 2015
- Novellus Systems, Inc.
- Steven T. Mayer
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST
- Publication number 20140367279
- Publication date Dec 18, 2014
- LAM RESEARCH CORPORATION
- Lee Brogan
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS FOR ADVANCED PACKAGING APPLICATIONS
- Publication number 20140357089
- Publication date Dec 4, 2014
- Novellus Systems, Inc.
- Bryan L. BUCKALEW
- H01 - BASIC ELECTRIC ELEMENTS

David W. Porter

Person

Patents Grantslast 30 patents

Electroplating apparatus for tailored uniformity profile

Selective deposition with atomic layer etch reset

Protecting anodes from passivation in alloy plating systems

Electroplating apparatus for tailored uniformity profile

Wetting pretreatment for enhanced damascene metal filling

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Selective deposition with atomic layer etch reset

TSV bath evaluation using field versus feature contrast

Electroplating apparatus and process for wafer level packaging

Bubble and foam solutions using a completely immersed air-free feed...

Protecting anodes from passivation in alloy plating systems

Methods and apparatuses for cleaning electroplating substrate holders

Dynamic current distribution control apparatus and method for wafer...

Electroplating apparatus for tailored uniformity profile

Electroplating apparatus and process for wafer level packaging

Apparatus for advanced packaging applications

Method and apparatus for remote plasma treatment for reducing metal...

Wetting pretreatment for enhanced damascene metal filling

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Dynamic current distribution control apparatus and method for wafer...

Method and apparatus for electroplating semiconductor wafer when co...

Apparatus for wetting pretreatment for enhanced damascene metal fil...

TSV bath evaluation using field versus feature contrast

Electrofill vacuum plating cell

Bubble and foam solutions using a completely immersed air-free feed...

Protecting anodes from passivation in alloy plating systems

Enhancement of electrolyte hydrodynamics for efficient mass transfe...

Control of electrolyte hydrodynamics for efficient mass transfer du...

Wet etching methods for copper removal and planarization in semicon...

Apparatus for advanced packaging applications

Patents Applicationslast 30 patents

CONTROL OF WAFER BOW DURING INTEGRATED CIRCUIT PROCESSING

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...

SELECTIVE DEPOSITION WITH ATOMIC LAYER ETCH RESET

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING

WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING

ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

METHOD AND APPARATUS FOR ELECTROPLATING SEMICONDUCTOR WAFER WHEN CO...

TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST

BUBBLE AND FOAM SOLUTIONS USING A COMPLETELY IMMERSED AIR-FREE FEED...

PROTECTING ANODES FROM PASSIVATION IN ALLOY PLATING SYSTEMS

DYNAMIC CURRENT DISTRIBUTION CONTROL APPARATUS AND METHOD FOR WAFER...

ENHANCEMENT OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFE...

CONTROL OF ELECTROLYTE HYDRODYNAMICS FOR EFFICIENT MASS TRANSFER DU...

APPARATUS FOR ADVANCED PACKAGING APPLICATIONS

ELECTROPLATING APPARATUS AND PROCESS FOR WAFER LEVEL PACKAGING

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

ATMOSPHERIC PLASMA APPARATUS FOR SEMICONDUCTOR PROCESSING

METHOD AND APPARATUS FOR PREPARING A SUBSTRATE WITH A SEMI-NOBLE ME...

WET ETCHING METHODS FOR COPPER REMOVAL AND PLANARIZATION IN SEMICON...

WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FILLING

APPARATUS FOR WETTING PRETREATMENT FOR ENHANCED DAMASCENE METAL FIL...

METHOD AND APPARATUS FOR REMOTE PLASMA TREATMENT FOR REDUCING METAL...

ELECTROPLATING APPARATUS FOR TAILORED UNIFORMITY PROFILE

TSV BATH EVALUATION USING FIELD VERSUS FEATURE CONTRAST

APPARATUS FOR ADVANCED PACKAGING APPLICATIONS