Edward C. Cooney III

Person

Jericho, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Integrated circuit including wire structure, related method and des...
- Patent number 10,224,276
- Issue date Mar 5, 2019
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming BEOL metal levels with multiple dielectric layer...
- Patent number 10,163,697
- Issue date Dec 25, 2018
- GLOBALFOUNDRIES Inc.
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with anti-reverse engineering function
- Patent number 10,141,274
- Issue date Nov 27, 2018
- International Business Machines Corporation
- Edward C. Cooney
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Test structure for monitoring interface delamination
- Patent number 10,056,306
- Issue date Aug 21, 2018
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with anti-reverse engineering function
- Patent number 9,893,023
- Issue date Feb 13, 2018
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit including wire structure, related method and des...
- Patent number 9,831,122
- Issue date Nov 28, 2017
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laser scribe structures for a wafer
- Patent number 9,728,509
- Issue date Aug 8, 2017
- GLOBALFOUNDRIES Inc.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip with anti-reverse engineering function
- Patent number 9,711,464
- Issue date Jul 18, 2017
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure for BEOL metal levels with multiple dielectric layers for...
- Patent number 9,673,091
- Issue date Jun 6, 2017
- GLOBALFOUNDRIES Inc.
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal wires of a stacked inductor
- Patent number 9,577,023
- Issue date Feb 21, 2017
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 9,355,936
- Issue date May 31, 2016
- GLOBALFOUNDRIES Inc.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of managing metal density in dicing channel and related int...
- Patent number 9,196,592
- Issue date Nov 24, 2015
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of manufacturing semiconductor devices and a semiconductor...
- Patent number 8,969,195
- Issue date Mar 3, 2015
- International Business Machines Corporation
- Felix P. Anderson
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Imager microlens structure having interfacial region for adhesion o...
- Patent number 8,878,326
- Issue date Nov 4, 2014
- International Business Machines Corporation
- Edward C. Cooney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Integrated circuit including sensor structure, related method and d...
- Patent number 8,822,993
- Issue date Sep 2, 2014
- International Business Machines Corporation
- Edward C. Cooney
- G01 - MEASURING TESTING
Information Patent Grant
Thick on-chip high-performance wiring structures
- Patent number 8,803,284
- Issue date Aug 12, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical integrated circuit switches, design structure and methods...
- Patent number 8,791,778
- Issue date Jul 29, 2014
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flattened substrate surface for substrate bonding
- Patent number 8,778,737
- Issue date Jul 15, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thick on-chip high-performance wiring structures
- Patent number 8,765,595
- Issue date Jul 1, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via including variable sidewall profile
- Patent number 8,643,190
- Issue date Feb 4, 2014
- Ultratech, Inc.
- Edward Crandal Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure and method for reducing vertical crack propagation
- Patent number 8,604,618
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical integrated circuit switches, design structure and methods...
- Patent number 8,604,898
- Issue date Dec 10, 2013
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Top corner rounding of damascene wire for insulator crack suppression
- Patent number 8,575,022
- Issue date Nov 5, 2013
- International Business Machines Corporation
- Gregory S. Chrisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrostatic chucking of an insulator handle substrate
- Patent number 8,564,113
- Issue date Oct 22, 2013
- International Business Machines Corporation
- Paul S. Andry
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improved adhesion of protective layers of imager microl...
- Patent number 8,476,099
- Issue date Jul 2, 2013
- International Business Machines Corporation
- Edward C. Cooney
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Metal oxide temperature monitor
- Patent number 6,759,260
- Issue date Jul 6, 2004
- International Business Machines Corporation
- Arne W. Ballantine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single and multilevel rework
- Patent number 6,674,168
- Issue date Jan 6, 2004
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal oxide temperature monitor
- Patent number 6,580,140
- Issue date Jun 17, 2003
- International Business Machines Corporation
- Arne W. Ballantine
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process to create robust contacts and interconnects
- Patent number 6,534,394
- Issue date Mar 18, 2003
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin tantalum nitride copper interconnect barrier
- Patent number 6,429,524
- Issue date Aug 6, 2002
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
- Publication number 20180053734
- Publication date Feb 22, 2018
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE, RELATED METHOD AND DES...
- Publication number 20180040556
- Publication date Feb 8, 2018
- GLOBALFOUNDRIES INC.
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LASER SCRIBE STRUCTURES FOR A WAFER
- Publication number 20170323855
- Publication date Nov 9, 2017
- GLOBALFOUNDRIES INC.
- Anthony K. Stamper
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
- Publication number 20170263574
- Publication date Sep 14, 2017
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TEST STRUCUTRE FOR MONITORING INTERFACE DELAMINATION
- Publication number 20170229358
- Publication date Aug 10, 2017
- GLOBALFOUNDRIES INC.
- Edward C. Cooney
- G01 - MEASURING TESTING
Information Patent Application
STRUCTURE FOR BEOL METAL LEVELS WITH MULTIPLE DIELECTRIC LAYERS FOR...
- Publication number 20170207121
- Publication date Jul 20, 2017
- GLOBALFOUNDRIES INC.
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION
- Publication number 20170084552
- Publication date Mar 23, 2017
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL LEVEL FORMATION METHOD AND AN INTEGRATED CIRCUIT STRUCTURE HA...
- Publication number 20160379878
- Publication date Dec 29, 2016
- International Business Machines Corporation
- Felix P. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANAGING METAL DENSITY IN DICING CHANNEL AND RELATED INT...
- Publication number 20150200167
- Publication date Jul 16, 2015
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...
- Publication number 20150130064
- Publication date May 14, 2015
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE AND RELATED METHOD
- Publication number 20150056799
- Publication date Feb 26, 2015
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL WIRES OF A STACKED INDUCTOR
- Publication number 20140354392
- Publication date Dec 4, 2014
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20140209908
- Publication date Jul 31, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thick On-Chip High-Performance Wiring Structures
- Publication number 20140167219
- Publication date Jun 19, 2014
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION
- Publication number 20140035169
- Publication date Feb 6, 2014
- International Business Machines Corporation
- Gregory S. Chrisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING SENSOR STRUCTURE, RELATED METHOD AND D...
- Publication number 20140021469
- Publication date Jan 23, 2014
- International Business Machines Corporation
- Edward C. Cooney
- G01 - MEASURING TESTING
Information Patent Application
Vertical Integrated Circuit Switches, Design Structure and Methods...
- Publication number 20140014480
- Publication date Jan 16, 2014
- International Business Machines Corporation
- Felix P. ANDERSON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE, RELATED METHOD AND DES...
- Publication number 20130320536
- Publication date Dec 5, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURES AND DESIGN STRUCTURES FOR IMPROVED ADHESION OF PROTECTIV...
- Publication number 20130187249
- Publication date Jul 25, 2013
- International Business Machines Corporation
- Edward C. COONEY
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Thick On-Chip High-Performance Wiring Structures
- Publication number 20130175073
- Publication date Jul 11, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION
- Publication number 20130171817
- Publication date Jul 4, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION
- Publication number 20130133919
- Publication date May 30, 2013
- International Business Machines Corporation
- Gregory S. Chrisman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING
- Publication number 20130105981
- Publication date May 2, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION
- Publication number 20130075913
- Publication date Mar 28, 2013
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080254630
- Publication date Oct 16, 2008
- International Business Machines Corporation
- Daniel C. EDELSTEIN
- B82 - NANO-TECHNOLOGY
Information Patent Application
SACRIFICIAL METAL SPACER DUAL DAMASCENE
- Publication number 20080203579
- Publication date Aug 28, 2008
- International Business Machines Corporation
- Edward C. Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BY-PRODUCT COLLECTING PROCESSES FOR CLEANING PROCESSES
- Publication number 20080093212
- Publication date Apr 24, 2008
- Edward Crandal Cooney
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080038915
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...
- Publication number 20080038923
- Publication date Feb 14, 2008
- International Business Machines Corporation
- Daniel C. Edelstein
- B82 - NANO-TECHNOLOGY
Information Patent Application
DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS F...
- Publication number 20080026566
- Publication date Jan 31, 2008
- International Business Machines Corporation
- Jeffrey Gambino
- H01 - BASIC ELECTRIC ELEMENTS

Edward C. Cooney III

Person

Patents Grantslast 30 patents

Integrated circuit including wire structure, related method and des...

Method for forming BEOL metal levels with multiple dielectric layer...

Semiconductor chip with anti-reverse engineering function

Test structure for monitoring interface delamination

Semiconductor chip with anti-reverse engineering function

Integrated circuit including wire structure, related method and des...

Laser scribe structures for a wafer

Semiconductor chip with anti-reverse engineering function

Structure for BEOL metal levels with multiple dielectric layers for...

Metal wires of a stacked inductor

Flattened substrate surface for substrate bonding

Methods of managing metal density in dicing channel and related int...

Methods of manufacturing semiconductor devices and a semiconductor...

Imager microlens structure having interfacial region for adhesion o...

Integrated circuit including sensor structure, related method and d...

Thick on-chip high-performance wiring structures

Vertical integrated circuit switches, design structure and methods...

Flattened substrate surface for substrate bonding

Thick on-chip high-performance wiring structures

Through substrate via including variable sidewall profile

Structure and method for reducing vertical crack propagation

Vertical integrated circuit switches, design structure and methods...

Top corner rounding of damascene wire for insulator crack suppression

Electrostatic chucking of an insulator handle substrate

Methods for improved adhesion of protective layers of imager microl...

Metal oxide temperature monitor

Single and multilevel rework

Metal oxide temperature monitor

Process to create robust contacts and interconnects

Ultra-thin tantalum nitride copper interconnect barrier

Patents Applicationslast 30 patents

SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION

INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE, RELATED METHOD AND DES...

LASER SCRIBE STRUCTURES FOR A WAFER

SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION

TEST STRUCUTRE FOR MONITORING INTERFACE DELAMINATION

STRUCTURE FOR BEOL METAL LEVELS WITH MULTIPLE DIELECTRIC LAYERS FOR...

SEMICONDUCTOR CHIP WITH ANTI-REVERSE ENGINEERING FUNCTION

METAL LEVEL FORMATION METHOD AND AN INTEGRATED CIRCUIT STRUCTURE HA...

METHODS OF MANAGING METAL DENSITY IN DICING CHANNEL AND RELATED INT...

METHODS OF MANUFACTURING SEMICONDUCTOR DEVICES AND A SEMICONDUCTOR...

INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE AND RELATED METHOD

METAL WIRES OF A STACKED INDUCTOR

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

Thick On-Chip High-Performance Wiring Structures

TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION

INTEGRATED CIRCUIT INCLUDING SENSOR STRUCTURE, RELATED METHOD AND D...

Vertical Integrated Circuit Switches, Design Structure and Methods...

INTEGRATED CIRCUIT INCLUDING WIRE STRUCTURE, RELATED METHOD AND DES...

STRUCTURES AND DESIGN STRUCTURES FOR IMPROVED ADHESION OF PROTECTIV...

Thick On-Chip High-Performance Wiring Structures

STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION

TOP CORNER ROUNDING OF DAMASCENE WIRE FOR INSULATOR CRACK SUPPRESSION

FLATTENED SUBSTRATE SURFACE FOR SUBSTRATE BONDING

STRUCTURE AND METHOD FOR REDUCING VERTICAL CRACK PROPAGATION

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

SACRIFICIAL METAL SPACER DUAL DAMASCENE

BY-PRODUCT COLLECTING PROCESSES FOR CLEANING PROCESSES

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

DEVICE AND METHODOLOGY FOR REDUCING EFFECTIVE DIELECTRIC CONSTANT I...

DUAL DAMASCENE INTERCONNECT STRUCTURES HAVING DIFFERENT MATERIALS F...