Dinesh Chopra

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for simultaneously removing multiple conductiv...
- Patent number 9,214,359
- Issue date Dec 15, 2015
- Micron Technology, Inc.
- Dinesh Chopra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Inline monitoring of pad loading for CuCMP and developing an endpoi...
- Patent number 8,557,132
- Issue date Oct 15, 2013
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Methods of forming electrical contacts to structures that are at di...
- Patent number 8,232,206
- Issue date Jul 31, 2012
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures
- Patent number 7,713,817
- Issue date May 11, 2010
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Slurry for use in polishing semiconductor device conductive structu...
- Patent number 7,662,719
- Issue date Feb 16, 2010
- Micron Technology, Inc.
- Nishant Sinha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Etch aided by electrically shorting upper and lower sidewall portio...
- Patent number 7,573,116
- Issue date Aug 11, 2009
- Micron Technology, Inc.
- Bradley J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recovery system for platinum plating bath
- Patent number 7,476,305
- Issue date Jan 13, 2009
- Micron Technology, Inc.
- Dinesh Chopra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and apparatus for cleaning a web-based chemical mechanical p...
- Patent number 7,438,632
- Issue date Oct 21, 2008
- Micron Technology, Inc.
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Grant
Fixed-abrasive chemical-mechanical planarization of titanium nitride
- Patent number 7,402,094
- Issue date Jul 22, 2008
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Electrochemical reaction cell for a combined barrier layer and seed...
- Patent number 7,385,290
- Issue date Jun 10, 2008
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures
- Patent number 7,335,935
- Issue date Feb 26, 2008
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connection forming methods, oxidation reducing methods,...
- Patent number 7,329,607
- Issue date Feb 12, 2008
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus and method for conditioning polishing surface, and polish...
- Patent number 7,278,905
- Issue date Oct 9, 2007
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 7,273,411
- Issue date Sep 25, 2007
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Conductive connection forming methods, oxidation reducing methods,...
- Patent number 7,220,663
- Issue date May 22, 2007
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System for controlling metal formation processes using ion implanta...
- Patent number 7,214,614
- Issue date May 8, 2007
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conductive connection forming methods, oxidation reducing methods,...
- Patent number 7,176,576
- Issue date Feb 13, 2007
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for simultaneously removing multiple conductive materials fr...
- Patent number 7,129,160
- Issue date Oct 31, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Slurry for use in polishing semiconductor device conductive structu...
- Patent number 7,118,686
- Issue date Oct 10, 2006
- Micron Technology, Inc.
- Nishant Sinha
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Apparatuses for forming a planarizing pad for planarization of micr...
- Patent number 7,112,245
- Issue date Sep 26, 2006
- Micron Technology, Inc.
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Grant
Method of providing a structure using self-aligned features
- Patent number 7,109,112
- Issue date Sep 19, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Etch aided by electrically shorting upper and lower sidewall portio...
- Patent number 7,094,699
- Issue date Aug 22, 2006
- Micron Technology, Inc.
- Bradley J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for cleaning a web-based chemical mechanical p...
- Patent number 7,063,603
- Issue date Jun 20, 2006
- Micron Technology, Inc.
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Grant
Method of forming a barrier seed layer with graded nitrogen composi...
- Patent number 7,041,595
- Issue date May 9, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor processing methods for forming electrical contacts
- Patent number 7,005,379
- Issue date Feb 28, 2006
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fixed-abrasive chemical-mechanical planarization of titanium nitride
- Patent number 6,997,781
- Issue date Feb 14, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Methods and apparatuses for mechanical and chemical-mechanical plan...
- Patent number 6,964,602
- Issue date Nov 15, 2005
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for cleaning a web-based chemical mechanical p...
- Patent number 6,949,011
- Issue date Sep 27, 2005
- Micron Technology, Inc.
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Grant
Method and apparatus for cleaning a web-based chemical mechanical p...
- Patent number 6,945,855
- Issue date Sep 20, 2005
- Micron Technology, Inc.
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Grant
Planarizing pads for planarization of microelectronic substrates
- Patent number 6,932,687
- Issue date Aug 23, 2005
- Micron Technology, Inc.
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIV...
- Publication number 20140377953
- Publication date Dec 25, 2014
- Dinesh Chopra
