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Devin Alexander Mourey

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  • Corvallis, OR, US
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Patents Grantslast 30 patents

  • Information Patent Grant

    Three-dimensional features formed in molded panel
    • Patent number 11,807,523
    • Issue date Nov 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microfluidic device with manifold
    • Patent number 11,597,646
    • Issue date Mar 7, 2023
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Molded printhead
    • Patent number 11,541,659
    • Issue date Jan 3, 2023
    • Hewlett-Packard Development Company, L.P.
    • Silam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Plurality of filters
    • Patent number 11,440,009
    • Issue date Sep 13, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microfluidic device with capillary chamber
    • Patent number 11,440,008
    • Issue date Sep 13, 2022
    • Hewlett-Packard Development Company, L.P.
    • Devin Alexander Mourey
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Monolithic carrier structure including fluid routing for digital di...
    • Patent number 11,383,230
    • Issue date Jul 12, 2022
    • Hewlett-Packard Development Company, L.P.
    • Jeffrey A. Nielsen
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Grant

    Monolithic carrier structure for digital dispensing
    • Patent number 11,364,492
    • Issue date Jun 21, 2022
    • Hewlett-Packard Development Company, L.P.
    • Jeffrey A. Nielsen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Print head interposers
    • Patent number 11,325,378
    • Issue date May 10, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Method of preparing test samples
    • Patent number 11,326,200
    • Issue date May 10, 2022
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
  • Information Patent Grant

    Surface enhanced luminescence analyte interrogation stage with sacr...
    • Patent number 11,199,499
    • Issue date Dec 14, 2021
    • Hewlett-Packard Development Company, L.P.
    • Milo Overbay
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Three-dimensional features formed in molded panel
    • Patent number 11,148,942
    • Issue date Oct 19, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Printhead assembly
    • Patent number 11,117,376
    • Issue date Sep 14, 2021
    • Hewlett-Packard Development Company, L.P.
    • Si-lam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Complex impedance detection
    • Patent number 11,090,929
    • Issue date Aug 17, 2021
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Grant

    Liquid level sensing
    • Patent number 11,046,084
    • Issue date Jun 29, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Print head interposers
    • Patent number 10,836,162
    • Issue date Nov 17, 2020
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Molded printhead
    • Patent number 10,836,169
    • Issue date Nov 17, 2020
    • Hewlett-Packard Development Company, L.P.
    • Silam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Frame layer receiving a substrate supported SEL stage
    • Patent number 10,830,704
    • Issue date Nov 10, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Composite wafers
    • Patent number 10,815,121
    • Issue date Oct 27, 2020
    • Hewlett-Packard Development Company, L.P.
    • Si-lam J. Choy
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Microelectromechanical system (MEMS) devices
    • Patent number 10,640,369
    • Issue date May 5, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Grant

    Substrate supported SEL stage and housing
    • Patent number 10,557,798
    • Issue date Feb 11, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G01 - MEASURING TESTING
  • Information Patent Grant

    Fluid level sensing with protective member
    • Patent number 10,493,766
    • Issue date Dec 3, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead electrical interconnects
    • Patent number 10,479,085
    • Issue date Nov 19, 2019
    • Hewlett-Packard Development Company, L.P.
    • Devin Alexander Mourey
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printer circuit board fluid ejection apparatus
    • Patent number 10,427,407
    • Issue date Oct 1, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Fluid ejection die and plastic-based substrate
    • Patent number 10,421,278
    • Issue date Sep 24, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Overmolded ink delivery device
    • Patent number 10,377,142
    • Issue date Aug 13, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Service structures in print heads
    • Patent number 10,369,793
    • Issue date Aug 6, 2019
    • Hewlett-Packard Development Company, L.P.
    • Devin Alexander Mourey
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead with bond pad surrounded by dam
    • Patent number 10,232,619
    • Issue date Mar 19, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead with s-shaped die
    • Patent number 10,232,620
    • Issue date Mar 19, 2019
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Print head interposers
    • Patent number 10,207,500
    • Issue date Feb 19, 2019
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Grant

    Printhead assembly
    • Patent number 10,195,852
    • Issue date Feb 5, 2019
    • Hewlett-Packard Development Company, L.P.
    • Silam J Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS

Patents Applicationslast 30 patents

  • Information Patent Application

    THREE-DIMENSIONAL PRINTING WITH BINDER AGENT
    • Publication number 20240269921
    • Publication date Aug 15, 2024
    • Hewlett-Packard Development Company, L.P.
    • Karsten N. Wilson
    • B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
  • Information Patent Application

    THREE-DIMENSIONAL PRINTING WITH COALESCING AGENT
    • Publication number 20240253303
    • Publication date Aug 1, 2024
    • Hewlett-Packard Development Company, L.P.
    • Karsten N. Wilson
    • B33 - ADDITIVE MANUFACTURING TECHNOLOGY
  • Information Patent Application

    MONOLITHIC CARRIER STRUCTURE INCLUDING FLUID ROUTING FOR DIGITAL DI...
    • Publication number 20220297113
    • Publication date Sep 22, 2022
    • Hewlett-Packard Development Company, L.P.
    • Jeffrey A. NIELSEN
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
    • Publication number 20220002149
    • Publication date Jan 6, 2022
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    SURFACE ENHANCED LUMINESCENCE ANALYTE INTERROGATION STAGE WITH SACR...
    • Publication number 20210172874
    • Publication date Jun 10, 2021
    • Hewlett-Packard Development Company, L.P.
    • Milo OVERBAY
    • G01 - MEASURING TESTING
  • Information Patent Application

