Devendra Natekar

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,518,750
- Issue date Aug 27, 2013
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,409,924
- Issue date Apr 2, 2013
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 8,227,907
- Issue date Jul 24, 2012
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible interconnect pattern on semiconductor package
- Patent number 7,915,081
- Issue date Mar 29, 2011
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched interposer for integrated circuit devices
- Patent number 7,592,704
- Issue date Sep 22, 2009
- Intel Corporation
- Terry L. Sterrett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin silicon based substrate
- Patent number 7,589,424
- Issue date Sep 15, 2009
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit die containing particle-filled through-silicon m...
- Patent number 7,528,006
- Issue date May 5, 2009
- Intel Corporation
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Horizontal Carbon Nanotubes by Vertical Growth and Rolling
- Patent number 7,514,116
- Issue date Apr 7, 2009
- Intel Corporation
- Devendra Natekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thin silicon based substrate
- Patent number 7,443,030
- Issue date Oct 28, 2008
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etched interposer for integrated circuit devices
- Patent number 7,413,995
- Issue date Aug 19, 2008
- Intel Corporation
- Terry L. Sterrett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming through-silicon vias with stress buffer collars a...
- Patent number 7,402,515
- Issue date Jul 22, 2008
- Intel Corporation
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and devices for supporting substrates using fluids
- Patent number 7,144,299
- Issue date Dec 5, 2006
- Intel Corporation
- Leonel R. Arana
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing of thin based substrate
- Patent number 7,049,208
- Issue date May 23, 2006
- Intel Corporation
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20130122656
- Publication date May 16, 2013
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20120289002
- Publication date Nov 15, 2012
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE
- Publication number 20110103438
- Publication date May 5, 2011
- Intel Corporation
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particale-filled through-silicon...
- Publication number 20100193952
- Publication date Aug 5, 2010
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING...
- Publication number 20090072013
- Publication date Mar 19, 2009
- DEVENDRA NATEKAR
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thin Silicon based substrate
- Publication number 20080303159
- Publication date Dec 11, 2008
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ETCHED INTERPOSER FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20080265391
- Publication date Oct 30, 2008
- Terry L. STERRETT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming through-silicon vias with stress buffer collars a...
- Publication number 20080251932
- Publication date Oct 16, 2008
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flexible interconnect pattern on semiconductor package
- Publication number 20070231953
- Publication date Oct 4, 2007
- Yoshihiro Tomita
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Nano-scale particle paste for wiring microelectronic devices using...
- Publication number 20070152194
- Publication date Jul 5, 2007
- Intel Corporation
- Devendra Natekar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stacked die package with thermally conductive block embedded in sub...
- Publication number 20070090517
- Publication date Apr 26, 2007
- Sung-won Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit die containing particle-filled through-silicon m...
- Publication number 20070001266
- Publication date Jan 4, 2007
- Leonel Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method to operate on one or more attach sites in die...
- Publication number 20070000592
- Publication date Jan 4, 2007
- Intel Corporation
- Farokh Fares
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of forming through-silicon vias with stress buffer collars a...
- Publication number 20060290002
- Publication date Dec 28, 2006
- Leonel R. Arana
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS
- Publication number 20060252354
- Publication date Nov 9, 2006
- Leonel R. Arana
- B24 - GRINDING POLISHING
Information Patent Application
Thin silicon based substrate
- Publication number 20060189121
- Publication date Aug 24, 2006
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING OF THIN BASED SUBSTRATE
- Publication number 20060079079
- Publication date Apr 13, 2006
- Sriram Muthukumar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thinning semiconductor wafers
- Publication number 20060046433
- Publication date Mar 2, 2006
- Terry L. Sterrett
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Etched interposer for integrated circuit devices
- Publication number 20060038303
- Publication date Feb 23, 2006
- Terry L. Sterrett
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Devendra Natekar

Person

Patents Grantslast 30 patents

Flexible interconnect pattern on semiconductor package

Flexible interconnect pattern on semiconductor package

Flexible interconnect pattern on semiconductor package

Flexible interconnect pattern on semiconductor package

Etched interposer for integrated circuit devices

Thin silicon based substrate

Integrated circuit die containing particle-filled through-silicon m...

Horizontal Carbon Nanotubes by Vertical Growth and Rolling

Thin silicon based substrate

Etched interposer for integrated circuit devices

Method of forming through-silicon vias with stress buffer collars a...

Methods and devices for supporting substrates using fluids

Method of manufacturing of thin based substrate

Patents Applicationslast 30 patents

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

FLEXIBLE INTERCONNECT PATTERN ON SEMICONDUCTOR PACKAGE

Integrated circuit die containing particale-filled through-silicon...

NANO-SCALE PARTICLE PASTE FOR WIRING MICROELECTRONIC DEVICES USING...

Thin Silicon based substrate

ETCHED INTERPOSER FOR INTEGRATED CIRCUIT DEVICES

Method of forming through-silicon vias with stress buffer collars a...

Flexible interconnect pattern on semiconductor package

Nano-scale particle paste for wiring microelectronic devices using...

Stacked die package with thermally conductive block embedded in sub...

Integrated circuit die containing particle-filled through-silicon m...

Apparatus and method to operate on one or more attach sites in die...

Method of forming through-silicon vias with stress buffer collars a...

METHODS AND DEVICES FOR SUPPORTING SUBSTRATES USING FLUIDS

Thin silicon based substrate

METHOD OF MANUFACTURING OF THIN BASED SUBSTRATE

Thinning semiconductor wafers

Etched interposer for integrated circuit devices