Donald C. Abbott

Person

Norton, MA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and system for electroplating a MEMS device
- Patent number 11,230,783
- Issue date Jan 25, 2022
- Texas Instruments Incorporated
- Donald Charles Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method and system for electroplating a MEMS device
- Patent number 10,704,156
- Issue date Jul 7, 2020
- Texas Instruments Incorporated
- Donald Charles Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Selective planishing method for making a semiconductor device
- Patent number 10,438,816
- Issue date Oct 8, 2019
- Texas Instruments Incorporated
- Donald C. Abbott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Selective planishing method for making a semiconductor device
- Patent number 9,972,506
- Issue date May 15, 2018
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,373,572
- Issue date Jun 21, 2016
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,165,873
- Issue date Oct 20, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having etched foil capacitor integrated into...
- Patent number 9,142,496
- Issue date Sep 22, 2015
- Texas Instruments Incorporated
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper leadframe finish for copper wire bonding
- Patent number 9,059,185
- Issue date Jun 16, 2015
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective leadframe planishing
- Patent number 9,006,038
- Issue date Apr 14, 2015
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with selective planished leadframe
- Patent number 8,963,300
- Issue date Feb 24, 2015
- Texas Instruments Incorporation
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacture integrated circuit package
- Patent number 8,697,496
- Issue date Apr 15, 2014
- Texas Instruments Incorporated
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe having selective planishing
- Patent number 8,587,099
- Issue date Nov 19, 2013
- Texas Instruments Incorporated
- Donald C. Abbott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Singulation and strip testing of no-lead integrated circuit package...
- Patent number 8,574,931
- Issue date Nov 5, 2013
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal plugged substrates with no adhesive between metal and polyimide
- Patent number 8,471,155
- Issue date Jun 25, 2013
- Texas Instruments Incorporated
- Donald C Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally improved semiconductor QFN/SON package
- Patent number 8,242,614
- Issue date Aug 14, 2012
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
IC die having TSV and wafer level underfill and stacked IC devices...
- Patent number 8,227,295
- Issue date Jul 24, 2012
- Texas Instruments Incorporated
- Margaret R. Simmons-Matthews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having buss-less substrate
- Patent number 8,227,298
- Issue date Jul 24, 2012
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of forming metallic leadframes having laser-treated surfaces...
- Patent number 8,158,460
- Issue date Apr 17, 2012
- Texas Instruments Incorporated
- Donald C Abbott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost lead-free preplated leadframe having improved adhesion and...
- Patent number 8,138,026
- Issue date Mar 20, 2012
- Texas Instruments Incorporated
- Donald C. Abbott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Metallic leadframes having laser-treated surfaces for improved adhe...
- Patent number 8,044,495
- Issue date Oct 25, 2011
- Texas Instruments Incorporated
- Donald C Abbott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Aluminum leadframes for semiconductor QFN/SON devices
- Patent number 8,039,317
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for post-circuitization assembly
- Patent number 8,039,309
- Issue date Oct 18, 2011
- Texas Instruments Incorporated
- Masood Murtuza
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Palladium-spot leadframes for high adhesion semiconductor devices a...
- Patent number 7,939,378
- Issue date May 10, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Semiconductor package having buss-less substrate
- Patent number 7,928,574
- Issue date Apr 19, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 7,918,018
- Issue date Apr 5, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Low cost lead-free preplated leadframe having improved adhesion and...
- Patent number 7,872,336
- Issue date Jan 18, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Thermally improved semiconductor QFN/SON package
- Patent number 7,863,103
- Issue date Jan 4, 2011
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having substrate with differentially plated co...
- Patent number 7,851,928
- Issue date Dec 14, 2010
- Texas Instruments Incorporated
- Bernardo Gallegos
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating a leadframe
- Patent number 7,788,800
- Issue date Sep 7, 2010
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aluminum leadframes for semiconductor QFN/SON devices
- Patent number 7,608,916
- Issue date Oct 27, 2009
- Texas Instruments Incorporated
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD AND SYSTEM FOR ELECTTROPLATING A MEMS DEVICE
- Publication number 20200291539
- Publication date Sep 17, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Donald Charles Abbott
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE
- Publication number 20180204739
- Publication date Jul 19, 2018
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR ELECTROPLATING A MEMS DEVICE
- Publication number 20170175283
- Publication date Jun 22, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Donald Charles Abbott
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Mask-Less Selective Plating of Leadframe
- Publication number 20170051388
- Publication date Feb 23, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Semiconductor Package Having Etched Foil Capacitor Integrated Into...
- Publication number 20160035655
- Publication date Feb 4, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Gregory E. Howard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE
- Publication number 20150221526
- Publication date Aug 6, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Leadframe Finish for Copper Wire Bonding
- Publication number 20150014829
- Publication date Jan 15, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME WITH LEAD OF VARYING THICKNESS
- Publication number 20140367838
- Publication date Dec 18, 2014
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20140175626
- Publication date Jun 26, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System for No-Lead Integrated Circuit Packages Without Tape Frame
- Publication number 20140138805
- Publication date May 22, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURE INTEGRATED CIRCUIT PACKAGE
- Publication number 20140097527
- Publication date Apr 10, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Leadframe Planishing
- Publication number 20140048920
- Publication date Feb 20, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective Leadframe Planishing
- Publication number 20130298393
- Publication date Nov 14, 2013
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING SELECTIVE PLANISHING
- Publication number 20130292811
- Publication date Nov 7, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV
- Publication number 20130099384
- Publication date Apr 25, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Margaret R. Simmons-Matthews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package And Method
- Publication number 20130082407
- Publication date Apr 4, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mask-Less Selective Plating of Leadframes
- Publication number 20130025745
- Publication date Jan 31, 2013
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Singulation and Strip Testing of No-Lead Integrated Circuit Package...
- Publication number 20120252142
- Publication date Oct 4, 2012
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhe...
- Publication number 20120009739
- Publication date Jan 12, 2012
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package Having Buss-Less Substrate
- Publication number 20110165732
- Publication date Jul 7, 2011
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Metal Plugged Substrates with No Adhesive Between Metal and Polyimide
- Publication number 20110147934
- Publication date Jun 23, 2011
- TEXAS INSTRUMENTS INCORPORATED
- Donald C. Abbott
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Low Cost Lead-Free Preplated Leadframe Having Improved Adhesion and...
- Publication number 20110076806
- Publication date Mar 31, 2011
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally Improved Semiconductor QFN/SON Package
- Publication number 20110068443
- Publication date Mar 24, 2011
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhe...
- Publication number 20100320579
- Publication date Dec 23, 2010
- Texax Instruments Incorporated
- Donald C ABBOTT
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
IC DIE HAVING TSV AND WAFER LEVEL UNDERFILL AND STACKED IC DEVICES...
- Publication number 20100096738
- Publication date Apr 22, 2010
- TEXAS INSTRUMENTS INCORPORATED
- Margaret R. Simmons-Matthews
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY IMPROVED SEMICONDUCTOR QFN/SON PACKAGE
- Publication number 20100096734
- Publication date Apr 22, 2010
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Leadframes for Semiconductor QFN/SON Devices
- Publication number 20100009500
- Publication date Jan 14, 2010
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAMES HAVING BOTH ENHANCED-ADHESION AND SMOOTH SURFACES AND ME...
- Publication number 20090315159
- Publication date Dec 24, 2009
- Donald Charles Abbott
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SUBSTRATE WITH DIFFERENTIALLY PLATED CO...
- Publication number 20090302463
- Publication date Dec 10, 2009
- TEXAS INSTRUMENTS INCORPORATED
- BERNARDO GALLEGOS
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor Package Having Buss-Less Substrate
- Publication number 20090051036
- Publication date Feb 26, 2009
- TEXAS INSTRUMENTS INCORPORATED
- DONALD C. ABBOTT
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Donald C. Abbott

