Various features relate to integrated devices.
A package may include a substrate and integrated devices. These components are coupled together to provide a package that may perform various electrical functions. The performance of a package and its components may depend on the quality of the joints between various components of the package. There is an ongoing need to provide packages that include secure and reliable joints between components.
Various features relate to integrated devices.
One example provides an integrated device that includes a die portion. The die portion includes a plurality of pads and a plurality of under bump metallization interconnects coupled to the plurality of pads. The integrated device includes a plurality of pillar interconnects coupled to the plurality of under bump metallization interconnects. The plurality of pillar interconnects includes a first pillar interconnect. The first pillar interconnect comprises a first pillar interconnect portion comprising a first width, and a second pillar interconnect portion comprising a second width that is different than the first width.
Another example provides a package comprising a substrate and an integrated device coupled to the substrate through a plurality of pillar interconnects and a plurality of solder interconnects. The plurality of pillar interconnects comprises a first pillar interconnect. The first pillar interconnect comprises a first pillar interconnect portion comprising a first width and a second pillar interconnect portion comprising a second width that is different than the first width.
Another example provides a method for fabricating an integrated device. The method provides a die portion. The die portion includes a plurality of pads and a plurality of under bump metallization interconnects coupled to the plurality of pads. The method forms a plurality of pillar interconnects over the plurality of under bump metallization interconnects. Forming the plurality of pillar interconnects comprises forming a first pillar interconnect portion comprising a first width, and forming a second pillar interconnect portion comprising a second width that is different than the first width.
Various features, nature and advantages may become apparent from the detailed description set forth below when taken in conjunction with the drawings in which like reference characters identify correspondingly throughout.
In the following description, specific details are given to provide a thorough understanding of the various aspects of the disclosure. However, it will be understood by one of ordinary skill in the art that the aspects may be practiced without these specific details. For example, circuits may be shown in block diagrams in order to avoid obscuring the aspects in unnecessary detail. In other instances, well-known circuits, structures and techniques may not be shown in detail in order not to obscure the aspects of the disclosure.
The present disclosure describes a package that includes a substrate and an integrated device coupled to the substrate through a plurality of pillar interconnects and a plurality of solder interconnects. The plurality of pillar interconnects comprises a first pillar interconnect. The first pillar interconnect comprises a first pillar interconnect portion comprising a first width, and a second pillar interconnect portion comprising a second width that is different than the first width. In some implementations, the first width may be greater than the second width. In some implementations, the first width may be less than the second width. The different and/or varying widths may allow more surface area for the solder interconnects to couple to, thus providing a more robust and reliable joint between the integrated device and the substrate. The increased surface area may also allow more solder interconnects to be located between the first pillar interconnect and the substrate, without causing a short between neighboring interconnects of the substrate. The more robust and reliable joint helps provide a more reliable electrical path for currents and/or signals traveling between the integrated device and the substrate, which can lead to improved performances for the integrated device and the package.
The die portion 102 includes a die substrate 120, an interconnect portion 122, a passivation layer 105, a plurality of pads 107, and a plurality of under bump metallization interconnects 109. The die substrate 120 may include silicon (Si). A plurality of cells and/or a plurality of transistors (not shown) may be formed in and/or over the die substrate 120. Different implementations may use different types of transistors, such as a field effect transistor (FET), planar FET, finFET, and a gate all around FET. In some implementations, a front end of line (FEOL) process may be used to fabricate the plurality of cells and/or transistors in and/or over the die substrate 120. The interconnect portion 122 is located over and coupled to the die substrate 120. The interconnect portion 122 may be coupled to the plurality of cells and/or transistors located in and/or over the die substrate 120. The interconnect portion 122 (e.g., die interconnect portion) may include a plurality of die interconnects (not shown) that are coupled to the plurality of cells and/or transistors. In some implementations, a back end of line (BEOL) process may be used to fabricate the interconnect portion 122.
