Dingying David Xu

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Omni directional interconnect with magnetic fillers in mold matrix
- Patent number 12,354,883
- Issue date Jul 8, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus to reduce defects in interconnects between se...
- Patent number 12,341,117
- Issue date Jun 24, 2025
- Intel Corporation
- Kyle McElhinny
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package substrate z-disaggregation with liquid metal interconnects
- Patent number 12,230,564
- Issue date Feb 18, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 12,230,563
- Issue date Feb 18, 2025
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dummy die structures of a packaged integrated circuit device
- Patent number 12,068,222
- Issue date Aug 20, 2024
- Intel Corporation
- Mitul Modi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selectively roughened copper architectures for low insertion loss c...
- Patent number 12,033,930
- Issue date Jul 9, 2024
- Intel Corporation
- Jieying Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patternable die attach materials and processes for patterning
- Patent number 11,923,312
- Issue date Mar 5, 2024
- Intel Corporation
- Bai Nie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,676,891
- Issue date Jun 13, 2023
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pins with etched tips for electrical die test
- Patent number 11,340,258
- Issue date May 24, 2022
- Intel Corporation
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Grant
Method to enable 30 microns pitch EMIB or below
- Patent number 11,088,062
- Issue date Aug 10, 2021
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pins with etched tips for electrical die test
- Patent number 10,598,696
- Issue date Mar 24, 2020
- Intel Corporation
- Joseph D. Stanford
- G01 - MEASURING TESTING
Information Patent Grant
Thermal head with a thermal barrier for integrated circuit die proc...
- Patent number 10,499,461
- Issue date Dec 3, 2019
- Intel Corporation
- Mohit Mamodia
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coated probe tips for plunger pins of an integrated circuit package...
- Patent number 10,168,357
- Issue date Jan 1, 2019
- Intel Corporation
- Wen Yin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Space transformer with perforated metallic plate for electrical die...
- Patent number 9,941,652
- Issue date Apr 10, 2018
- Intel Corporation
- Nachiket R. Raravikar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stiffener tape for electronic assembly
- Patent number 9,793,151
- Issue date Oct 17, 2017
- Intel Corporation
- Xavier Brun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder-on-die using water-soluble resist system and method
- Patent number 9,659,889
- Issue date May 23, 2017
- Intel Corporation
- Mihir Oka
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Package with dielectric or anisotropic conductive (ACF) buildup layer
- Patent number 9,543,197
- Issue date Jan 10, 2017
- Intel Corporation
- Chuan Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dry-removable protective coatings
- Patent number 9,472,517
- Issue date Oct 18, 2016
- Intel Corporation
- Mihir A. Oka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,458,283
- Issue date Oct 4, 2016
- Intel Corporation
- Dingying Xu
- C07 - ORGANIC CHEMISTRY
Information Patent Grant
Flexible underfill compositions for enhanced reliability
- Patent number 9,068,067
- Issue date Jun 30, 2015
- Intel Corporation
- Dingying Xu
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Coating for a microelectronic device, treatment comprising same, an...
- Patent number 8,569,108
- Issue date Oct 29, 2013
- Intel Corporation
- Dingying Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Forming die backside coating structures with coreless packages
- Patent number 8,466,559
- Issue date Jun 18, 2013
- Intel Corporation
- Rahul N. Manepalli
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Treatment for a microelectronic device and method of resisting dama...
- Patent number 8,304,065
- Issue date Nov 6, 2012
- Leonel Arana
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Coating for a microelectronic device, treatment comprising same, an...
- Patent number 8,287,996
- Issue date Oct 16, 2012
- Intel Corporation
- Dingying Xu
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
In-situ formation of conductive filling material in through-silicon...
- Patent number 7,851,342
- Issue date Dec 14, 2010
- Intel Corporation
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic package having solder-filled through-vias
- Patent number 7,638,867
- Issue date Dec 29, 2009
- Intel Corporation
- Dingying Xu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method, system, and apparatus for filling vias
- Patent number 7,557,036
- Issue date Jul 7, 2009
- Intel Corporation
- Amram Eitan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING
- Publication number 20250218998
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...
- Publication number 20250218904
- Publication date Jul 3, 2025
- Intel Corporation
- Ziyin Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...
- Publication number 20250218880
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE
- Publication number 20250218957
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...
- Publication number 20250218958
- Publication date Jul 3, 2025
- Intel Corporation
- Brandon Christian Marin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES
- Publication number 20250219021
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...
- Publication number 20250218960
- Publication date Jul 3, 2025
- Intel Corporation
- Clay Bradley Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...
- Publication number 20250218999
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...
- Publication number 20250220818
- Publication date Jul 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...
- Publication number 20250219028
- Publication date Jul 3, 2025
- Intel Corporation
- Jeremy Ecton
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES
- Publication number 20250218926
- Publication date Jul 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES
- Publication number 20250218906
- Publication date Jul 3, 2025
- Intel Corporation
- Zhixin XIE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE
- Publication number 20250218964
- Publication date Jul 3, 2025
- Intel Corporation
- Kyle J. Arrington
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES
- Publication number 20250210398
- Publication date Jun 26, 2025
- Intel Corporation
- Clay ARRINGTON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES
- Publication number 20250210426
- Publication date Jun 26, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...
- Publication number 20250192069
- Publication date Jun 12, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...
- Publication number 20250192070
- Publication date Jun 12, 2025
- Intel Corporation
- Jesse C. Jones
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES
- Publication number 20250192059
- Publication date Jun 12, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS
- Publication number 20250183180
- Publication date Jun 5, 2025
- Intel Corporation
- Brandon C. MARIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...
- Publication number 20250183182
- Publication date Jun 5, 2025
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW Z-HEIGHT SEPARABLE LIQUID METAL BASED ELECTRICAL INTERCONNECT
- Publication number 20250149414
- Publication date May 8, 2025
- Intel Corporation
- Ziyin LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW
- Publication number 20250149433
- Publication date May 8, 2025
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...
- Publication number 20250112161
- Publication date Apr 3, 2025
- Intel Corporation
- Minglu Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS
- Publication number 20250112136
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE
- Publication number 20250110295
- Publication date Apr 3, 2025
- Intel Corporation
- Ziyin Lin
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES
- Publication number 20250112085
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTROLLING SUBSTRATE BUMP HEIGHT
- Publication number 20250112164
- Publication date Apr 3, 2025
- Intel Corporation
- Bohan SHAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...
- Publication number 20250105074
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION
- Publication number 20250106983
- Publication date Mar 27, 2025
- Intel Corporation
- Bohan SHAN
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...
- Publication number 20250006645
- Publication date Jan 2, 2025
- Intel Corporation
- Xiao Liu
- H01 - BASIC ELECTRIC ELEMENTS

