Diane Hymes

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sacrificial protection layer for environmentally sensitive surfaces...
- Patent number 12,119,218
- Issue date Oct 15, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Controlled degradation of a stimuli-responsive polymer film
- Patent number 11,862,473
- Issue date Jan 2, 2024
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate freeze dry apparatus and method
- Patent number 9,673,037
- Issue date Jun 6, 2017
- Law Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of collapse-free drying of high aspect ratio structures
- Patent number 9,666,427
- Issue date May 30, 2017
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric repair for emerging memory devices
- Patent number 9,627,608
- Issue date Apr 18, 2017
- Lam Research Corporation
- Nerissa Draeger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Delamination drying apparatus and method
- Patent number 8,898,928
- Issue date Dec 2, 2014
- Lam Research Corporation
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer heating and temperature control by backside fluid injection
- Patent number 8,591,665
- Issue date Nov 26, 2013
- Lam Research Corporation
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer heating and temperature control by backside fluid injection
- Patent number 8,328,942
- Issue date Dec 11, 2012
- Lam Research Corporation
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper interconnect seed layer treatment methods and apparatuses fo...
- Patent number 7,135,098
- Issue date Nov 14, 2006
- Lam Research Corporation
- Diane J. Hymes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for cleaning semiconductor substrates after p...
- Patent number 6,927,198
- Issue date Aug 9, 2005
- Lam Research Corporation
- Liming Zhang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Reinforced chemical mechanical planarization belt
- Patent number 6,666,326
- Issue date Dec 23, 2003
- Lam Research Corporation
- Diane J. Hymes
- B24 - GRINDING POLISHING
Information Patent Grant
Bond pad and wire bond
- Patent number 6,610,601
- Issue date Aug 26, 2003
- Lam Research Corporation
- Hugh Li
- B08 - CLEANING
Information Patent Grant
Cleaning solutions for semiconductor substrates after polishing of...
- Patent number 6,593,282
- Issue date Jul 15, 2003
- Lam Research Corporation
- Xu Li
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Cleaning solution and method for cleaning semiconductor substrates...
- Patent number 6,479,443
- Issue date Nov 12, 2002
- Lam Research Corporation
- Liming Zhang
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Copper interconnect seed layer treatment methods and apparatuses fo...
- Patent number 6,423,200
- Issue date Jul 23, 2002
- Lam Research Corporation
- Diane J. Hymes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for enabling conventional wire bonding to copper-based bond...
- Patent number 6,358,847
- Issue date Mar 19, 2002
- Lam Research Corporation
- Hugh Li
- B08 - CLEANING
Information Patent Grant
Apparatus for cleaning semiconductor substrates
- Patent number 6,324,715
- Issue date Dec 4, 2001
- Lam Research Corporation
- Diane J. Hymes
- B08 - CLEANING
Information Patent Grant
Method and apparatus for cleaning low K dielectric and metal wafer...
- Patent number 6,319,330
- Issue date Nov 20, 2001
- Lam Research Corporation
- Linda (Tong) Jiang
- B08 - CLEANING
Information Patent Grant
Cleaning solution and method for cleaning semiconductor substrates...
- Patent number 6,303,551
- Issue date Oct 16, 2001
- Lam Research Corporation
- Xu Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for cleaning semiconductor substrates after p...
- Patent number 6,294,027
- Issue date Sep 25, 2001
- Lam Research Corporation
- Xu Li
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning low K dielectric and metal wafer...
- Patent number 6,277,203
- Issue date Aug 21, 2001
- Lam Research Corporation
- Linda Jiang
- B08 - CLEANING
Information Patent Grant
Methods and apparatus for cleaning semiconductor substrates after p...
- Patent number 6,165,956
- Issue date Dec 26, 2000
- Lam Research Corporation
- Liming Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for cleaning semiconductor substrates after p...
- Patent number 6,162,301
- Issue date Dec 19, 2000
- Lam Research Corporation
- Liming Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for cleaning of semiconductor substrates using...
- Patent number 6,145,148
- Issue date Nov 14, 2000
- Lam Research Corporation
- Diane J. Hymes
- B08 - CLEANING
Information Patent Grant
Method and apparatus for cleaning of semiconductor substrates using...
- Patent number 5,868,863
- Issue date Feb 9, 1999
- Ontrak Systems, Inc.
- Diane J. Hymes
- B08 - CLEANING
Information Patent Grant
Method and apparatus for cleaning of semiconductor substrates using...
- Patent number 5,858,109
- Issue date Jan 12, 1999
- Ontrak Systems, Inc.
- Diane J. Hymes
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240429040
- Publication date Dec 26, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...
- Publication number 20240312778