The passivation layer 105 is located over and coupled to the interconnect portion 122. The plurality of pads 107 is located over the interconnect portion 122. The plurality of pads 107 may be coupled to die interconnects of the interconnect portion 122. In some implementations, the passivation layer 105 and/or the plurality of pads 107 may be considered part of the interconnect portion 122. In some implementations, a back end of line (BEOL) process may be used to fabricate the passivation layer 105 and the plurality of pads 107. The plurality of under bump metallization interconnects 109 is coupled to the plurality of pads 107. The plurality of under bump metallization interconnects 109 may be located over the plurality of pads 107. In some implementations, there may be additional interconnects between the plurality of pads 107 and the plurality of under bump metallization interconnects 109. For example, there may be metallization interconnects between the plurality of pads 107 and the plurality of under bump metallization interconnects 109. Examples of metallization interconnects include redistribution interconnects. In some implementations, the plurality of under bump metallization interconnects 109 may be coupled to the plurality of pads 107 through metallization interconnects (e.g., redistribution interconnects).
The plurality of pillar interconnects 104 may be coupled to the die portion 102. The plurality of pillar interconnects 104 may be coupled to the plurality of under bump metallization interconnects 109. The plurality of pillar interconnects 104 may be coupled to the die portion 102 through the plurality of under bump metallization interconnects 109. The plurality of pillar interconnects 104 may be a means for pillar interconnection. The plurality of under bump metallization interconnects 109 may be a means for under bump metallization interconnection.
The plurality of pads 107 includes a first pad 107a and a second pad 107b. The plurality of under bump metallization interconnects 109 includes a first under bump metallization interconnect 109a and a second under bump metallization interconnect 109b. The plurality of pillar interconnects 104 includes a first pillar interconnect 104a and a second pillar interconnect 104b. The plurality of solder interconnect 106 includes a first solder interconnect 106a and a second solder interconnect 106b.
The first under bump metallization interconnect 109a is coupled to the first pad 107a. The first pillar interconnect 104a is coupled to the first under bump metallization interconnect 109a. The first solder interconnect 106a is coupled to the first pillar interconnect 104a. The width of the widest part of the first pillar interconnect 104a may be greater than the width of the first under bump metallization interconnect 109a. It is noted that in some implementations, the first pillar interconnect 104a is coupled to the first under bump metallization interconnect 109a through at least one metallization interconnect. That is, at least one metallization interconnect (e.g., redistribution interconnect) may be located between the first pillar interconnect 104a and the first under bump metallization interconnect 109a.
The second under bump metallization interconnect 109b is coupled to the second pad 107b. The second pillar interconnect 104b is coupled to the second under bump metallization interconnect 109b. The second solder interconnect 106b is coupled to the second pillar interconnect 104b. The width of the widest part of the second pillar interconnect 104b may be greater than the width of the second under bump metallization interconnect 109b. It is noted that in some implementations, the second pillar interconnect 104b is coupled to the second under bump metallization interconnect 109b through at least one metallization interconnect. That is, at least one metallization interconnect (e.g., redistribution interconnect) may be located between the second pillar interconnect 104b and the second under bump metallization interconnect 109b.
Despite the solder interconnect being coupled to a portion of the pillar interconnect with a lesser width, the design of the pillar interconnect creates more space due to extra side surface of the pillar interconnect, to accommodate more solder interconnect, while reducing the likelihood of shorting with a nearby interconnect. The extra side surface area of the pillar interconnect and/or the additional volume of solder interconnect helps provide a more robust and reliable joint for the integrated device, thus providing a more robust and reliable electrical path for current(s) to and from the integrated device. The integrated device 300 may include a flip chip.
The integrated device 100 and/or the integrated device 300 may be implemented in a package.
As shown in
The second pillar interconnect 104b is coupled to the second solder interconnect 106b. The second solder interconnect 106b is coupled to a second interconnect 522b of the substrate 502. The second solder interconnect 106b may include an intermetallic compound (IMC). The intermetallic compound may be formed when metal from the second interconnect 522b and/or the second pillar interconnect 104b diffuses in the solder interconnect 106b.
