Edward Law

Person

Tracy, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 11,049,829
- Issue date Jun 29, 2021
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,615,110
- Issue date Apr 7, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Redistribution metal and under bump metal interconnect structures a...
- Patent number 10,504,862
- Issue date Dec 10, 2019
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded substrate core spiral inductor
- Patent number 10,128,037
- Issue date Nov 13, 2018
- Avago Technologies International Sales Pte. Limited
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thin recon interposer package without TSV for fine input/output pit...
- Patent number 10,008,439
- Issue date Jun 26, 2018
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic-core three-dimensional (3D) inductors and packaging integr...
- Patent number 9,693,461
- Issue date Jun 27, 2017
- Avago Technologies General IP (Singapore) Pte. Ltd.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal enhanced package using embedded substrate
- Patent number 9,564,391
- Issue date Feb 7, 2017
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor border protection sealant
- Patent number 9,390,993
- Issue date Jul 12, 2016
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level package resistance monitor scheme
- Patent number 8,957,694
- Issue date Feb 17, 2015
- Broadcom Corporation
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a wafer level semiconductor package having a pre-formed...
- Patent number 8,945,991
- Issue date Feb 3, 2015
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer level semiconductor package
- Patent number 8,922,014
- Issue date Dec 30, 2014
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatuses for integrated circuit substrate manufacture
- Patent number 8,779,598
- Issue date Jul 15, 2014
- Broadcom Corporation
- Fan Yeung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically enhanced ball grid array package
- Patent number 8,686,558
- Issue date Apr 1, 2014
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a wafer level semiconductor package having a...
- Patent number 8,592,259
- Issue date Nov 26, 2013
- Broadcom Corporation
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip and multi-substrate reconstitution based packaging
- Patent number 8,587,123
- Issue date Nov 19, 2013
- Broadcom Corporation
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip scale package assembly in reconstitution panel process format
- Patent number 8,367,475
- Issue date Feb 5, 2013
- Broadcom Corporation
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile ball grid array (BGA) package with exposed die and meth...
- Patent number 8,169,067
- Issue date May 1, 2012
- Broadcom Corporation
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bumping free flip chip process
- Patent number 8,088,647
- Issue date Jan 3, 2012
- Broadcom Corporation
- Kunzhong (Kevin) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package having one or more stiffeners
- Patent number 8,039,949
- Issue date Oct 18, 2011
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array package with patterned stiffener surface and method...
- Patent number 7,629,681
- Issue date Dec 8, 2009
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally and electrically enhanced ball grid array packaging
- Patent number 6,882,042
- Issue date Apr 19, 2005
- Broadcom Corporation
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20200105698
- Publication date Apr 2, 2020
- Avago Technologies International Sales Pte. Limited
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...
- Publication number 20190123007
- Publication date Apr 25, 2019
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...
- Publication number 20180308791
- Publication date Oct 25, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20180233440
- Publication date Aug 16, 2018
- Avago Technologies General IP (Singapore) PTE. LTD.
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...
- Publication number 20170011993
- Publication date Jan 12, 2017
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Substrate Core Spiral Inductor
- Publication number 20160300661
- Publication date Oct 13, 2016
- BROADCOM CORPORATION
- Namhoon Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR BORDER PROTECTION SEALANT
- Publication number 20160049348
- Publication date Feb 18, 2016
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE
- Publication number 20150340308
- Publication date Nov 26, 2015
- BROADCOM CORPORATION
- Edward LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RECONSTITUTION TECHNIQUES FOR SEMICONDUCTOR PACKAGES
- Publication number 20150303172
- Publication date Oct 22, 2015
- BROADCOM CORPORATION
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...
- Publication number 20150302974
- Publication date Oct 22, 2015
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY AND ELECTRICALLY ENHANCED BALL GRID ARRAY PACKAGE
- Publication number 20140210083
- Publication date Jul 31, 2014
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20140084462
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...
- Publication number 20140087553
- Publication date Mar 27, 2014
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PACKAGE RESISTANCE MONITOR SCHEME
- Publication number 20130314120
- Publication date Nov 28, 2013
- BROADCOM CORPORATION
- Kunzhong Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer Level Semiconductor Package
- Publication number 20130134596
- Publication date May 30, 2013
- BROADCOM CORPORATION
- Kevin (Kunzhong) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Chip and Multi-Substrate Reconstitution Based Packaging
- Publication number 20130075917
- Publication date Mar 28, 2013
- BROADCOM CORPORATION
- Edward LAW
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatuses for Integrated Circuit Substrate Manufacture
- Publication number 20130001791
- Publication date Jan 3, 2013
- BROADCOM CORPORATION
- Fan YEUNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...
- Publication number 20120299187
- Publication date Nov 29, 2012
- BROADCOM CORPORATION
- Kent Charles OERTLE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION
- Publication number 20120241951
- Publication date Sep 27, 2012
- BROADCOM CORPORATION
- Kunzhong (Kevin) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP SCALE PACKAGE ASSEMBLY IN RECONSTITUTION PANEL PROCESS FORMAT
- Publication number 20120241955
- Publication date Sep 27, 2012
- BROADCOM CORPORATION
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE
- Publication number 20120187545
- Publication date Jul 26, 2012
- BROADCOM CORPORATION
- Rezaur Rahman Khan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermal Enhanced Package Using Embedded Substrate
- Publication number 20120175773
- Publication date Jul 12, 2012
- BROADCOM CORPORATION
- Kevin (Kunzhong) HU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally and Electrically Enhanced Ball Grid Array Package
- Publication number 20110318885
- Publication date Dec 29, 2011
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION
- Publication number 20110115074
- Publication date May 19, 2011
- BROADCOM CORPORATION
- Kunzhong (Kevin) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMPING FREE FLIP CHIP PROCESS
- Publication number 20110115075
- Publication date May 19, 2011
- BROADCOM CORPORATION
- Kunzhong (Kevin) Hu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball Grid Array Package Having One or More Stiffeners
- Publication number 20100052151
- Publication date Mar 4, 2010
- BROADCOM CORPORATION
- Sam Ziqun ZHAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEPOPULATING INTEGRATED CIRCUIT PACKAGE BALL LOCATIONS TO ENABLE IM...
- Publication number 20090194872
- Publication date Aug 6, 2009
- BROADCOM CORPORATION
- Ken Jian Ming Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low profile ball grid array (BGA) package with exposed die and meth...
- Publication number 20080096312
- Publication date Apr 24, 2008
- BROADCOM CORPORATION
- Edward Law
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit package having exposed thermally conducting body
- Publication number 20070273023
- Publication date Nov 29, 2007
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Ball grid array package with patterned stiffener surface and method...
- Publication number 20050077545
- Publication date Apr 14, 2005
- BROADCOM CORPORATION
- Sam Ziqun Zhao
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Redistribution metal and under bump metal interconnect structures a...