Person

Patents Grantslast 30 patents

Method and system for electroplating a MEMS device

Method and system for electroplating a MEMS device

Selective planishing method for making a semiconductor device

Selective planishing method for making a semiconductor device

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Semiconductor package having etched foil capacitor integrated into...

Copper leadframe finish for copper wire bonding

Selective leadframe planishing

Semiconductor device with selective planished leadframe

Method of manufacture integrated circuit package

Leadframe having selective planishing

Singulation and strip testing of no-lead integrated circuit package...

Metal plugged substrates with no adhesive between metal and polyimide

Thermally improved semiconductor QFN/SON package

IC die having TSV and wafer level underfill and stacked IC devices...

Semiconductor package having buss-less substrate

Method of forming metallic leadframes having laser-treated surfaces...

Low cost lead-free preplated leadframe having improved adhesion and...

Metallic leadframes having laser-treated surfaces for improved adhe...

Aluminum leadframes for semiconductor QFN/SON devices

Systems and methods for post-circuitization assembly

Palladium-spot leadframes for high adhesion semiconductor devices a...

Semiconductor package having buss-less substrate

Method of fabricating a semiconductor device

Low cost lead-free preplated leadframe having improved adhesion and...

Thermally improved semiconductor QFN/SON package

Semiconductor device having substrate with differentially plated co...

Method for fabricating a leadframe

Aluminum leadframes for semiconductor QFN/SON devices

Patents Applicationslast 30 patents

METHOD AND SYSTEM FOR ELECTTROPLATING A MEMS DEVICE

SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE

METHOD AND SYSTEM FOR ELECTROPLATING A MEMS DEVICE

Mask-Less Selective Plating of Leadframe

Semiconductor Package Having Etched Foil Capacitor Integrated Into...

SELECTIVE PLANISHING METHOD FOR MAKING A SEMICONDUCTOR DEVICE

Copper Leadframe Finish for Copper Wire Bonding

LEADFRAME WITH LEAD OF VARYING THICKNESS

INTEGRATED CIRCUIT PACKAGE AND METHOD OF MANUFACTURE

System for No-Lead Integrated Circuit Packages Without Tape Frame

METHOD OF MANUFACTURE INTEGRATED CIRCUIT PACKAGE

Selective Leadframe Planishing

Selective Leadframe Planishing

LEADFRAME HAVING SELECTIVE PLANISHING

Stacked IC Devices Comprising a Workpiece Solder Connected to the TSV

Integrated Circuit Package And Method

Mask-Less Selective Plating of Leadframes

Singulation and Strip Testing of No-Lead Integrated Circuit Package...

Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhe...

Semiconductor Package Having Buss-Less Substrate

Metal Plugged Substrates with No Adhesive Between Metal and Polyimide

Low Cost Lead-Free Preplated Leadframe Having Improved Adhesion and...

Thermally Improved Semiconductor QFN/SON Package

Metallic Leadframes Having Laser-Treated Surfaces for Improved Adhe...

IC DIE HAVING TSV AND WAFER LEVEL UNDERFILL AND STACKED IC DEVICES...

THERMALLY IMPROVED SEMICONDUCTOR QFN/SON PACKAGE

Aluminum Leadframes for Semiconductor QFN/SON Devices

LEADFRAMES HAVING BOTH ENHANCED-ADHESION AND SMOOTH SURFACES AND ME...

SEMICONDUCTOR DEVICE HAVING SUBSTRATE WITH DIFFERENTIALLY PLATED CO...

Semiconductor Package Having Buss-Less Substrate