As shown in
The second pillar interconnect 304b is coupled to the second solder interconnect 106b. The second solder interconnect 106b is coupled to a second interconnect 522b of the substrate 502. The second solder interconnect 106b may include an intermetallic compound (IMC). The intermetallic compound may be formed when metal from the second interconnect 522b and/or the second pillar interconnect 304b diffuses in the solder interconnect 106b.
In some implementations, an integrated device may include combinations of pillar interconnects with different shapes and/or sizes.
As shown in
The second pillar interconnect 104b is coupled to the second solder interconnect 106b. The second solder interconnect 106b is coupled to a second interconnect 522b of the substrate 502. The second solder interconnect 106b may include an intermetallic compound (IMC). The intermetallic compound may be formed when metal from the second interconnect 522b and/or the second pillar interconnect 104b diffuses in the solder interconnect 106b.
In some implementations, the plurality of pillar interconnects 104 may be configured to provide electrical paths for input/output (I/O) signals to and from the integrated device 800. The smaller width and/or diameter of the plurality of pillar interconnects 104 may allow more pillar interconnects to be provided with an integrated device, thus allowing higher density routing, more connections and/or electrical paths to and from the integrated device 800. In some implementations, the plurality of pillar interconnects 304 may be configured to provide electrical paths for currents (e.g., power) to cores of the integrated device 800. The larger size of the plurality of pillar interconnects 304 helps reduce mechanical stress on the integrated device 800 and the package 500, without having to necessarily increase the size of the under bump metallization interconnect underneath the plurality of pillar interconnects 304.
An integrated device (e.g., 100, 300, 800) may include a die (e.g., semiconductor bare die). The integrated device may include a power management integrated circuit (PMIC). The integrated device may include an application processor. The integrated device may include a modem. The integrated device may include a radio frequency (RF) device, a passive device, a filter, a capacitor, an inductor, an antenna, a transmitter, a receiver, a gallium arsenide (GaAs) based integrated device, a surface acoustic wave (SAW) filters, a bulk acoustic wave (BAW) filter, a light emitting diode (LED) integrated device, a silicon (Si) based integrated device, a silicon carbide (SiC) based integrated device, a memory, power management processor, and/or combinations thereof. An integrated device (e.g., 100) may include at least one electronic circuit (e.g., first electronic circuit, second electronic circuit, etc. . . . ). An integrated device may be an example of an electrical component and/or electrical device.
Having described an integrated device with pillar interconnects, a method for fabricating an integrated device will now be described below.
In some implementations, fabricating an integrated device includes several processes.
It should be noted that the sequence of
Stage 1, as shown in
Stage 2 illustrates a state after a first photo resist layer 900 is formed over the die portion 102 and patterned to include a plurality of openings 901 in the first photo resist layer 900. The first photo resist layer 900 may include a positive photo resist layer. However, in some implementations, the first photo resist layer 900 may include a negative photo resist layer. A photolithography process may be used to form and define the pattern of the first photo resist layer 900.
Stage 3 illustrates a state after pillar interconnect portions 902 are formed through the plurality of openings 901 of the first photo resist layer 900. The pillar interconnect portions 902 may be formed over the plurality of under bump metallization interconnects 109 (or under bump metallization layer). A plating process may be used to form the pillar interconnect portions 902.
Stage 4, as shown in
Stage 5 illustrates a state after a second photo resist layer 906 is formed over the die portion 102 and patterned. The second photo resist layer 906 may be formed around the pillar interconnect portions 902. The second photo resist layer 906 may include a negative photo resist layer. However, in some implementations, the second photo resist layer 906 may include a positive photo resist layer. For example, if the first photo resist layer 900 is a positive photo resist layer, the second photo resist layer 906 may be a negative photo resist layer. If the first photo resist layer 900 is a negative photo resist layer, the second photo resist layer 906 may be a positive photo resist layer. A photolithography process may be used to form and define the pattern of the second photo resist layer 906.