Dingying David Xu

Person

Patents Grantslast 30 patents

Omni directional interconnect with magnetic fillers in mold matrix

Methods and apparatus to reduce defects in interconnects between se...

Package substrate z-disaggregation with liquid metal interconnects

Method to enable 30 microns pitch EMIB or below

Dummy die structures of a packaged integrated circuit device

Selectively roughened copper architectures for low insertion loss c...

Patternable die attach materials and processes for patterning

Method to enable 30 microns pitch EMIB or below

Probe pins with etched tips for electrical die test

Method to enable 30 microns pitch EMIB or below

Probe pins with etched tips for electrical die test

Thermal head with a thermal barrier for integrated circuit die proc...

Coated probe tips for plunger pins of an integrated circuit package...

Space transformer with perforated metallic plate for electrical die...

Stiffener tape for electronic assembly

Solder-on-die using water-soluble resist system and method

Package with dielectric or anisotropic conductive (ACF) buildup layer

Dry-removable protective coatings

Flexible underfill compositions for enhanced reliability

Flexible underfill compositions for enhanced reliability

Coating for a microelectronic device, treatment comprising same, an...

Forming die backside coating structures with coreless packages

Treatment for a microelectronic device and method of resisting dama...

Coating for a microelectronic device, treatment comprising same, an...

In-situ formation of conductive filling material in through-silicon...

Microelectronic package having solder-filled through-vias

Method, system, and apparatus for filling vias

Patents Applicationslast 30 patents

LOW TEMPERATURE SOLDER INTERCONNECT FOR PACKAGE PITCH SCALING

TECHNOLOGIES FOR POWER AND SPACER COMPONENTS EMBEDDED IN A SUBSTRAT...

MICROELECTRONIC ASSEMBLIES WITH PILLAR-FIRST CONDUCTIVE VIA FORMATI...

METHODS AND APPARATUS TO EMBED A SEMICONDUCTOR DEVICE IN A GLASS CORE

PEDESTALS FOR SEMICONDUCTOR COMPONENTS EMBEDDED IN PACKAGE SUBSTRAT...

VERTICALLY EMBEDDED COMPONENTS IN PACKAGE SUBSTRATES

METHODS AND APPARATUS TO EMBED SEMICONDUCTOR DEVICES IN CORES OF PA...

PASSIVE COMPONENT ASSEMBLY FOR THICKNESS MODIFICATION TO MATCH CORE...

FLOW ENHANCED DUMMY STRUCTURE TO ENABLE CAPILLARY FLOW BASED SIDEWA...

DEEP TRENCH CAPACITORS IN MULTI-CORE INTEGRATED CIRCUIT DEVICE PACK...

MICROELECTRONIC ASSEMBLIES INCLUDING CAVITY-LESS ENCAPSULATED DIES

RECONSTITUTED PASSIVE ASSEMBLIES FOR EMBEDDING IN THICK CORES

TECHNOLOGIES FOR CONNECTED COMPONENTS EMBEDDED IN A SUBSTRATE CORE

PATTERNABLE BOND-DEBOND PROCESSES AND APPARATUSES

MICROELECTRONIC ASSEMBLIES WITH STRENGTHENED GLASS CORES

MICROELECTRONIC ASSEMBLIES WITH PRE-SINGULATION EDGE FEATURES IN GL...

MICROELECTRONIC ASSEMBLIES WITH POST-SINGULATION EDGE FEATURES IN G...

EMBEDDED BRIDGE WITH THROUGH SILICON VIA BONDING ARCHITECTURES

DIRECT BONDING FOR EMBEDDED BRIDGES WITH VIAS

MICROELECTRONIC ASSEMBLIES WITH THROUGH-GLASS VIA STRESS ALLEVIATIO...

LOW Z-HEIGHT SEPARABLE LIQUID METAL BASED ELECTRICAL INTERCONNECT

NEW METHOD TO ENABLE 30 MICRONS PITCH EMIB OR BELOW

METHODS AND APPARATUS TO CONNECT INTERCONNECT BRIDGES TO PACKAGE SU...

GLASS CORE PROTECTION USING PERIPHERAL BUFFER LAYERS

POLYETHYLENE OXIDE-BASED OPTICAL ADHESIVE

APPARATUS AND METHODS FOR CAPILLARY UNDERFILL OF EMBEDDED DEVICES

CONTROLLING SUBSTRATE BUMP HEIGHT

GLASS CORES INCLUDING PROTRUDING THROUGH GLASS VIAS AND RELATED MET...

STIFFENER ARCHITECTURES FOR GLASS EDGE PROTECTION

MICROELECTRONIC ASSEMBLIES INCLUDING A PHOTOIMAGEABLE DIELECTRIC FO...