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Patents Grants
last 30 patents
Information
Patent Grant
Pad structure design in fan-out package
Patent number
11,984,405
Issue date
May 14, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package dielectric substrate including a trench
Patent number
11,961,796
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yueh-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Via for semiconductor device connection and methods of forming the...
Patent number
11,961,800
Issue date
Apr 16, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,955,401
Issue date
Apr 9, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor devices
Patent number
11,935,836
Issue date
Mar 19, 2024
Taiwan Semiconductor Manufacturing Company, Ltd
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages with metal line crack prevention design
Patent number
11,862,606
Issue date
Jan 2, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution structure for integrated circuit package and method...
Patent number
11,854,994
Issue date
Dec 26, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layer structures for integrated circuit package
Patent number
11,848,271
Issue date
Dec 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd
Jie Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure
Patent number
11,842,983
Issue date
Dec 12, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure and manufacturing method thereof
Patent number
11,837,587
Issue date
Dec 5, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Stacked semiconductor devices and methods of forming same
Patent number
11,823,912
Issue date
Nov 21, 2023
Taiwan Semiconductor Manufacturing Company Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package for thermal dissipation
Patent number
11,804,475
Issue date
Oct 31, 2023
Taiwan Semiconductor Manufacturing Company
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Alignment mark design for packages
Patent number
11,742,298
Issue date
Aug 29, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Li-Hsien Huang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method
Patent number
11,728,249
Issue date
Aug 15, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit package pad and methods of forming
Patent number
11,721,559
Issue date
Aug 8, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Packages and methods of forming packages
Patent number
11,715,727
Issue date
Aug 1, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor structure having a sensor device and method of manufa...
Patent number
11,682,654
Issue date
Jun 20, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-stacked package-on-package structures
Patent number
11,664,322
Issue date
May 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of forming the same
Patent number
11,652,063
Issue date
May 16, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Raised via for terminal connections on different planes
Patent number
11,646,220
Issue date
May 9, 2023
Taiwan Semiconductor Manufacturing Company
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Wafer level chip scale packaging intermediate structure apparatus a...
Patent number
11,631,611
Issue date
Apr 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure
Patent number
11,626,341
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fan-out structure and method of fabricating the same
Patent number
11,626,296
Issue date
Apr 11, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Opening in the pad for bonding integrated passive device in InFO pa...
Patent number
11,612,057
Issue date
Mar 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package for thermal dissipation
Patent number
11,594,520
Issue date
Feb 28, 2023
Taiwan Semiconductor Manufacturing Company
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package structure including IPD and method of forming the same
Patent number
11,587,900
Issue date
Feb 21, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Hua-Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with metal-insulator-metal capacitor and method of manufact...
Patent number
11,581,250
Issue date
Feb 14, 2023
Taiwan Semiconductor Manufacturing Company, Ltd
Shuo-Mao Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electric magnetic shielding structure in packages
Patent number
11,532,567
Issue date
Dec 20, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and manufacturing method thereof
Patent number
11,515,229
Issue date
Nov 29, 2022
Taiwan Semiconductor Manufacturing Company, Ltd
Wei-Chih Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Redistribution layers in semiconductor packages and methods of form...
Patent number
11,508,695
Issue date
Nov 22, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE AND METHODS OF MANUFACTURING
Publication number
20240128211
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chih-Wei WU
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240128218
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Pin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND METHOD OF FORMING THE SAME
Publication number
20240128143
Publication date
Apr 18, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Chia-Han Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20240096811
Publication date
Mar 21, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Kuan-Chung Lu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGES WITH METAL LINE CRACK PREVENTION DESIGN
Publication number
20240088104
Publication date
Mar 14, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Redistribution Layer Structures for Integrated Circuit Package
Publication number
20240079324
Publication date
Mar 7, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Jie CHEN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240072021
Publication date
Feb 29, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME
Publication number
20240063030
Publication date
Feb 22, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Hung-Pin Chang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR STRUCTURE AND MANUFACTURING METHOD THEREOF
Publication number
20240055311
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Yueh-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20240055371
Publication date
Feb 15, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Package and Method of Forming the Same
Publication number
20240047417
Publication date
Feb 8, 2024
Taiwan Semiconductor Manufacturing Co., Ltd.
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20240030186
Publication date
Jan 25, 2024
Taiwan Semiconductor Manufacturing Company, Ltd.
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Methods of Forming Packages and Resulting Structures
Publication number
20230402429
Publication date
Dec 14, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chien-Fu Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED SEMICONDUCTOR DEVICES AND METHODS OF FORMING SAME
Publication number
20230386864
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
Publication number
20230386989
Publication date
Nov 30, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yueh-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20230378012
Publication date
Nov 23, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Integrated Circuit Packages and Methods of Forming the Same
Publication number
20230335534
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Der-Chyang Yeh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGES
Publication number
20230335471
Publication date
Oct 19, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Wei-Yu Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT PACKAGES AND METHODS OF FORMING THE SAME
Publication number
20230282614
Publication date
Sep 7, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Cheng-Hsien Hsieh
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fan-Out Structure and Method of Fabricating the Same
Publication number
20230245903
Publication date
Aug 3, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Wafer Level Chip Scale Packaging Intermediate Structure Apparatus a...
Publication number
20230245923
Publication date
Aug 3, 2023
Taiwan Semiconductor Manufacturing Co, LTD.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE
Publication number
20230215774
Publication date
Jul 6, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Shih-Hui Wang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package for Thermal Dissipation
Publication number
20230207531
Publication date
Jun 29, 2023
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE INCLUDING IPD AND METHOD OF FORMING THE SAME
Publication number
20230154881
Publication date
May 18, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Hua-Wei Tseng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE DIELECTRIC SUSBTRATE INCLUDING A TRENCH
Publication number
20230068082
Publication date
Mar 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yueh-Ting Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF
Publication number
20230054020
Publication date
Feb 23, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Wei-Chih Lai
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE STRUCTURE WITH BRIDGE DIE AND METHOD OF FORMING THE SAME
Publication number
20230036283
Publication date
Feb 2, 2023
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DEVICES
Publication number
20220384350
Publication date
Dec 1, 2022
Taiwan Semiconductor Manufacturing Company, Ltd.
Yu-Hung Lin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Stacked Semiconductor Devices and Methods of Forming Same
Publication number
20220375767
Publication date
Nov 24, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Hsien-Wei Chen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
REDISTRIBUTION STRUCTURE FOR INTEGRATED CIRCUIT PACKAGE AND METHOD...
Publication number
20220367374
Publication date
Nov 17, 2022
Taiwan Semiconductor Manufacturing Co., Ltd.
Chen-Hua Yu
H01 - BASIC ELECTRIC ELEMENTS