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Methods Of Forming Semiconductor Structures
- Publication number 20100190314
- Publication date Jul 29, 2010
- Micron Technology, Inc.
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Semiconductor Structures
- Publication number 20080102596
- Publication date May 1, 2008
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIV...
- Publication number 20080045009
- Publication date Feb 21, 2008
- Micron Technology, Inc.
- Dinesh Chopra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Etch aided by electrically shorting upper and lower sidewall portio...
- Publication number 20060281319
- Publication date Dec 14, 2006
- Bradley J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus and method for conditioning polishing surface, and polish...
- Publication number 20060276115
- Publication date Dec 7, 2006
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
Combined barrier layer and seed layer
- Publication number 20060261485
- Publication date Nov 23, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for use in polishing semiconductor device conductive structu...
- Publication number 20060249252
- Publication date Nov 9, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Slurry for use in polishing semiconductor device conductive structu...
- Publication number 20060252268
- Publication date Nov 9, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Apparatus and method for conditioning polishing surface, and polish...
- Publication number 20060189264
- Publication date Aug 24, 2006
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF PROVIDING A STRUCTURE USING SELF-ALIGNED FEATURES
- Publication number 20060154483
- Publication date Jul 13, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for cleaning a web-based chemical mechanical p...
- Publication number 20060116057
- Publication date Jun 1, 2006
- Scott E. Moore
- B24 - GRINDING POLISHING
Information Patent Application
Fixed-abrasive chemical-mechanical planarization of titanium nitride
- Publication number 20060009136
- Publication date Jan 12, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor structures
- Publication number 20060003583
- Publication date Jan 5, 2006
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixed-abrasive chemical-mechanical planarization of titanium nitride
- Publication number 20060003675
- Publication date Jan 5, 2006
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
Semiconductor processing methods for forming electrical contacts
- Publication number 20050224981
- Publication date Oct 13, 2005
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fixed-abrasive chemical-mechanical planarization of titanium nitride
- Publication number 20050199588
- Publication date Sep 15, 2005
- Micron Technology, Inc.
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
Methods for polishing copper features of semiconductor devices stru...
- Publication number 20050153556
- Publication date Jul 14, 2005
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
Combined barrier layer and seed layer
- Publication number 20050023516
- Publication date Feb 3, 2005
- Micron Technology, Inc.
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for simultaneously removing multiple conductiv...
- Publication number 20050020004
- Publication date Jan 27, 2005
- Dinesh Chopra
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive connection forming methods, oxidation reducing methods,...
- Publication number 20050009318
- Publication date Jan 13, 2005
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of providing a structure using self-aligned features
- Publication number 20040219738
- Publication date Nov 4, 2004
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Conductive connection forming methods, oxidation reducing methods,...
- Publication number 20040212093
- Publication date Oct 28, 2004
- Dinesh Chopra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Inline monitoring of pad loading for CuCMP and developing an endpoi...
- Publication number 20040206374
- Publication date Oct 21, 2004
- Dinesh Chopra
- B08 - CLEANING
Information Patent Application
Inline monitoring of pad loading for CuCMP and developing an endpoi...
- Publication number 20040206454
- Publication date Oct 21, 2004
- Dinesh Chopra
- B08 - CLEANING
Information Patent Application
Etch aided by electrically shorting upper and lower sidewall portio...
- Publication number 20040203240
- Publication date Oct 14, 2004
- Bradley J. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for mechanical and chemical-mechanical plan...
- Publication number 20040192176
- Publication date Sep 30, 2004
- Dinesh Chopra
- B24 - GRINDING POLISHING
Information Patent Application
Planarizing pads for planarization of microelectronic substrates
- Publication number 20040166792
- Publication date Aug 26, 2004
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Application
Apparatuses for forming a planarizing pad for planarization of micr...
- Publication number 20040154533
- Publication date Aug 12, 2004
- Vishnu K. Agarwal
- B24 - GRINDING POLISHING
Information Patent Application
Plating metal caps on conductive interconnect for wirebonding
- Publication number 20040157433
- Publication date Aug 12, 2004
- Nishant Sinha
- H01 - BASIC ELECTRIC ELEMENTS

Dinesh Chopra

Person

Patents Grantslast 30 patents

Method and apparatus for simultaneously removing multiple conductiv...

