Edmund J. Sprogis

Person

Myrtle Beach, SC, US

People

Patents Grantslast 30 patents

Information Patent Grant
Probe for localized neural optogenetics stimulation and neurochemis...
- Patent number 10,722,729
- Issue date Jul 28, 2020
- International Business Machines Corporation
- Hariklia Deligianni
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Grant
On-chip DC-DC power converters with fully integrated GaN power swit...
- Patent number 10,396,665
- Issue date Aug 27, 2019
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wafer handler and methods of manufacture
- Patent number 10,049,909
- Issue date Aug 14, 2018
- GLOBALFOUNDRIES Inc.
- John J. Garant
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated DC-DC power converters through face-to-face bonding
- Patent number 10,032,750
- Issue date Jul 24, 2018
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
3D integrated DC-DC power converters
- Patent number 9,819,269
- Issue date Nov 14, 2017
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
On-chip DC-DC power converters with fully integrated GaN power swit...
- Patent number 9,806,615
- Issue date Oct 31, 2017
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
3D integrated DC-DC power converters
- Patent number 9,654,004
- Issue date May 16, 2017
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wafer handler and methods of manufacture
- Patent number 9,613,842
- Issue date Apr 4, 2017
- GLOBALFOUNDRIES Inc.
- John J. Garant
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit and design structure having reduced through sili...
- Patent number 9,406,562
- Issue date Aug 2, 2016
- GLOBALFOUNDRIES, INC.
- Jeffrey P. Bonn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Deep trench decoupling capacitor and methods of forming
- Patent number 9,385,179
- Issue date Jul 5, 2016
- GLOBALFOUNDRIES Inc.
- James S. Nakos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices having tensile and/or compressive stress and...
- Patent number 9,368,410
- Issue date Jun 14, 2016
- GLOBALFOUNDRIES Inc.
- Brent A. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS structure on replacement substrate
- Patent number 9,331,141
- Issue date May 3, 2016
- GLOBALFOUNDRIES Inc.
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked through-silicon via (TSV) transformer structure
- Patent number 9,111,933
- Issue date Aug 18, 2015
- International Business Machines Corporation
- Gary D. Carpenter
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Coil inductor for on-chip or on-chip stack
- Patent number 9,105,627
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Michael J. Shapiro
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Releasable buried layer for 3-D fabrication and methods of manufact...
- Patent number 9,040,390
- Issue date May 26, 2015
- International Business Machines Corporation
- Timothy H. Daubenspeck
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of making heat sink for integrated circuit devices
- Patent number 8,881,379
- Issue date Nov 11, 2014
- International Business Machines Corporation
- Douglas D. Coolbaugh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Processor voltage regulation
- Patent number 8,812,879
- Issue date Aug 19, 2014
- International Business Machines Corporation
- Huajun Wen
- G05 - CONTROLLING REGULATING
Information Patent Grant
Integrated decoupling capacitor employing conductive through-substr...
- Patent number 8,785,289
- Issue date Jul 22, 2014
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 8,778,737
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via and method of fabricating same
- Patent number 8,735,251
- Issue date May 27, 2014
- Ultratech, Inc.
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through silicon via for use in integrated circuit chips
- Patent number 8,637,937
- Issue date Jan 28, 2014
- Ultratech, Inc.
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through wafer vias with dishing correction methods
- Patent number 8,631,570
- Issue date Jan 21, 2014
- International Business Machines Corporation
- Peter J. Lindgren
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Electrostatic chucking of an insulator handle substrate
- Patent number 8,564,113
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated decoupling capacitor employing conductive through-substr...
- Patent number 8,558,345
- Issue date Oct 15, 2013
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench decoupling capacitor
- Patent number 8,492,816
- Issue date Jul 23, 2013
- International Business Machines Corporation
- James S. Nakos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
CMOS structure and method of manufacture
- Patent number 8,440,544
- Issue date May 14, 2013
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for wet singulation using a dicing singulation structure
- Patent number 8,298,917
- Issue date Oct 30, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wiring structures for uniform current density in C4 balls
- Patent number 8,264,078
- Issue date Sep 11, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-yield method of exposing and contacting through-silicon vias
- Patent number 8,263,497
- Issue date Sep 11, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PROBE FOR LOCALIZED NEURAL OPTOGENETICS STIMULATION AND NEUROCHEMIS...
- Publication number 20180193663
- Publication date Jul 12, 2018
- International Business Machines Corporation
- Hariklia Deligianni
- A61 - MEDICAL OR VETERINARY SCIENCE HYGIENE
Information Patent Application
