Debabrata Gupta

Person

Scottsdale, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Interconnect structure
- Patent number 9,496,236
- Issue date Nov 15, 2016
- Tessera, Inc.
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure
- Patent number 8,853,558
- Issue date Oct 7, 2014
- Tessera, Inc.
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assemblies comprising ceramic/organic hybrid substrate w...
- Patent number 7,535,728
- Issue date May 19, 2009
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming copper layers
- Patent number 7,413,936
- Issue date Aug 19, 2008
- Intel Corporation
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data processing system comprising ceramic/organic hybrid substrate...
- Patent number 7,120,031
- Issue date Oct 10, 2006
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost programmable CPU package/substrate
- Patent number 7,005,727
- Issue date Feb 28, 2006
- Intel Corporation
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic assembly comprising ceramic/organic hybrid substrate wit...
- Patent number 6,775,150
- Issue date Aug 10, 2004
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process for providing interconnect bumps on a bonding pad by applic...
- Patent number 5,567,648
- Issue date Oct 22, 1996
- Motorola, Inc.
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reflow of multi-layer metal bumps
- Patent number 5,451,274
- Issue date Sep 19, 1995
- Motorola, Inc.
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding a semiconductor substrate to a support substrate...
- Patent number 5,341,979
- Issue date Aug 30, 1994
- Motorola, Inc.
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multiple integrated circuit module which simplifies handling and te...
- Patent number 5,198,963
- Issue date Mar 30, 1993
- Motorola, Inc.
- Debabrata Gupta
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20150014850
- Publication date Jan 15, 2015
- Tessera, Inc.
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT STRUCTURE
- Publication number 20120145442
- Publication date Jun 14, 2012
- Tessera Research LLC
- Debabrata Gupta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC ASSEMBLIES COMPRISING CERAMIC/ORGANIC HYBRID SUBSTRATE W...
- Publication number 20060279940
- Publication date Dec 14, 2006
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low cost programmable CPU package/substrate
- Publication number 20060060946
- Publication date Mar 23, 2006
- Intel Corporation
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic assembly comprising ceramic/organic hybrid substrate wit...
- Publication number 20040238942
- Publication date Dec 2, 2004
- Intel Corporation
- Kishore K. Chakravorty
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low cost programmable CPU package/substrate
- Publication number 20040004232
- Publication date Jan 8, 2004
- Hamid Azimi
- H01 - BASIC ELECTRIC ELEMENTS

Debabrata Gupta

Person

Patents Grantslast 30 patents

Interconnect structure

Interconnect structure

Electronic assemblies comprising ceramic/organic hybrid substrate w...

Method of forming copper layers

Data processing system comprising ceramic/organic hybrid substrate...

Low cost programmable CPU package/substrate

Electronic assembly comprising ceramic/organic hybrid substrate wit...

Process for providing interconnect bumps on a bonding pad by applic...

Reflow of multi-layer metal bumps

Method of bonding a semiconductor substrate to a support substrate...

Multiple integrated circuit module which simplifies handling and te...

Patents Applicationslast 30 patents

INTERCONNECT STRUCTURE

INTERCONNECT STRUCTURE

ELECTRONIC ASSEMBLIES COMPRISING CERAMIC/ORGANIC HYBRID SUBSTRATE W...

Low cost programmable CPU package/substrate

Electronic assembly comprising ceramic/organic hybrid substrate wit...

Low cost programmable CPU package/substrate