Inline monitoring of pad loading for CuCMP and developing an endpoi...

Methods of forming electrical contacts to structures that are at di...

Methods of forming semiconductor structures

Slurry for use in polishing semiconductor device conductive structu...

Etch aided by electrically shorting upper and lower sidewall portio...

Recovery system for platinum plating bath

Method and apparatus for cleaning a web-based chemical mechanical p...

Fixed-abrasive chemical-mechanical planarization of titanium nitride

Electrochemical reaction cell for a combined barrier layer and seed...

Semiconductor structures

Conductive connection forming methods, oxidation reducing methods,...

Apparatus and method for conditioning polishing surface, and polish...

Polishing apparatus

Conductive connection forming methods, oxidation reducing methods,...

System for controlling metal formation processes using ion implanta...

Conductive connection forming methods, oxidation reducing methods,...

Method for simultaneously removing multiple conductive materials fr...

Slurry for use in polishing semiconductor device conductive structu...

Apparatuses for forming a planarizing pad for planarization of micr...

Method of providing a structure using self-aligned features

Etch aided by electrically shorting upper and lower sidewall portio...

Method and apparatus for cleaning a web-based chemical mechanical p...

Method of forming a barrier seed layer with graded nitrogen composi...

Semiconductor processing methods for forming electrical contacts

Fixed-abrasive chemical-mechanical planarization of titanium nitride

Methods and apparatuses for mechanical and chemical-mechanical plan...

Method and apparatus for cleaning a web-based chemical mechanical p...

Method and apparatus for cleaning a web-based chemical mechanical p...

Planarizing pads for planarization of microelectronic substrates

Patents Applicationslast 30 patents

METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIV...

Methods Of Forming Semiconductor Structures

Methods of Forming Semiconductor Structures

METHOD AND APPARATUS FOR SIMULTANEOUSLY REMOVING MULTIPLE CONDUCTIV...

Etch aided by electrically shorting upper and lower sidewall portio...

Apparatus and method for conditioning polishing surface, and polish...

Combined barrier layer and seed layer

Slurry for use in polishing semiconductor device conductive structu...

Slurry for use in polishing semiconductor device conductive structu...

Apparatus and method for conditioning polishing surface, and polish...

METHOD OF PROVIDING A STRUCTURE USING SELF-ALIGNED FEATURES

Method and apparatus for cleaning a web-based chemical mechanical p...

Fixed-abrasive chemical-mechanical planarization of titanium nitride

Semiconductor structures

Fixed-abrasive chemical-mechanical planarization of titanium nitride

Semiconductor processing methods for forming electrical contacts

Fixed-abrasive chemical-mechanical planarization of titanium nitride

Methods for polishing copper features of semiconductor devices stru...

Combined barrier layer and seed layer

Method and apparatus for simultaneously removing multiple conductiv...

Conductive connection forming methods, oxidation reducing methods,...

Method of providing a structure using self-aligned features

Conductive connection forming methods, oxidation reducing methods,...

Inline monitoring of pad loading for CuCMP and developing an endpoi...

Inline monitoring of pad loading for CuCMP and developing an endpoi...

Etch aided by electrically shorting upper and lower sidewall portio...

Methods and apparatuses for mechanical and chemical-mechanical plan...

Planarizing pads for planarization of microelectronic substrates

Apparatuses for forming a planarizing pad for planarization of micr...

Plating metal caps on conductive interconnect for wirebonding