- Publication date Sep 19, 2024
- LAM RESEARCH CORPORATION
- Stephen J. BANIK
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...
- Publication number 20240030023
- Publication date Jan 25, 2024
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYE...
- Publication number 20230295412
- Publication date Sep 21, 2023
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
RESIDUE-FREE REMOVAL OF STIMULUS RESPONSIVE POLYMERS FROM SUBSTRATES
- Publication number 20230207305
- Publication date Jun 29, 2023
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- B08 - CLEANING
Information Patent Application
REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD...
- Publication number 20230178364
- Publication date Jun 8, 2023
- LAM RESEARCH CORPORATION
- Gregory BLACHUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLED DEGRADATION OF A STIMULI-RESPONSIVE POLYMER FILM
- Publication number 20230136036
- Publication date May 4, 2023
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SMALL MOLECULE FILMS FOR SACRIFICIAL BRACING, SURFACE PROTECTION, A...
- Publication number 20220328338
- Publication date Oct 13, 2022
- LAM RESEARCH CORPORATION
- Gregory BLACHUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIMULUS RESPONSIVE POLYMER FILMS AND FORMULATIONS
- Publication number 20220301859
- Publication date Sep 22, 2022
- LAM RESEARCH CORPORATION
- Gregory BLACHUT
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR A NON-AQUEOUS ELECTROLESS POLYOL DEPOSITION OF METAL OR...
- Publication number 20170073815
- Publication date Mar 16, 2017
- LAM RESEARCH CORPORATION
- Mehul N. Patel
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
DIELECTRIC REPAIR FOR EMERGING MEMORY DEVICES
- Publication number 20160079521
- Publication date Mar 17, 2016
- LAM RESEARCH CORPORATION
- Nerissa Draeger
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
COVERAGE OF HIGH ASPECT RATIO FEATURES USING SPIN-ON DIELECTRIC THR...
- Publication number 20160042945
- Publication date Feb 11, 2016
- LAM RESEARCH CORPORATION
- Ratchana Limary
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF COLLAPSE-FREE DRYING OF HIGH ASPECT RATIO STRUCTURES
- Publication number 20140373384
- Publication date Dec 25, 2014
- Stephen M. SIRARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOSITION APPARATUS AND METHOD
- Publication number 20140179097
- Publication date Jun 26, 2014
- LAM RESEARCH CORPORATION
- Diane J. HYMES
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DELAMINATION DRYING APPARATUS AND METHOD
- Publication number 20140101964
- Publication date Apr 17, 2014
- LAM RESEARCH CORPORATION
- Stephen M. SIRARD
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Heating and Temperature Control by Backside Fluid Injection
- Publication number 20130059260
- Publication date Mar 7, 2013
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE FREEZE DRY APPARATUS AND METHOD
- Publication number 20120304483
- Publication date Dec 6, 2012
- LAM RESEARCH CORPORATION
- Stephen M. Sirard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer heating and temperature control by backside fluid injection
- Publication number 20060130762
- Publication date Jun 22, 2006
- Lam Research Corp.
- Ben Mooring
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reactive fluid systems for removing deposition materials and method...
- Publication number 20050261150
- Publication date Nov 24, 2005
- Battelle Memorial Institute, a part interest
- Clement R. Yonker
- B08 - CLEANING
Information Patent Application
Reinforced chemical mechanical planarization belt
- Publication number 20040089520
- Publication date May 13, 2004
- LAM RESEARCH CORPORATION
- Diane J. Hymes
- B24 - GRINDING POLISHING
Information Patent Application
Methods and apparatus for cleaning semiconductor substrates after p...
- Publication number 20040033917
- Publication date Feb 19, 2004
- Lam Research Corporation
- Liming Zhang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Reinforced chemical mechanical planarization belt
- Publication number 20030186630
- Publication date Oct 2, 2003
- LAM RESEARCH CORPORATION
- Jibing Lin
- B24 - GRINDING POLISHING
Information Patent Application
Reinforced chemical mechanical planarization belt
- Publication number 20030173193
- Publication date Sep 18, 2003
- LAM RESEARCH CORPORATION
- Diane J. Hymes
- B24 - GRINDING POLISHING
Information Patent Application
Copper interconnect seed layer treatment methods and apparatuses fo...
- Publication number 20020175071
- Publication date Nov 28, 2002
- LAM RESEARCH CORPORATION
- Diane J. Hymes
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Cleaning solution and method for cleaning semiconductor substrates...
- Publication number 20020077260
- Publication date Jun 20, 2002
- Xu Li
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
COPPER INTERCONNECT SEED LAYER TREATMENT METHODS AND APPARATUSES FO...
- Publication number 20020063062
- Publication date May 30, 2002
- DIANE J. HYMES
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Bond pad and wire bond
- Publication number 20020058417
- Publication date May 16, 2002
- Hugh Li
- H01 - BASIC ELECTRIC ELEMENTS