Stage 6, as shown in
Stage 7 illustrates a state after a plurality of pillar interconnect portions 912 is formed through the plurality of openings 911 of the third photo resist layer 910. The plurality of pillar interconnect portions 912 may be formed over and coupled to the plurality of pillar interconnect portions 902. The plurality of pillar interconnect portions 902 and the plurality of pillar interconnect portions 912 may form and define the plurality of pillar interconnects 104 and/or the plurality of pillar interconnects 304. A plating process may be used to form the plurality of pillar interconnect portions 912. There may or may not be one or more interfaces between the pillar interconnect portions 902 formed at stage 3 and the plurality of pillar interconnect portions 912 that are formed at stage 7.
Stage 8, as shown in
Stage 9 illustrates a state after the third photo resist layer 910 and the second photo resist layer 906 are removed from the die portion 102. The third photo resist layer 910 and/or the second photo resist layer 906 may be removed through a development process. The third photo resist layer 910 and/or the second photo resist layer 906 may be removed through a rinsing process.
Stage 9 also illustrates a state after portions of an under bump metallization layer are selectively etched to define an under bump metallization interconnect 109a and an under bump metallization interconnect 109b. Stage 9 may also illustrate a state after the plurality of solder interconnects 106 has undergone a solder reflow process to couple the plurality of pillar interconnects 104 and/or the plurality of pillar interconnects 304. Stage 9 may illustrate an integrated device 800 that includes a die portion 102, the plurality of pillar interconnects 104, the plurality of pillar interconnects 304, and a plurality of solder interconnects 106.
The plurality of pillar interconnects 304 may include the pillar interconnect 304a. The pillar interconnect 304a may include a first portion with a first width and a second portion with a second width. The first width of the first portion of the pillar interconnect 304a may be greater than the second width of the second portion of the pillar interconnect 304a. The portion of the pillar interconnect 304a that is closer to the under bump metallization interconnect has a larger width than the portion of the pillar interconnect 304a that is farthest away (e.g., vertically farthest away) from the under bump metallization interconnect.
The plurality of pillar interconnects 104 may include the pillar interconnect 104b. The pillar interconnect 104b may include a first portion with a first width and a second portion with a second width. The first width of the first portion of the pillar interconnect 104b may be less than the second width of the second portion of the pillar interconnect 104b. The portion of the pillar interconnect 104b that is closer to the under bump metallization interconnect has a smaller width than the portion of the pillar interconnect 104b that is farthest away (e.g., vertically farthest away) from the under bump metallization interconnect.
In some implementations, fabricating an integrated device includes several processes.
It should be noted that the method of
The method provides (at 1005) a die portion (e.g., 102). The die portion 102 may include a die substrate 120, an interconnect portion 122, a passivation layer 105, a plurality of pads 107 and a plurality of under bump metallization interconnects 109. The die portion 102 may include a bare die (e.g., semiconductor bare die). Stage 1 of
The method forms (at 1010) a first photo resist layer (e.g., 900) over the die portion (e.g., 102). The method may also pattern (at 1010) the first photo resist layer (e.g., 900). A photolithography process may be used to form and define the pattern of the first photo resist layer 900. The first photo resist layer 900 may include a positive photo resist layer. However, in some implementations, the first photo resist layer 900 may include a negative photo resist layer. Stage 2 of
The method forms (at 1015) pillar interconnects portions (e.g., 902). The pillar interconnect portions 902 may be formed over the plurality of under bump metallization interconnects 109 (or under bump metallization layer). A plating process may be used to form the pillar interconnect portions 902. The pillar interconnect portions 902 may be formed through a plurality of openings 901 of the first photo resist layer 900. Stage 3 of
The method removes (at 1020) the first photo resist layer (e.g., 900). The first photo resist layer 900 may be removed through a development process. The first photo resist layer 900 may be removed through a rinsing process. Stage 4 of
