Claims
- 1. A scrubber for performing a chemical mechanical scrubbing process for cleaning of a semiconductor substrate comprising:an input to receive the semiconductor substrate; a first brush assembly coupled to the input and comprising a first chemical mechanical semiconductor scrubbing brush having an interior portion and an exterior portion, and a first solution delivery system coupled to the first brush to deliver a first cleaning solution to the interior portion of the first brush for application through the first brush to the exterior portion of the first brush and the semiconductor substrate; and a second brush assembly coupled to an output of the first brush assembly and comprising a second chemical mechanical semiconductor scrubbing brush having an interior portion and an exterior portion, and a second solution delivery system coupled to the second brush to deliver a second cleaning solution to the interior portion of the second brush for application through the second brush to the exterior portion of the second brush and the semiconductor substrate; wherein at least one of the first and second cleaning solutions comprises and SC1 cleaning solution.
- 2. The scrubber as described in claim 1 wherein the first brush and the second brush are PVA brushes.
- 3. The scrubber defined in claim 1 wherein the SC1 solution is approximately one part ammonium hydroxide (NH4OH), four parts peroxide (H2O2), and twenty parts water (H2O) by volume.
- 4. The scrubber defined in claim 1 wherein at least one of the first and second solution delivery systems comprises:a supply line to supply an SC1 solution; a delivery tube coupled to the supply line; and a device coupled to the delivery tube to control the flow rate of the cleaning solution through the delivery tube.
- 5. The scrubber defined in claim 1 wherein the other of the first and second cleaning solutions comprises NH4OH.
- 6. The scrubber defined in claim 1 wherein the other of the first and second cleaning solutions comprises hydrochloric acid (HCL).
- 7. The scrubber defined in claim 1 wherein the other of the first and second cleaning solutions comprises hydrofluoric acid (HF).
- 8. The scrubber defined in claim 1 wherein the other of the first and second cleaning solutions comprises a second SC1 cleaning solution.
Parent Case Info
This is a divisional application of U.S. patent application Ser. No. 08/792,093, entitled “Method and Apparatus for Cleaning of Semiconductor Substrates Using Standard Clean 1 (SC1),” which was filed on Jan. 31, 1997 and issued as U.S. Pat. No. 5,858,109. U.S. patent application Ser. No. 08/792,093 is a continuation-in-part application of U.S. patent application Ser. No. 08/542,531, entitled “Method and Apparatus for Chemical Delivery Through the Brush,” filed on Oct. 13, 1995, and is now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
5518552 |
Tanoue et al. |
May 1996 |
|
5639311 |
Holley et al. |
Jun 1997 |
|
Non-Patent Literature Citations (1)
Entry |
Post-CMP Cleaning Technology, SEMICON Korea 95, Process Technology, Semiconductore Equipment and Materials International, 29-36, Jan. 1995. |
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
08/542531 |
Oct 1995 |
US |
Child |
08/792093 |
|
US |