On-Chip DC-DC Power Converters with Fully Integrated GaN Power Swit...
- Publication number 20180034369
- Publication date Feb 1, 2018
- International Business Machines Corporation
- Hariklia Deligianni
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Integrated DC-DC Power Converters Through Face-to-Face Bonding
- Publication number 20180005988
- Publication date Jan 4, 2018
- International Business Machines Corporation
- Hariklia Deligianni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER HANDLER AND METHODS OF MANUFACTURE
- Publication number 20170154800
- Publication date Jun 1, 2017
- GLOBALFOUNDRIES INC.
- John J. Garant
- B32 - LAYERED PRODUCTS
Information Patent Application
EDGE TRIM PROCESSES AND RESULTANT STRUCTURES
- Publication number 20160343564
- Publication date Nov 24, 2016
- International Business Machines Corporation
- Richard F. INDYK
- B32 - LAYERED PRODUCTS
Information Patent Application
WAFER HANDLER AND METHODS OF MANUFACTURE
- Publication number 20150235891
- Publication date Aug 20, 2015
- International Business Machines Corporation
- John J. Garant
- B32 - LAYERED PRODUCTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA AND METHOD OF FABRICATING SAME
- Publication number 20140094007
- Publication date Apr 3, 2014
- Ultratech, Inc.
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...
- Publication number 20130344675
- Publication date Dec 26, 2013
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACT...
- Publication number 20130320521
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Timothy H. DAUBENSPECK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked Through-Silicon Via (TSV) Transformer Structure
- Publication number 20130307656
- Publication date Nov 21, 2013
- International Business Machines Corporation
- Gary D. Carpenter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20130221479
- Publication date Aug 29, 2013
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH DECOUPLING CAPACITOR AND METHODS OF FORMING
- Publication number 20130147015
- Publication date Jun 13, 2013
- International Business Machines Corporation
- James S. Nakos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COIL INDUCTOR FOR ON-CHIP OR ON-CHIP STACK
- Publication number 20130113448
- Publication date May 9, 2013
- International Business Machines Corporation
- MICHAEL J. SHAPIRO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20130105981
- Publication date May 2, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT SINK FOR INTEGRATED CIRCUIT DEVICES
- Publication number 20120214280
- Publication date Aug 23, 2012
- International Business Machines Corporation
- Douglas D. COOLBAUGH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE
- Publication number 20120193790
- Publication date Aug 2, 2012
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILI...
- Publication number 20120181700
- Publication date Jul 19, 2012
- International Business Machines Corporation
- Jeffrey P. Bonn
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS
- Publication number 20120137515
- Publication date Jun 7, 2012
- International Business Machines Corporation
- Peter J. Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA AND METHOD OF FABRICATING SAME
- Publication number 20120132967
- Publication date May 31, 2012
- International Business Machines Corporation
- Paul Stephen Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD
- Publication number 20120091585
- Publication date Apr 19, 2012
- International Business Machines Corporation
- Leena P. Buchwalter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS STRUCTURE AND METHOD OF MANUFACTURE
- Publication number 20120086100
- Publication date Apr 12, 2012
- International Business Machines Corporation
- Paul S. ANDRY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS
- Publication number 20120080797
- Publication date Apr 5, 2012
- International Business Machines Corporation
- Timothy H. Daubenspeck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER STRUCTURE WITH BURIED OXIDE/NITRID...
- Publication number 20110180896
- Publication date Jul 28, 2011
- International Business Machines Corporation
- Gerd Pfeiffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SILICON VIA LITHOGRAPHIC ALIGNMENT AND REGISTRATION
- Publication number 20110177670
- Publication date Jul 21, 2011
- International Business Machines Corporaton
- Russell T. Herrin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Photomasks having sub-lithographic features to prevent undesired wa...
- Publication number 20110177435
- Publication date Jul 21, 2011
- International Business Machines Corporation
- Russell T. Herrin
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
DEEP TRENCH DECOUPLING CAPACITOR
- Publication number 20110169131
- Publication date Jul 14, 2011
- International Business Machines Corporation
- James S. Nakos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROCESSOR VOLTAGE REGULATION
- Publication number 20110161682
- Publication date Jun 30, 2011
- International Business Machines Corporation
- Huajun Wen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER
- Publication number 20110129996
- Publication date Jun 2, 2011
- International Business Machines Corporation
- Peter James Lindgren
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...
- Publication number 20110108948
- Publication date May 12, 2011
- International Business Machines Corporation
- Tae Hong Kim
- H01 - BASIC ELECTRIC ELEMENTS

Edmund J. Sprogis

Person

Patents Grantslast 30 patents

Probe for localized neural optogenetics stimulation and neurochemis...

On-chip DC-DC power converters with fully integrated GaN power swit...

Wafer handler and methods of manufacture

Integrated DC-DC power converters through face-to-face bonding

3D integrated DC-DC power converters

On-chip DC-DC power converters with fully integrated GaN power swit...

3D integrated DC-DC power converters

Wafer handler and methods of manufacture

Integrated circuit and design structure having reduced through sili...

Deep trench decoupling capacitor and methods of forming

Semiconductor devices having tensile and/or compressive stress and...

Flattened substrate surface for substrate bonding

CMOS structure on replacement substrate

Stacked through-silicon via (TSV) transformer structure

Coil inductor for on-chip or on-chip stack

Releasable buried layer for 3-D fabrication and methods of manufact...

Method of making heat sink for integrated circuit devices

Processor voltage regulation

Integrated decoupling capacitor employing conductive through-substr...

Flattened substrate surface for substrate bonding

Through silicon via and method of fabricating same

Through silicon via for use in integrated circuit chips

Through wafer vias with dishing correction methods

Electrostatic chucking of an insulator handle substrate

Integrated decoupling capacitor employing conductive through-substr...

Deep trench decoupling capacitor

CMOS structure and method of manufacture

Process for wet singulation using a dicing singulation structure

Metal wiring structures for uniform current density in C4 balls

High-yield method of exposing and contacting through-silicon vias

Patents Applicationslast 30 patents

PROBE FOR LOCALIZED NEURAL OPTOGENETICS STIMULATION AND NEUROCHEMIS...

On-Chip DC-DC Power Converters with Fully Integrated GaN Power Swit...

Integrated DC-DC Power Converters Through Face-to-Face Bonding

WAFER HANDLER AND METHODS OF MANUFACTURE

EDGE TRIM PROCESSES AND RESULTANT STRUCTURES

WAFER HANDLER AND METHODS OF MANUFACTURE

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

THROUGH SILICON VIA AND METHOD OF FABRICATING SAME

INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...

RELEASABLE BURIED LAYER FOR 3-D FABRICATION AND METHODS OF MANUFACT...

Stacked Through-Silicon Via (TSV) Transformer Structure

CMOS STRUCTURE AND METHOD OF MANUFACTURE

DEEP TRENCH DECOUPLING CAPACITOR AND METHODS OF FORMING

COIL INDUCTOR FOR ON-CHIP OR ON-CHIP STACK

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

HEAT SINK FOR INTEGRATED CIRCUIT DEVICES

ELECTROSTATIC CHUCKING OF AN INSULATOR HANDLE SUBSTRATE

INTEGRATED CIRCUIT AND DESIGN STRUCTURE HAVING REDUCED THROUGH SILI...

THROUGH WAFER VIAS WITH DISHING CORRECTION METHODS

THROUGH SILICON VIA AND METHOD OF FABRICATING SAME

LASER RELEASE PROCESS FOR VERY THIN SI-CARRIER BUILD

CMOS STRUCTURE AND METHOD OF MANUFACTURE

METAL WIRING STRUCTURES FOR UNIFORM CURRENT DENSITY IN C4 BALLS

METHOD OF PRODUCING BONDED WAFER STRUCTURE WITH BURIED OXIDE/NITRID...

THROUGH SILICON VIA LITHOGRAPHIC ALIGNMENT AND REGISTRATION

Photomasks having sub-lithographic features to prevent undesired wa...

DEEP TRENCH DECOUPLING CAPACITOR

PROCESSOR VOLTAGE REGULATION

THROUGH SUBSTRATE ANNULAR VIA INCLUDING PLUG FILLER

INTEGRATED DECOUPLING CAPACITOR EMPLOYING CONDUCTIVE THROUGH-SUBSTR...