The method forms (at 1025) a second photo resist layer (e.g., 906) over the die portion (e.g., 102). The method may also pattern (at 1025) the second photo resist layer (e.g., 906). The second photo resist layer may be formed around the pillar interconnect portions 902. The second photo resist layer 906 may include a negative photo resist layer. However, in some implementations, the second photo resist layer 906 may include a positive photo resist layer. A photolithography process may be used to form and define the pattern of the second photo resist layer 906. Stage 5 of
The method also forms (at 1025) a third photo resist layer (e.g., 910) over the second photo resist layer (e.g., 906). The method may also pattern (at 1025) the third photo resist layer (e.g., 910). The third photo resist layer 910 may include a negative photo resist layer. However, in some implementations, the third photo resist layer 910 may include a positive photo resist layer. If the second photo resist layer 906 is a positive photo resist layer, the third photo resist layer 910 may be a negative photo resist layer. If the second photo resist layer 906 is a negative photo resist layer, the third photo resist layer 910 may be a positive photo resist layer. A photolithography process may be used to form and define the pattern of the third photo resist layer 910. Stage 6 of
The method forms (at 1030) another pillar interconnect portions 912 to form a plurality of pillar interconnects 104 and/or a plurality of pillar interconnects 304. The plurality of pillar interconnects 104 and/or the plurality of pillar interconnects 304 may be formed over the plurality of under bump metallization interconnects 109 (or under bump metallization layer). The plurality of pillar interconnect portions 912 may be formed over the pillar interconnect portions 902. A plating process may be used to form the plurality of pillar interconnect portions 912. There may or may not be one or more interfaces between the pillar interconnect portions 902 formed (at 1015) and the plurality of pillar interconnect portions 912 that are formed (at 1030). Stage 7 of
The method provides (at 1035) a plurality of solder interconnects (e.g., 106) over the plurality of pillar interconnects (e.g., 104, 304). The plurality of solder interconnects 106 may be formed over the plurality of pillar interconnects 104 and/or the plurality of pillar interconnects 304 through the plurality of openings 911 of the third photo resist layer 910. In some implementations, a paste process may be used to formed the plurality of solder interconnects 106. However, the plurality of solder interconnects 106 may be formed differently. Stage 8 of
The method removes (at 1040) the third photo resist layer (e.g., 910) and the second photo resist layer (e.g., 906). The third photo resist layer 910 and/or the second photo resist layer 906 may be removed through a development process The third photo resist layer 910 and/or the second photo resist layer 906 may be removed through a rinsing process. Stage 9 of
The method may remove (at 1045) portions of an under bump metallization layer. For example, the method may selectively etch portions of the under bump metallization layer to define an under bump metallization interconnect 109a and an under bump metallization interconnect 109b. The method may also (at 1045) perform a solder reflow process to couple the plurality of solder interconnects 106 to the plurality of pillar interconnects 104 and/or the plurality of pillar interconnects 304. Stage 9 of
The integrated devices (e.g., 100, 300, 800) described in the disclosure may be fabricated one at a time or may be fabricated together as part of one or more wafers and then singulated into individual integrated devices.
In some implementations, fabricating a package includes several processes.
It should be noted that the sequence of
Stage 1, as shown in
Stage 2 illustrates a state after the integrated device 100 is coupled to the substrate 502 through the plurality of pillar interconnects 104 and the plurality of solder interconnects 106. A solder reflow process may be used to couple the integrated device 100 to the substrate 502.
Stage 3 illustrates a state after an encapsulation layer 508 is provided (e.g., formed) over the substrate 502. The encapsulation layer 508 may encapsulate the integrated device 100. The encapsulation layer 508 may include a mold, a resin and/or an epoxy. A compression molding process, a transfer molding process, or a liquid molding process may be used to form the encapsulation layer 508. The encapsulation layer 508 may be photo etchable. The encapsulation layer 508 may be a means for encapsulation.
Stage 4 illustrates a state after a plurality of solder interconnects 530 is coupled to the substrate 502. A solder reflow process may be used to couple the plurality of solder interconnects 530 to the substrate 502.
In some implementations, fabricating a package includes several processes.
It should be noted that the method of
The method provides (at 1205) a substrate (e.g., 502). The substrate 502 may be provided by a supplier or fabricated. Different implementations may use different processes to fabricate the substrate 502. Examples of processes that may be used to fabricate the substrate 502 include a semi-additive process (SAP) and a modified semi-additive process (mSAP). The substrate 502 includes at least one dielectric layer 520, a plurality of interconnects 522, and a solder resist layer 526. The substrate 502 may include an embedded trace substrate (ETS). In some implementations, the at least one dielectric layer 520 may include prepreg layers. Stage 1 of
The method couples (at 1210) an integrated device (e.g., 100, 300, 800) a first surface of the substrate 502. For example, the integrated device 100 is coupled to a first surface (e.g., top surface) of the substrate 502. The integrated device 100 is coupled to the substrate 502 through the plurality of pillar interconnects 104 and the plurality of solder interconnects 106. A solder reflow process may be used to couple the integrated device 100 to the substrate 502. In some implementations, an integrated device may be coupled to the substrate 502 through the plurality of pillar interconnects 104, the plurality of pillar interconnects 304 and/or the plurality of solder interconnects 106.
The method forms (at 1215) an encapsulation layer (e.g., 508) over the substrate (e.g., 502). The encapsulation layer 508 may be provided and formed over and/or around the substrate 502 and the integrated device 100. The encapsulation layer 508 may include a mold, a resin and/or an epoxy. A compression molding process, a transfer molding process, or a liquid molding process may be used to form the encapsulation layer 508. The encapsulation layer 508 may be photo etchable. The encapsulation layer 508 may be a means for encapsulation. Stage 3 of
The method couples (at 1220) a plurality of solder interconnects (e.g., 530) to the substrate 502. A solder reflow process may be used to couple the plurality of solder interconnects 530 to the substrate 502. Stage 4 of
The packages (e.g., 500) described in the disclosure may be fabricated one at a time or may be fabricated together as part of one or more wafers and then singulated into individual packages.
One or more of the components, processes, features, and/or functions illustrated in
It is noted that the figures in the disclosure may represent actual representations and/or conceptual representations of various parts, components, objects, devices, packages, integrated devices, integrated circuits, and/or transistors. In some instances, the figures may not be to scale. In some instances, for purpose of clarity, not all components and/or parts may be shown. In some instances, the position, the location, the sizes, and/or the shapes of various parts and/or components in the figures may be exemplary. In some implementations, various components and/or parts in the figures may be optional.
The word “exemplary” is used herein to mean “serving as an example, instance, or illustration.” Any implementation or aspect described herein as “exemplary” is not necessarily to be construed as preferred or advantageous over other aspects of the disclosure. Likewise, the term “aspects” does not require that all aspects of the disclosure include the discussed feature, advantage or mode of operation. The term “coupled” is used herein to refer to the direct or indirect coupling (e.g., mechanical coupling) between two objects. For example, if object A physically touches object B, and object B touches object C, then objects A and C may still be considered coupled to one another—even if they do not directly physically touch each other. An object A, that is coupled to an object B, may be coupled to at least part of object B. The term “electrically coupled” may mean that two objects are directly or indirectly coupled together such that an electrical current (e.g., signal, power, ground) may travel between the two objects. Two objects that are electrically coupled may or may not have an electrical current traveling between the two objects. The use of the terms “first”, “second”, “third” and “fourth” (and/or anything above fourth) is arbitrary. Any of the components described may be the first component, the second component, the third component or the fourth component. For example, a component that is referred to a second component, may be the first component, the second component, the third component or the fourth component. The terms “encapsulate”, “encapsulating” and/or any derivation means that the object may partially encapsulate or completely encapsulate another object. The terms “top” and “bottom” are arbitrary. A component that is located on top may be located over a component that is located on a bottom. A top component may be considered a bottom component, and vice versa. As described in the disclosure, a first component that is located “over” a second component may mean that the first component is located above or below the second component, depending on how a bottom or top is arbitrarily defined. In another example, a first component may be located over (e.g., above) a first surface of the second component, and a third component may be located over (e.g., below) a second surface of the second component, where the second surface is opposite to the first surface. It is further noted that the term “over” as used in the present application in the context of one component located over another component, may be used to mean a component that is on another component and/or in another component (e.g., on a surface of a component or embedded in a component). Thus, for example, a first component that is over the second component may mean that (1) the first component is over the second component, but not directly touching the second component, (2) the first component is on (e.g., on a surface of) the second component, and/or (3) the first component is in (e.g., embedded in) the second component. A first component that is located “in” a second component may be partially located in the second component or completely located in the second component. A value that is about X-XX, may mean a value that is between X and XX, inclusive of X and XX. The value(s) between X and XX may be discrete or continuous. The term “about ‘value X’”, or “approximately value X”, as used in the disclosure means within 10 percent of the ‘value X’. For example, a value of about 1 or approximately 1, would mean a value in a range of 0.9-1.1.