Diane Hymes

Person

Patents Grantslast 30 patents

Sacrificial protection layer for environmentally sensitive surfaces...

Controlled degradation of a stimuli-responsive polymer film

Substrate freeze dry apparatus and method

Method of collapse-free drying of high aspect ratio structures

Dielectric repair for emerging memory devices

Delamination drying apparatus and method

Wafer heating and temperature control by backside fluid injection

Wafer heating and temperature control by backside fluid injection

Copper interconnect seed layer treatment methods and apparatuses fo...

Methods and apparatus for cleaning semiconductor substrates after p...

Reinforced chemical mechanical planarization belt

Bond pad and wire bond

Cleaning solutions for semiconductor substrates after polishing of...

Cleaning solution and method for cleaning semiconductor substrates...

Copper interconnect seed layer treatment methods and apparatuses fo...

Method for enabling conventional wire bonding to copper-based bond...

Apparatus for cleaning semiconductor substrates

Method and apparatus for cleaning low K dielectric and metal wafer...

Cleaning solution and method for cleaning semiconductor substrates...

Methods and apparatus for cleaning semiconductor substrates after p...

Method and apparatus for cleaning low K dielectric and metal wafer...

Methods and apparatus for cleaning semiconductor substrates after p...

Methods and apparatus for cleaning semiconductor substrates after p...

Method and apparatus for cleaning of semiconductor substrates using...

Method and apparatus for cleaning of semiconductor substrates using...

Method and apparatus for cleaning of semiconductor substrates using...

Patents Applicationslast 30 patents

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

TEMPORARY CAPPING MATERIAL FOR OXIDE PREVENTION IN LOW TEMPERATURE...

SACRIFICIAL PROTECTION LAYER FOR ENVIRONMENTALLY SENSITIVE SURFACES...

LOW CEILING TEMPERATURE HOMOPOLYMERS AS SACRIFICIAL PROTECTION LAYE...

RESIDUE-FREE REMOVAL OF STIMULUS RESPONSIVE POLYMERS FROM SUBSTRATES

REMOVABLE CVD POLYMER FILM FOR SURFACE PROTECTION AND QUEUE PERIOD...

CONTROLLED DEGRADATION OF A STIMULI-RESPONSIVE POLYMER FILM

SMALL MOLECULE FILMS FOR SACRIFICIAL BRACING, SURFACE PROTECTION, A...

STIMULUS RESPONSIVE POLYMER FILMS AND FORMULATIONS

METHOD FOR A NON-AQUEOUS ELECTROLESS POLYOL DEPOSITION OF METAL OR...

DIELECTRIC REPAIR FOR EMERGING MEMORY DEVICES

COVERAGE OF HIGH ASPECT RATIO FEATURES USING SPIN-ON DIELECTRIC THR...

METHOD OF COLLAPSE-FREE DRYING OF HIGH ASPECT RATIO STRUCTURES

DEPOSITION APPARATUS AND METHOD

DELAMINATION DRYING APPARATUS AND METHOD

Wafer Heating and Temperature Control by Backside Fluid Injection

SUBSTRATE FREEZE DRY APPARATUS AND METHOD

Wafer heating and temperature control by backside fluid injection

Reactive fluid systems for removing deposition materials and method...

Reinforced chemical mechanical planarization belt

Methods and apparatus for cleaning semiconductor substrates after p...

Reinforced chemical mechanical planarization belt

Reinforced chemical mechanical planarization belt

Copper interconnect seed layer treatment methods and apparatuses fo...

Cleaning solution and method for cleaning semiconductor substrates...

COPPER INTERCONNECT SEED LAYER TREATMENT METHODS AND APPARATUSES FO...

Bond pad and wire bond