    PRINT HEAD INTERPOSERS
    • Publication number 20210039390
    • Publication date Feb 11, 2021
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MOLDED PRINTHEAD
    • Publication number 20200369031
    • Publication date Nov 26, 2020
    • Hewlett-Packard Development Company, L.P.
    • Silam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    COMPLEX IMPEDANCE DETECTION
    • Publication number 20200331259
    • Publication date Oct 22, 2020
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G06 - COMPUTING CALCULATING COUNTING
  • Information Patent Application

    PRINTED CIRCUIT BOARD FLUID EJECTION APPARATUS
    • Publication number 20190366719
    • Publication date Dec 5, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FRAME LAYER RECEIVING A SUBSTRATE SUPPORTED SEL STAGE
    • Publication number 20190145896
    • Publication date May 16, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G01 - MEASURING TESTING
  • Information Patent Application

    SUBSTRATE SUPPORTED SEL STAGE AND HOUSING
    • Publication number 20190145898
    • Publication date May 16, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G01 - MEASURING TESTING
  • Information Patent Application

    PLURALITY OF FILTERS
    • Publication number 20190143325
    • Publication date May 16, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    PRINT HEAD INTERPOSERS
    • Publication number 20190143688
    • Publication date May 16, 2019
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MICROFLUIDIC DEVICE WITH MANIFOLD
    • Publication number 20190144268
    • Publication date May 16, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    COMPOSITE WAFERS
    • Publication number 20190135615
    • Publication date May 9, 2019
    • Hewlett-Packard Development Company, L.P.
    • Si-lam J. Choy
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    METHOD OF PREPARING TEST SAMPLES
    • Publication number 20190119723
    • Publication date Apr 25, 2019
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • C12 - BIOCHEMISTRY BEER SPIRITS WINE VINEGAR MICROBIOLOGY ENZYMOLOGY MUTATION...
  • Information Patent Application

    PRINTHEAD ASSEMBLY
    • Publication number 20190118535
    • Publication date Apr 25, 2019
    • Hewlett-Packard Development Company, L.P.
    • Silam J Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    FLUID LEVEL SENSING WITH PROTECTIVE MEMBER
    • Publication number 20190118540
    • Publication date Apr 25, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • G01 - MEASURING TESTING
  • Information Patent Application

    MICROELECTROMECHANICAL SYSTEM (MEMS) DEVICES
    • Publication number 20190119104
    • Publication date Apr 25, 2019
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    LIQUID LEVEL SENSING
    • Publication number 20190111694
    • Publication date Apr 18, 2019
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • G01 - MEASURING TESTING
  • Information Patent Application

    MONOLITHIC CARRIER STRUCTURE FOR DIGITAL DISPENSING
    • Publication number 20190083972
    • Publication date Mar 21, 2019
    • Hewlett-Packard Development Company, L.P.
    • Jeffrey A. NIELSEN
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MONOLITHIC CARRIER STRUCTURE INCLUDING FLUID ROUTING FOR DIGITAL DI...
    • Publication number 20190076837
    • Publication date Mar 14, 2019
    • Hewlett-Packard Development Company, L.P.
    • Jeffrey A. NIELSEN
    • B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
  • Information Patent Application

    MICROFLUIDIC DEVICE WITH CAPILLARY CHAMBER
    • Publication number 20190060898
    • Publication date Feb 28, 2019
    • Hewlett-Packard Development Company, L.P.
    • Devin Alexander MOUREY
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    FLUID EJECTION DIE AND PLASTIC-BASED SUBSTRATE
    • Publication number 20180354268
    • Publication date Dec 13, 2018
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    MOLDED PRINTHEAD
    • Publication number 20180304633
    • Publication date Oct 25, 2018
    • Hewlett-Packard Development Company, L.P.
    • Silam J. Choy
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    THREE-DIMENSIONAL FEATURES FORMED IN MOLDED PANEL
    • Publication number 20180265353
    • Publication date Sep 20, 2018
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua Chen
    • B81 - MICRO-STRUCTURAL TECHNOLOGY
  • Information Patent Application

    OVERMOLDED INK DELIVERY DEVICE
    • Publication number 20180264834
    • Publication date Sep 20, 2018
    • Hewlett-Packard Development Company, L.P.
    • Chien-Hua CHEN
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    SERVICE STRUCTURES IN PRINT HEADS
    • Publication number 20180244044
    • Publication date Aug 30, 2018
    • Hewlett-Packard Development Company, L.P.
    • Devin Alexander Mourey
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    PRINTHEAD ELECTRICAL INTERCONNECTS
    • Publication number 20180222202
    • Publication date Aug 9, 2018
    • Hewlett-Packard Development Company, L.P.
    • Devin Alexander Mourey
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
  • Information Patent Application

    PRINTHEAD WITH S-SHAPED DIE
    • Publication number 20180215147
    • Publication date Aug 2, 2018
    • Hewlett-Packard Development Company, L.P.
    • Michael W. Cumbie
    • B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS