Eiichi Asano

Person

Gunma-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 8,048,969
- Issue date Nov 1, 2011
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 7,943,706
- Issue date May 17, 2011
- Shin-Etsu Chemical Co., Ltd.
- Yasuo Kimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 7,432,603
- Issue date Oct 7, 2008
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 7,095,125
- Issue date Aug 22, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,894,091
- Issue date May 17, 2005
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Flip-chip type semiconductor device
- Patent number 6,794,058
- Issue date Sep 21, 2004
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,723,452
- Issue date Apr 20, 2004
- Shin-Etsu Chemical Co., Ltd.
- Yasuo Kimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,630,745
- Issue date Oct 7, 2003
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Light-transmissive epoxy resin composition and semiconductor device
- Patent number 6,627,328
- Issue date Sep 30, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Patent number 6,518,332
- Issue date Feb 11, 2003
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,297,306
- Issue date Oct 2, 2001
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,291,556
- Issue date Sep 18, 2001
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,274,251
- Issue date Aug 14, 2001
- Hokko Chemical Industry Co., Ltd.
- Kenji Ohashi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Inorganic filler, epoxy resin composition, and semiconductor device
- Patent number 6,207,296
- Issue date Mar 27, 2001
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Higuchi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,177,489
- Issue date Jan 23, 2001
- Shin-Etsu Chemical Co., Ltd.
- Satoshi Okuse
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,168,872
- Issue date Jan 2, 2001
- Hokko Chemical Industry Co., Ltd.
- Kenji Ohashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Patent number 6,162,878
- Issue date Dec 19, 2000
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Encapsulant of crystalline epoxy resin and phenolic resin-crystalli...
- Patent number 6,027,812
- Issue date Feb 22, 2000
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition
- Patent number 6,001,901
- Issue date Dec 14, 1999
- Shin-Etsu Chemical Co., Ltd.
- Toshio Shiobara
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Epoxy resin composition and semiconductor device encapsulated there...
- Patent number 5,940,688
- Issue date Aug 17, 1999
- Shin-Etsu Chemical Co., Ltd.
- Noriaki Higuchi
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Inorganic filler, epoxy resin composition, and semiconductor device
- Patent number 5,935,314
- Issue date Aug 10, 1999
- Mitsubishi Denki Kabushiki Kaisha
- Noriaki Higuchi
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Semiconductor encapsulating epoxy resin compositions and semiconduc...
- Patent number 5,739,187
- Issue date Apr 14, 1998
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
High transparency silica-titania glass beads, method for making, an...
- Patent number 5,175,199
- Issue date Dec 29, 1992
- Shin-Etsu Chemical Company Limited
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20070207322
- Publication date Sep 6, 2007
- Shin-Etsu Chemical Co., Ltd.
- Yasuo Kimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20070106036
- Publication date May 10, 2007
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20060241250
- Publication date Oct 26, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20060241215
- Publication date Oct 26, 2006
- Shin-Etsu Chemical Co., Ltd.
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20060216519
- Publication date Sep 28, 2006
- Shin-Etsu Chemical Co., Ltd.
- Yasuo Kimura
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20050267236
- Publication date Dec 1, 2005
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20040034161
- Publication date Feb 19, 2004
- SHIN-ETSU CHEMICAL CO. LTD
- Shoichi Osada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Flip-chip type semiconductor device
- Publication number 20030144382
- Publication date Jul 31, 2003
- Shin-Etsu Chemical Co., Ltd.
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20030050399
- Publication date Mar 13, 2003
- Yasuo Kimura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor encapsulating epoxy resin compositions, and semicondu...
- Publication number 20020102429
- Publication date Aug 1, 2002
- Shin-Etsu Chemical Co., Ltd.
- Eiichi Asano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Light-transmissive epoxy resin composition and flip-chip type semic...
- Publication number 20020058742
- Publication date May 16, 2002
- Tsuyoshi Honda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Light-transmissive epoxy resin composition and semiconductor device
- Publication number 20020058145
- Publication date May 16, 2002
- Tatsuya Kanamaru
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Semiconductor encapsulating epoxy resin composition and semiconduct...
- Publication number 20020016398
- Publication date Feb 7, 2002
- Shoichi Osada
- H01 - BASIC ELECTRIC ELEMENTS

Eiichi Asano

Person

Patents Grantslast 30 patents

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Flip-chip type semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Light-transmissive epoxy resin composition and semiconductor device

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Inorganic filler, epoxy resin composition, and semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Encapsulant of crystalline epoxy resin and phenolic resin-crystalli...

Epoxy resin composition

Epoxy resin composition and semiconductor device encapsulated there...

Inorganic filler, epoxy resin composition, and semiconductor device

Semiconductor encapsulating epoxy resin compositions and semiconduc...

High transparency silica-titania glass beads, method for making, an...

Patents Applicationslast 30 patents

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin composition and semiconduct...

Flip-chip type semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconduct...

Semiconductor encapsulating epoxy resin compositions, and semicondu...

Light-transmissive epoxy resin composition and flip-chip type semic...

Light-transmissive epoxy resin composition and semiconductor device

Semiconductor encapsulating epoxy resin composition and semiconduct...