In some implementations, an interconnect is an element or component of a device or package that allows or facilitates an electrical connection between two points, elements and/or components. In some implementations, an interconnect may include a trace, a via, a pad, a pillar, a metallization layer, a redistribution layer, and/or an under bump metallization (UBM) layer/interconnect. In some implementations, an interconnect may include an electrically conductive material that may be configured to provide an electrical path for a signal (e.g., a data signal), ground and/or power. An interconnect may include more than one element or component. An interconnect may be defined by one or more interconnects. An interconnect may include one or more metal layers. An interconnect may be part of a circuit. Different implementations may use different processes and/or sequences for forming the interconnects. In some implementations, a chemical vapor deposition (CVD) process, a physical vapor deposition (PVD) process, a sputtering process, a spray coating, and/or a plating process may be used to form the interconnects.
Also, it is noted that various disclosures contained herein may be described as a process that is depicted as a flowchart, a flow diagram, a structure diagram, or a block diagram. Although a flowchart may describe the operations as a sequential process, many of the operations can be performed in parallel or concurrently. In addition, the order of the operations may be re-arranged. A process is terminated when its operations are completed.
In the following, further examples are described to facilitate the understanding of the invention.
Aspect 1: An integrated device comprising a die portion. The die portion includes a plurality of pads and a plurality of under bump metallization interconnects coupled to the plurality of pads. The integrated device includes a plurality of pillar interconnects coupled to the plurality of under bump metallization interconnects. The plurality of pillar interconnects includes a first pillar interconnect. The first pillar interconnect includes a first pillar interconnect portion comprising a first width and a second pillar interconnect portion comprising a second width that is different than the first width.
Aspect 2: The integrated device of aspect 1, wherein the first width is greater than the second width.
Aspect 3: The integrated device of aspects 1 through 2, wherein the first pillar interconnect is configured to provide an electrical path for input/output (I/O) signals to and/or from the integrated device.
Aspect 4: The integrated device of aspects 1 through 3, wherein the first pillar interconnect portion is coupled to a first under bump metallization interconnect from the plurality of under bump metallization interconnects.
Aspect 5: The integrated device of aspect 1, wherein the first width is less than the second width.
Aspect 6: The integrated device of aspects 1 and 5, wherein the first pillar interconnect is configured to provide an electrical path for power to the integrated device.
Aspect 7: The integrated device of aspects 1 and 5 through 6, wherein the first pillar interconnect comprises a cross-sectional side profile having a T shape.
Aspect 8: The integrated device of aspects 1 and 5 through 7, wherein the plurality of pillar interconnects includes a second pillar interconnect. The second pillar interconnect includes a third pillar interconnect portion comprising a third width and a fourth pillar interconnect portion comprising a fourth width that is less than the third width.
Aspect 9: The integrated device of aspect 8, wherein the first pillar interconnect is configured to provide an electrical path for input/output (I/O) signals to and/or from the integrated device, and wherein the second pillar interconnect is configured to provide an electrical path for power to the integrated device.
