DIANA M. SCHONAUER

Person

SAN JOSE, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Prevention of precipitation defects on copper interconnects during...
- Patent number 6,720,264
- Issue date Apr 13, 2004
- Advanced Micro Devices, Inc.
- Kashmir S. Sahota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically preventing Cu dendrite formation and growth by immersion
- Patent number 6,596,637
- Issue date Jul 22, 2003
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect structure formed in porous dielectric material with mi...
- Patent number 6,528,409
- Issue date Mar 4, 2003
- Advanced Micro Devices, Inc.
- Sergey Lopatin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ta barrier slurry containing an organic additive
- Patent number 6,503,418
- Issue date Jan 7, 2003
- Advanced Micro Devices, Inc.
- Kashmir S. Sahota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Selective copper alloy deposition
- Patent number 6,433,402
- Issue date Aug 13, 2002
- Advanced Micro Devices, Inc.
- Christy Mei-Chu Woo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically preventing copper dendrite formation and growth by spraying
- Patent number 6,319,833
- Issue date Nov 20, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper dendrite prevention by chemical removal of dielectric
- Patent number 6,218,290
- Issue date Apr 17, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Prevention of Cu dendrite formation and growth
- Patent number 6,207,569
- Issue date Mar 27, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically preventing Cu dendrite formation and growth by double si...
- Patent number 6,197,690
- Issue date Mar 6, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preventing Cu dendrite formation and growth
- Patent number 6,177,349
- Issue date Jan 23, 2001
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically removable Cu CMP slurry abrasive
- Patent number 6,169,034
- Issue date Jan 2, 2001
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Chemical treatment for preventing copper dendrite formation and growth
- Patent number 6,162,727
- Issue date Dec 19, 2000
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Elimination of residual materials in a multiple-layer interconnect...
- Patent number 6,153,933
- Issue date Nov 28, 2000
- Advanced Micro Devices, Inc.
- Darin A. Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemically removable Cu CMP slurry abrasive
- Patent number 6,140,239
- Issue date Oct 31, 2000
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of preventing copper dendrite formation and growth
- Patent number 6,074,949
- Issue date Jun 13, 2000
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface modification method for film stress reduction
- Patent number 5,936,307
- Issue date Aug 10, 1999
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical-mechanical polishing slurry formulation and method for tun...
- Patent number 5,916,855
- Issue date Jun 29, 1999
- Advanced Micro Devices, Inc.
- Steven C. Avanzino
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Reduced chemical-mechanical polishing particulate contamination
- Patent number 5,702,563
- Issue date Dec 30, 1997
- Advanced Micro Devices, Inc.
- Isidore Salugsugan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical solutions for removing metal-compound contaminants from wa...
- Patent number 5,662,769
- Issue date Sep 2, 1997
- Advanced Micro Devices, Inc.
- Diana M. Schonauer
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...

Patents Applicationslast 30 patents

Information Patent Application
PREVENTION OF PRECIPITATION DEFECTS ON COPPER INTERCONNECTS DURING...
- Publication number 20040014319
- Publication date Jan 22, 2004
- Kashmir S. Sahota
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
TA BARRIER SLURRY CONTAINING AN ORGANIC ADDITIVE
- Publication number 20020005504
- Publication date Jan 17, 2002
- KASHMIR S. SAHOTA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

DIANA M. SCHONAUER

Person

Patents Grantslast 30 patents

Prevention of precipitation defects on copper interconnects during...

Chemically preventing Cu dendrite formation and growth by immersion

Interconnect structure formed in porous dielectric material with mi...

Ta barrier slurry containing an organic additive

Selective copper alloy deposition

Chemically preventing copper dendrite formation and growth by spraying

Copper dendrite prevention by chemical removal of dielectric

Prevention of Cu dendrite formation and growth

Chemically preventing Cu dendrite formation and growth by double si...

Preventing Cu dendrite formation and growth

Chemically removable Cu CMP slurry abrasive

Chemical treatment for preventing copper dendrite formation and growth

Elimination of residual materials in a multiple-layer interconnect...

Chemically removable Cu CMP slurry abrasive

Method of preventing copper dendrite formation and growth

Surface modification method for film stress reduction

Chemical-mechanical polishing slurry formulation and method for tun...

Reduced chemical-mechanical polishing particulate contamination

Chemical solutions for removing metal-compound contaminants from wa...

Patents Applicationslast 30 patents

PREVENTION OF PRECIPITATION DEFECTS ON COPPER INTERCONNECTS DURING...

TA BARRIER SLURRY CONTAINING AN ORGANIC ADDITIVE