Thin recon interposer package without TSV for fine input/output pit...

Redistribution metal and under bump metal interconnect structures a...

Embedded substrate core spiral inductor

Thin recon interposer package without TSV for fine input/output pit...

Magnetic-core three-dimensional (3D) inductors and packaging integr...

Thermal enhanced package using embedded substrate

Semiconductor border protection sealant

Wafer level package resistance monitor scheme

Fabricating a wafer level semiconductor package having a pre-formed...

Wafer level semiconductor package

Method and apparatuses for integrated circuit substrate manufacture

Thermally and electrically enhanced ball grid array package

Method of fabricating a wafer level semiconductor package having a...

Multi-chip and multi-substrate reconstitution based packaging

Chip scale package assembly in reconstitution panel process format

Low profile ball grid array (BGA) package with exposed die and meth...

Bumping free flip chip process

Ball grid array package having one or more stiffeners

Ball grid array package with patterned stiffener surface and method...

Thermally and electrically enhanced ball grid array packaging

Patents Applicationslast 30 patents

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

REDISTRIBUTION METAL AND UNDER BUMP METAL INTERCONNECT STRUCTURES A...

THIN RECON INTERPOSER PACKAGE WITHOUT TSV FOR FINE INPUT/OUTPUT PIT...

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

Thin Recon Interposer Package Without TSV for Fine Input/Output Pit...

Embedded Substrate Core Spiral Inductor

SEMICONDUCTOR BORDER PROTECTION SEALANT

RECONSTITUTED INTERPOSER SEMICONDUCTOR PACKAGE

RECONSTITUTION TECHNIQUES FOR SEMICONDUCTOR PACKAGES

MAGNETIC-CORE THREE-DIMENSIONAL (3D) INDUCTORS AND PACKAGING INTEGR...

THERMALLY AND ELECTRICALLY ENHANCED BALL GRID ARRAY PACKAGE

Wafer Level Semiconductor Package

Fabricating a Wafer Level Semiconductor Package Having a Pre-formed...

WAFER LEVEL PACKAGE RESISTANCE MONITOR SCHEME

Wafer Level Semiconductor Package

Multi-Chip and Multi-Substrate Reconstitution Based Packaging

Method and Apparatuses for Integrated Circuit Substrate Manufacture

Aluminum Bond Pad With Trench Thinning for Fine Pitch Ultra-Thick A...

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

CHIP SCALE PACKAGE ASSEMBLY IN RECONSTITUTION PANEL PROCESS FORMAT

DIRECT THROUGH VIA WAFER LEVEL FANOUT PACKAGE

Thermal Enhanced Package Using Embedded Substrate

Thermally and Electrically Enhanced Ball Grid Array Package

WAFER BUMPING USING PRINTED UNDER BUMP METALIZATION

BUMPING FREE FLIP CHIP PROCESS

Ball Grid Array Package Having One or More Stiffeners

DEPOPULATING INTEGRATED CIRCUIT PACKAGE BALL LOCATIONS TO ENABLE IM...

Low profile ball grid array (BGA) package with exposed die and meth...

Integrated circuit package having exposed thermally conducting body

Ball grid array package with patterned stiffener surface and method...