Aspect 10: The integrated device of aspects 1 through 9, wherein the die portion comprises a die substrate, a plurality of transistors formed in and/or over the die substrate, and an interconnect portion located over the die substrate.
Aspect 11: A package comprising a substrate and an integrated device coupled to the substrate through a plurality of pillar interconnects and a plurality of solder interconnects. The plurality of pillar interconnects includes a first pillar interconnect. The first pillar interconnect includes a first pillar interconnect portion comprising a first width and a second pillar interconnect portion comprising a second width that is different than the first width.
Aspect 12: The package of aspect 11, wherein the first width is greater than the second width.
Aspect 13: The package of aspects 11 through 12, wherein the first pillar interconnect is configured to provide an electrical path for input/output (I/O) signals to and/or from the integrated device.
Aspect 14: The package of aspects 11 through 13, wherein the integrated device comprises a first under bump metallization interconnect, and wherein the first pillar interconnect portion is coupled to a first under bump metallization interconnect.
Aspect 15: The package of aspect 11, wherein the first width is less than the second width.
Aspect 16: The package of aspects 11 and 15, wherein the first pillar interconnect is configured to provide an electrical path for power to the integrated device.
Aspect 17: The package of aspects 11 and 15 through 16, wherein the first pillar interconnect comprises a cross-sectional side profile having a T shape.
Aspect 18: The package of aspects 11 and 15 through 17, wherein the plurality of pillar interconnects includes a second pillar interconnect. The second pillar interconnect includes a third pillar interconnect portion comprising a third width and a fourth pillar interconnect portion comprising a fourth width that is less than the third width.
Aspect 19: The package of aspect 18, wherein the first pillar interconnect is configured to provide an electrical path for input/output (I/O) signals to and/or from the integrated device, and wherein the second pillar interconnect is configured to provide an electrical path for power to the integrated device.
Aspect 20: The package of aspects 11 through 19, wherein the package is part of a device selected from a group consisting of a music player, a video player, an entertainment unit, a navigation device, a communications device, a mobile device, a mobile phone, a smartphone, a personal digital assistant, a fixed location terminal, a tablet computer, a computer, a wearable device, a laptop computer, a server, an internet of things (IoT) device, and a device in an automotive vehicle.
Aspect 21: A method for fabricating an integrated device. The method provides a die portion comprising a plurality of pads and a plurality of under bump metallization interconnects coupled to the plurality of pads. The method forms a plurality of pillar interconnects over the plurality of under bump metallization interconnects. Forming the plurality of pillar interconnects comprises forming a first pillar interconnect. Forming the first pillar interconnect comprises forming a first pillar interconnect portion comprising a first width, and forming a second pillar interconnect portion comprising a second width that is different than the first width.
Aspect 22: The method of aspect 21, wherein forming the plurality of pillar interconnects comprises forming and patterning a first photo resist layer over the die portion; forming a first pillar interconnect portion, removing the first photo resist layer; forming a second photo resist layer over the die portion, forming and patterning a third photo resist layer over the second photo resist layer, and forming a second pillar interconnect portion over the first pillar interconnect portion through an opening in the third photo resist layer.
Aspect 23: The method of aspect 22, wherein the third photo resist layer includes a positive photo resist layer or a negative photo resist layer.
Aspect 24: The method of aspect 23, wherein the second photo resist layer includes a positive photo resist layer or a negative photo resist layer.
Aspect 25: The method of aspect 22, wherein if the second photo resist layer includes a positive photo resist layer, the third photo resist layer includes a negative photo resist layer.
Aspect 26: The method of aspect 22, wherein if the second photo resist layer includes a negative photo resist layer, the third photo resist layer includes a positive photo resist layer.
The various features of the disclosure described herein can be implemented in different systems without departing from the disclosure. It should be noted that the foregoing aspects of the disclosure are merely examples and are not to be construed as limiting the disclosure. The description of the aspects of the present disclosure is intended to be illustrative, and not to limit the scope of the claims. As such, the present teachings can be readily applied to other types of apparatuses and many alternatives, modifications, and variations will be apparent to those skilled in the art.