Dongming He

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Thermal compression flip chip bump for high performance and fine pitch
- Patent number 12,113,038
- Issue date Oct 8, 2024
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package comprising spacers between integrated devices
- Patent number 11,948,909
- Issue date Apr 2, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated device comprising pillar interconnect with cavity
- Patent number 11,721,656
- Issue date Aug 8, 2023
- QUALCOMM Incorporated
- Yujen Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sidewall wetting barrier for conductive pillars
- Patent number 11,694,982
- Issue date Jul 4, 2023
- QUALCOMM Incorporated
- Wei Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip flexible under bump metallization size
- Patent number 11,557,557
- Issue date Jan 17, 2023
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) packages employing a thermal conductive pac...
- Patent number 11,437,335
- Issue date Sep 6, 2022
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip-chip device
- Patent number 11,417,622
- Issue date Aug 16, 2022
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip integrated circuit package
- Patent number 9,406,649
- Issue date Aug 2, 2016
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked multi-chip integrated circuit package
- Patent number 8,963,339
- Issue date Feb 24, 2015
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES
- Publication number 20240421128
- Publication date Dec 19, 2024
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR
- Publication number 20240413112
- Publication date Dec 12, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...
- Publication number 20240371736
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Omar James Bchir
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE
- Publication number 20240371806
- Publication date Nov 7, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE
- Publication number 20240319455
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE
- Publication number 20240321849
- Publication date Sep 26, 2024
- QUALCOMM Incorporated
- Xia LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...
- Publication number 20240096845
- Publication date Mar 21, 2024
- QUALCOMM Incorporated
- Yangyang Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...
- Publication number 20240079352
- Publication date Mar 7, 2024
- QUALCOMM Incorporated
- Jihong Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS
- Publication number 20240055383
- Publication date Feb 15, 2024
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS
- Publication number 20240006361
- Publication date Jan 4, 2024
- QUALCOMM Incorporated
- Wei WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE
- Publication number 20230384367
- Publication date Nov 30, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES
- Publication number 20230223375
- Publication date Jul 13, 2023
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES
- Publication number 20230082120
- Publication date Mar 16, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY
- Publication number 20230057439
- Publication date Feb 23, 2023
- QUALCOMM Incorporated
- Yujen CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS
- Publication number 20220270995
- Publication date Aug 25, 2022
- QUALCOMM Incorporated
- Wei HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE
- Publication number 20210407939
- Publication date Dec 30, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PAC...
- Publication number 20210242160
- Publication date Aug 5, 2021
- QUALCOMM Incorporated
- Kuiwon Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL COMPRESSION FLIP CHIP BUMP
- Publication number 20210210449
- Publication date Jul 8, 2021
- QUALCOMM Incorporated
- Dongming HE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP-CHIP DEVICE
- Publication number 20210118834
- Publication date Apr 22, 2021
- QUALCOMM Incorporated
- Yangyang SUN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...
- Publication number 20180331061
- Publication date Nov 15, 2018
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
- Publication number 20150155265
- Publication date Jun 4, 2015
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE
- Publication number 20140097535
- Publication date Apr 10, 2014
- QUALCOMM Incorporated
- Dongming He
- H01 - BASIC ELECTRIC ELEMENTS

Dongming He

Person

Patents Grantslast 30 patents

Thermal compression flip chip bump for high performance and fine pitch

Package comprising spacers between integrated devices

Integrated device comprising pillar interconnect with cavity

Sidewall wetting barrier for conductive pillars

Flip-chip flexible under bump metallization size

Integrated circuit (IC) packages employing a thermal conductive pac...

Flip-chip device

Stacked multi-chip integrated circuit package

Stacked multi-chip integrated circuit package

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH MULTIPLE STACKED PASSIVE DEVICES

INTEGRATED CIRCUIT DEVICE INCLUDING MULTI-LAYER INTERCONNECT PILLAR

SUBSTRATE EMPLOYING CORE WITH CAVITY EMBEDDING REDUCED HEIGHT ELECT...

FLIP-CHIP BUMPING METAL LAYER AND BUMP STRUCTURE

PACKAGE COMPRISING AN OPTICAL INTEGRATED DEVICE

PACKAGE COMPRISING OPTICAL INTEGRATED DEVICE

CIRCUIT PACKAGES WITH BUMP INTERCONNECT POLYMER SURROUND AND METHOD...

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING CAPACITOR INTERPOSER SUB...

BUMP COPLANARITY FOR DIE-TO-DIE AND OTHER APPLICATIONS

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE WIDTHS

BUMP STRUCTURE FOR MICRO-BUMPED WAFER PROBE

PACKAGE COMPRISING SPACERS BETWEEN INTEGRATED DEVICES

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECTS WITH VARIABLE SHAPES

INTEGRATED DEVICE COMPRISING PILLAR INTERCONNECT WITH CAVITY

SIDEWALL WETTING BARRIER FOR CONDUCTIVE PILLARS

FLIP-CHIP FLEXIBLE UNDER BUMP METALLIZATION SIZE

INTEGRATED CIRCUIT (IC) PACKAGES EMPLOYING A THERMAL CONDUCTIVE PAC...

THERMAL COMPRESSION FLIP CHIP BUMP

FLIP-CHIP DEVICE

INTEGRATED DEVICE COMPRISING BUMP ON EXPOSED REDISTRIBUTION INTERCO...

STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE

STACKED MULTI-CHIP INTEGRATED CIRCUIT PACKAGE