Do Hyun Na

Person

Dongjak-gu, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 11,430,723
- Issue date Aug 30, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method thereof
- Patent number 11,328,969
- Issue date May 10, 2022
- Amkor Technology Singapore Holding Pte Ltd.
- Do Hyun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a semiconductor die embedded between an e...
- Patent number 10,090,230
- Issue date Oct 2, 2018
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microfluidic sensor package structure and method
- Patent number 9,513,254
- Issue date Dec 6, 2016
- Amkor Technology, Inc.
- Hyung II Jeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 9,418,942
- Issue date Aug 16, 2016
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device having an interposer
- Patent number 8,802,494
- Issue date Aug 12, 2014
- Amkor Technology Korea, Inc.
- Choon Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of bond pad for semiconductor die and method therefor
- Patent number 8,198,738
- Issue date Jun 12, 2012
- Amkor Technology, Inc.
- Chan Ha Hwang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having an interposer
- Patent number 8,183,678
- Issue date May 22, 2012
- Amkor Technology Korea, Inc.
- Choon Heung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Increased I/O semiconductor package and method of making same
- Patent number 8,125,064
- Issue date Feb 28, 2012
- Amkor Technology, Inc.
- Chang Deok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with half-etched locking features
- Patent number 7,808,084
- Issue date Oct 5, 2010
- Amkor Technology, Inc.
- Chang Deok Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor package and its manufacturing method
- Patent number 7,227,236
- Issue date Jun 5, 2007
- Amkor Technology, Inc.
- Chang Deok Lee
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20220415769
- Publication date Dec 29, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20220320010
- Publication date Oct 6, 2022
- Amkor Technology Singapore Holding Pte. Ltd.
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20190148254
- Publication date May 16, 2019
- Amkor Technology, Inc.
- Do Hyun Na
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20190043793
- Publication date Feb 7, 2019
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20180134546
- Publication date May 17, 2018
- Amkor Technology, Inc.
- Ji Hoon Oh
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF
- Publication number 20160211221
- Publication date Jul 21, 2016
- Jin Young Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150187717
- Publication date Jul 2, 2015
- Amkor Technology, Inc.
- Ji Young Chung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...
- Publication number 20150084185
- Publication date Mar 26, 2015
- Amkor Technology, Inc.
- Jae Yun Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD
- Publication number 20150041324
- Publication date Feb 12, 2015
- Amkor Technology, Inc.
- Hyung Il Jeon
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER
- Publication number 20130109135
- Publication date May 2, 2013
- AMKOR Technology Korea, Inc.
- Choon Heung LEE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITANCE MEASURING CIRCUIT FOR TOUCH SENSOR
- Publication number 20110187389
- Publication date Aug 4, 2011
- POINTCHIPS CO., LTD.
- Sang Hyun Han
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF
- Publication number 20110031598
- Publication date Feb 10, 2011
- AMKOR Technology Korea, Inc.
- Choon Heung LEE
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device with a semiconductor die embedded between an e...

Semiconductor device and manufacturing method thereof

Semiconductor device with a semiconductor die embedded between an e...

Microfluidic sensor package structure and method

Semiconductor device

Method of fabricating a semiconductor device having an interposer

Structure of bond pad for semiconductor die and method therefor

Semiconductor device having an interposer

Increased I/O semiconductor package and method of making same

Semiconductor package with half-etched locking features

Image sensor package and its manufacturing method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE WITH A SEMICONDUCTOR DIE EMBEDDED BETWEEN AN E...

MICROFLUIDIC SENSOR PACKAGE STRUCTURE AND METHOD

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE HAVING AN INTERPOSER

CAPACITANCE MEASURING CIRCUIT FOR TOUCH SENSOR

SEMICONDUCTOR DEVICE AND FABRICATING METHOD THEREOF